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    • 51. 发明授权
    • Semiconductor laser device
    • 半导体激光器件
    • US4730329A
    • 1988-03-08
    • US869596
    • 1986-06-02
    • Toshihiko YoshidaHaruhisa TakiguchiShinji KaneiwaSadayoshi Matsui
    • Toshihiko YoshidaHaruhisa TakiguchiShinji KaneiwaSadayoshi Matsui
    • H01S5/00H01S5/062H01S5/22H01S5/223H01S5/227H01S5/24H01S3/18
    • H01S5/227H01S5/0035H01S5/06213H01S5/2206H01S5/2237H01S5/2275H01S5/24
    • A semiconductor laser includes a mesa-striped laser structure. A substrate has layered on it an active layer with a refractive index higher than that of, and with an energy gap smaller than that of the substrate. A first electrode is formed under the substrate. A cladding layer of a conductivity type different than that of the substrate overlays the active layer. A multilayered burying crystal includes, at the sides of the mesa-striped laser structure, successively first, second and third burying layers. The first and third burying layers are of the same conductivity type as the substrate. The second burying layer is of a conductivity type different from that of the substrate. A cap layer of a conductivity type different than the substrate covers the upper face of the mesa-striped structure and an upper face of the third burying layer. A second electrode is formed on the cap layer. Injected current flowing into a thyristor composed of the cap layer and the three burying layers can be suppressed.
    • 半导体激光器包括台面条纹激光器结构。 衬底上层叠有折射率高于衬底的能隙的能隙的活性层。 第一电极形成在衬底下方。 不同于衬底的导电类型的覆层覆盖有源层。 多层埋入晶体在台面条纹激光器结构的两侧包括连续的第一,第二和第三掩埋层。 第一和第三掩埋层具有与衬底相同的导电类型。 第二掩埋层的导电类型与衬底的导电类型不同。 不同于衬底的导电类型的覆盖层覆盖台面状结构的上表面和第三掩埋层的上表面。 在盖层上形成第二电极。 可以抑制流入由盖层和三层埋层构成的晶闸管的注入电流。
    • 55. 发明授权
    • Method and apparatus for fabricating semiconductor
    • 用于制造半导体的方法和装置
    • US06206969B1
    • 2001-03-27
    • US08853863
    • 1997-05-09
    • Kosei TakahashiSadayoshi Matsui
    • Kosei TakahashiSadayoshi Matsui
    • C23C1600
    • C30B23/02C23C14/564C23C14/566
    • A semiconductor fabrication apparatus for evaporating a material in a growth chamber by a molecular beam epitaxy technique to fabricate a semiconductor is provided. The apparatus includes: an ultra-high vacuum chamber including a liquid nitrogen cold trap therein, the ultra-high vacuum chamber being connected to the growth chamber via a valve; a first evacuation system including an ultra-high vacuum evacuation system, the first evacuation system being connected to the ultra-high vacuum chamber; and a second evacuation system including an evacuation system capable of conducting an evacuation operation even in a low vacuum condition, the second evacuation system being connected to the liquid nitrogen cold trap. The first evacuation system and the second evacuation system independently conduct the respective evacuation operations.
    • 提供了一种用于通过分子束外延技术蒸发生长室中的材料以制造半导体的半导体制造装置。 该装置包括:超高真空室,其中包含液氮冷阱,超高真空室经由阀连接到生长室; 包括超高真空排气系统的第一抽空系统,所述第一抽空系统连接到所述超高真空室; 以及第二排气系统,其包括即使在低真空条件下能够进行排气操作的排气系统,所述第二抽空系统连接到所述液氮冷阱。 第一疏散系统和第二疏散系统独立进行各自的撤离操作。