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51. 发明申请

US20100060298A1 CAPACITIVE ELECTROMAGNETIC FLOWMETER 有权
标题翻译：电容式电磁流量计
公开(公告)号：US20100060298A1
公开(公告)日：2010-03-11
申请号：US12447510
申请日：2007-08-03
申请人： Yutaka Harada , Keiji Kanehara , Yoshio Yamazaki
发明人： Yutaka Harada , Keiji Kanehara , Yoshio Yamazaki
IPC分类号： G01R27/26 , G01R33/12
CPC分类号： G01F1/584 , G01F1/582
摘要： The surface of a signal electrode is treated as substrate treatment. For example, an oxide film on the surface of the signal electrode is removed for roughing, and the roughened surface is used as a surface treated face. A coating of a fluororesin is provided on the surface treated face for lining or thermal welding to the lining material. A signal electrode is provided in the resin lining. Since the oxide film has been removed from the surface of the signal electrode for roughening, the adhesive force of the coating of the fluororesin is increased. The fluororesin coating and the resin lining melt each other, and, as a result, the fluororesin coating is strongly bonded to the resin lining, whereby the adhesion between the signal electrode and the resin lining can be increased without opening a hole in the signal electrode. A method may also be adopted in which a primer film is formed by substrate treatment on the surface of the signal electrode.
摘要翻译：将信号电极的表面作为衬底处理。例如，除去信号电极表面的氧化膜进行粗加工，将粗糙面用作表面处理面。在表面处理面上设置氟树脂的涂层，用于对衬里材料进行衬里或热焊接。信号电极设置在树脂衬里中。由于氧化膜已经从信号电极的表面去除以粗化，所以氟树脂的涂层的粘附力增加。氟树脂涂层和树脂衬里彼此熔融，结果，氟树脂涂层牢固地结合到树脂衬里，由此可以增加信号电极和树脂衬里之间的粘附，而不会在信号电极中打开孔。还可以采用在信号电极的表面上通过基板处理形成底漆膜的方法。

52. 发明授权

US07582944B2 Optical apparatus and optical module using the same 有权
标题翻译：光学装置和使用其的光学模块
公开(公告)号：US07582944B2
公开(公告)日：2009-09-01
申请号：US11698100
申请日：2007-01-26
申请人： Toshiyuki Fukuda , Yoshiki Takayama , Masanori Minamio , Tetsushi Nishio , Yutaka Harada
发明人： Toshiyuki Fukuda , Yoshiki Takayama , Masanori Minamio , Tetsushi Nishio , Yutaka Harada
IPC分类号： H01L31/0232
CPC分类号： H01L31/0203 , H01L27/14618 , H01L27/14625 , H01L31/0232 , H01L33/483 , H01L33/58 , H01L33/62 , H01L2224/05026 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/16 , H01L2224/73204 , H01L2924/00014
摘要： An optical apparatus includes an optical device (LED device or semiconductor imaging device) having a photoreceptor/light-emitting region, a peripheral circuit region and an electrode region, a transparent member having a larger light passing through region than the optical device and including, on one surface thereof, protruding electrodes for connection to the optical device, external connection electrodes for connection to a mounting substrate, conductive interconnects for connecting the protruding electrodes and the external connection electrodes, and a transparent adhesive provided between the optical device and the transparent member. In the optical apparatus, one surface of the optical device in which the photoreceptor/light-emitting region is formed and one surface of the transparent member are arrange so as to face to each other and electrodes of the optical device and the protruding electrodes of the transparent member are electrically connected and also adhered by the transparent adhesive.
摘要翻译：光学设备包括具有感光体/发光区域，外围电路区域和电极区域的光学器件（LED器件或半导体成像器件），具有比光学器件更大的光通过区域的透明部件，在其一个表面上具有用于连接到光学装置的突出电极，用于连接到安装基板的外部连接电极，用于连接突出电极的导电互连和外部连接电极，以及设置在光学装置和透明构件之间的透明粘合剂。在光学装置中，形成感光体/发光区域的光学装置的一个表面和透明构件的一个表面相互配置，并且光学装置的电极和透明构件电连接并且还通过透明粘合剂粘合。

53. 发明申请

US20090171016A1 Carbodiimide Compound and Waterborne Curable Resin Composition Containing Thereof 有权
标题翻译：碳二亚胺化合物及含有水性固化树脂组合物
公开(公告)号：US20090171016A1
公开(公告)日：2009-07-02
申请号：US12085360
申请日：2006-11-17
申请人： Koichi Sato , Yutaka Harada , Takehito Sasaoka
发明人： Koichi Sato , Yutaka Harada , Takehito Sasaoka
IPC分类号： C08L77/00 , C07C267/00 , C08L75/00
CPC分类号： C08K5/29
摘要： It is the purpose of the present invention to provide a carbodiimide compound exhibiting superior water resistance and having good storage stability when it is applied to a waterborne coating composition, and a waterborne curable resin composition comprising thereof, and the carbodiimide compound of the present invention is represented by the following general formula (1): wherein X represents a bifunctional organic group containing at least one carbodiimide group, Y represents a structure in which a hydroxyl group is eliminated from a polyalkylene glycol monoalkyl ether, R0 represents hydrogen or an alkyl group having 2 or less carbon atoms, R1 represents an alkylene group having 4 or less carbon atoms, n represents 0 or 1 and m represents an integer of 11 or more, and wherein the repeating number of oxyalkylene group in the polyalkylene glycol monoalkyl ether is 6 to 40.
摘要翻译：本发明的目的是提供一种在应用于水性涂料组合物时具有优异的耐水性和良好的储存稳定性的碳二亚胺化合物及其包含的水性固化性树脂组合物，本发明的碳二亚胺化合物为由以下通式（1）表示：其中X表示含有至少一个碳二亚胺基团的双官能有机基团，Y表示从聚亚烷基二醇单烷基醚中除去羟基的结构，R 0表示氢或具有 2个以下的碳原子，R1表示碳原子数4以下的亚烷基，n表示0或1，m表示11以上的整数，聚亚烷基二醇单烷基醚中的氧化烯基的重复数为6〜 40。

54. 发明申请

US20070206455A1 Optical device and method for manufacturing the same 审中-公开
标题翻译：光学装置及其制造方法
公开(公告)号：US20070206455A1
公开(公告)日：2007-09-06
申请号：US11708472
申请日：2007-02-21
申请人： Masanori Minamio , Yutaka Harada , Kiyokazu Itoi , Toshiyuki Fukuda
发明人： Masanori Minamio , Yutaka Harada , Kiyokazu Itoi , Toshiyuki Fukuda
IPC分类号： G11B7/00
CPC分类号： H01L27/14618 , H01L24/97 , H01L27/14683 , H01L2224/48091 , H01L2224/49171 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , Y10T29/49117 , H01L2224/85 , H01L2924/00014
摘要： An optical device includes a substrate, an optical element, a translucent component, a plurality of first terminals and a sealant. The sealant is located lower than the top surface of the translucent component. The top surface of the translucent component is exposed out of the sealant, while the side surface of the translucent component is covered with the sealant.
摘要翻译：光学装置包括基板，光学元件，半透明部件，多个第一端子和密封剂。密封剂位于比半透明组件的顶表面更低的位置。半透明部件的顶面从密封剂露出，而半透明部件的侧表面被密封剂覆盖。

55. 发明申请

US20070200944A1 Manufacturing method for a solid-state imaging apparatus, and the solid-state imaging apparatus 审中-公开
标题翻译：固体摄像装置的制造方法以及固体摄像装置
公开(公告)号：US20070200944A1
公开(公告)日：2007-08-30
申请号：US11588419
申请日：2006-10-27
申请人： Yasuo Takeuchi , Tomoko Komatsu , Nobukazu Teranishi , Tomoki Masuda , Yutaka Harada , Mituru Harada , Takashi Ohbayashi
发明人： Yasuo Takeuchi , Tomoko Komatsu , Nobukazu Teranishi , Tomoki Masuda , Yutaka Harada , Mituru Harada , Takashi Ohbayashi
IPC分类号： H04N3/14 , H04N5/335 , H04N9/64 , H04N5/217
CPC分类号： H01L27/14618 , H01L27/14621 , H01L27/14627 , H01L27/14636 , H01L27/14683 , H01L27/14843 , H01L2224/05554 , H01L2224/32225 , H01L2224/48091 , H01L2224/49175 , H01L2224/73265 , H01L2224/83385 , H01L2924/01019 , H01L2924/16235 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A light receiving region 21 and a floating diffusion region 22 are formed apart from each other in a semiconductor substrate 20 (S11), translucent adhesive 31 is applied to an area corresponding to the light receiving region 21 on the semiconductor substrate 20 (S22), and a translucent plate 30 is attached to the semiconductor substrate 20 on which the translucent adhesive 31 has been applied (S23). In this semiconductor manufacturing process, before the translucent adhesive 31 is applied, a dam member 24 is formed on the semiconductor substrate 20 so as to prevent the translucent adhesive 31 from flowing into an area corresponding to the floating diffusion region 22 on the semiconductor substrate 20 (S18).
摘要翻译：在半导体衬底20中，将光接收区域21和浮动扩散区域22彼此分开地形成（S11），半导体衬底20上的与光接收区域21相对应的区域施加半透明粘合剂31（S22）），并且半透明板30附接到其上施加有半透明粘合剂31的半导体衬底20（S23）。在该半导体制造工序中，在施加半透明粘接剂31之前，在半导体基板20上形成有阻挡构件24，以防止半透明粘合剂31流入与半导体基板20上的浮动扩散区域22相对应的区域（S18）。

56. 发明申请

US20070126914A1 Solid state imaging device 审中-公开
标题翻译：固态成像装置
公开(公告)号：US20070126914A1
公开(公告)日：2007-06-07
申请号：US11585891
申请日：2006-10-25
申请人： Tomoko Komatsu , Tomoki Masuda , Yasuo Takeuchi , Nobukazu Teranishi , Yutaka Harada , Kiyokazu Itoi , Akiyoshi Kohno
发明人： Tomoko Komatsu , Tomoki Masuda , Yasuo Takeuchi , Nobukazu Teranishi , Yutaka Harada , Kiyokazu Itoi , Akiyoshi Kohno
IPC分类号： H04N5/225
CPC分类号： H01L27/14618 , H01L27/14627 , H01L2224/48091 , H01L2924/00014
摘要： A solid state imaging element including light receiving elements and microlenses is placed in a recess of a ceramic package. A black resin fills space between the ceramic package and the solid state imaging element.
摘要翻译：包括光接收元件和微透镜的固态成像元件放置在陶瓷封装的凹部中。黑色树脂填充陶瓷封装和固态成像元件之间的空间。

57. 发明申请

US20050006749A1 Semiconductor device and method for manufacturing the same 审中-公开
标题翻译：半导体装置及其制造方法
公开(公告)号：US20050006749A1
公开(公告)日：2005-01-13
申请号：US10916445
申请日：2004-08-12
申请人： Nozomi Shimoishizaka , Ryuichi Sahara , Yoshifumi Nakamura , Takahiro Kumakawa , Shinji Murakami , Yutaka Harada
发明人： Nozomi Shimoishizaka , Ryuichi Sahara , Yoshifumi Nakamura , Takahiro Kumakawa , Shinji Murakami , Yutaka Harada
IPC分类号： H01L23/12 , H01L23/31 , H01L23/485 , H01L21/4763 , H01L23/02 , H01L23/48 , H01L29/40
CPC分类号： H01L23/3114 , H01L23/3171 , H01L24/10 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05024 , H01L2224/05571 , H01L2224/13 , H01L2224/13099 , H01L2224/1403 , H01L2224/16 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/351 , H01L2924/00 , H01L2224/05541 , H01L2224/05005
摘要： A low elasticity layer (20) having an opening in an electrode arranging area where element electrodes are disposed is provided on a main surface of a semiconductor substrate (10). On the low elasticity layer (20), lands (32) serving as external electrodes are disposed, and pads (30) on the element electrodes, the lands (32) and metal wires (31) for connecting them are integrally formed as a metal wiring pattern (33). A solder resist film (50) having an opening for exposing a part of each land (32) is formed, and a metal ball (40) is provided on the land (32) in the opening. The low elasticity layer (20) absorbs thermal stress and the like caused in heating or cooling the semiconductor device, so as to prevent disconnection of the metal wires (31).
摘要翻译：在半导体衬底（10）的主表面上设置有在电极配置区域中设置有元件电极的开口的低弹性层（20）。在低弹性层（20）上设置用作外部电极的焊盘（32），并且元件电极上的焊盘（30），用于连接的焊盘（32）和金属丝（31）一体地形成为金属接线图案（33）。形成具有用于暴露每个焊盘（32）的一部分的开口的阻焊膜（50），并且金属球（40）设置在开口中的焊盘（32）上。低弹性层（20）吸收在加热或冷却半导体器件时引起的热应力等，以防止金属线（31）的断开。

58. 发明授权

US06812573B2 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US06812573B2
公开(公告)日：2004-11-02
申请号：US09886971
申请日：2001-06-25
申请人： Nozomi Shimoishizaka , Ryuichi Sahara , Yoshifumi Nakamura , Takahiro Kumakawa , Shinji Murakami , Yutaka Harada
发明人： Nozomi Shimoishizaka , Ryuichi Sahara , Yoshifumi Nakamura , Takahiro Kumakawa , Shinji Murakami , Yutaka Harada
IPC分类号： H01L2348
CPC分类号： H01L23/3114 , H01L23/3171 , H01L24/10 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05024 , H01L2224/05571 , H01L2224/13 , H01L2224/13099 , H01L2224/1403 , H01L2224/16 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/351 , H01L2924/00 , H01L2224/05541 , H01L2224/05005
摘要： A low elasticity layer (20) having an opening in an electrode arranging area where element electrodes are disposed is provided on a main surface of a semiconductor substrate (10). On the low elasticity layer (20), lands (32) serving as external electrodes are disposed, and pads (30) on the element electrodes, the lands (32) and metal wires (31) for connecting them are integrally formed as a metal wiring pattern (33). A solder resist film (50) having an opening for exposing a part of each land (32) is formed, and a metal ball (40) is provided on the land (32) in the opening. The low elasticity layer (20) absorbs thermal stress and the like caused in heating or cooling the semiconductor device, so as to prevent disconnection of the metal wires (31).
摘要翻译：在半导体衬底（10）的主表面上设置有在电极配置区域中设置有元件电极的开口的低弹性层（20）。在低弹性层（20）上设置用作外部电极的焊盘（32），并且元件电极上的焊盘（30），用于连接的焊盘（32）和金属丝（31）一体地形成为金属布线图案（33）。形成具有用于暴露每个焊盘（32）的一部分的开口的阻焊膜（50），并且金属球（40）设置在开口中的焊盘（32）上。低弹性层（20）吸收在加热或冷却半导体器件时引起的热应力等，以防止金属线（31）的断开。

59. 发明授权

US06313532B1 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US06313532B1
公开(公告)日：2001-11-06
申请号：US09381381
申请日：1999-09-20
申请人： Nozomi Shimoishizaka , Ryuichi Sahara , Yoshifumi Nakamura , Takahiro Kumakawa , Shinji Murakami , Yutaka Harada
发明人： Nozomi Shimoishizaka , Ryuichi Sahara , Yoshifumi Nakamura , Takahiro Kumakawa , Shinji Murakami , Yutaka Harada
IPC分类号： H01L2348
CPC分类号： H01L23/3114 , H01L23/3171 , H01L24/10 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05024 , H01L2224/05571 , H01L2224/13 , H01L2224/13099 , H01L2224/1403 , H01L2224/16 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/351 , H01L2924/00 , H01L2224/05541 , H01L2224/05005
摘要： A low elasticity layer (20) having an opening in an electrode arranging area where element electrodes are disposed is provided on a main surface of a semiconductor substrate (10). On the low elasticity layer (20), lands (32) serving as external electrodes are disposed, and pads (30) on the element electrodes, the lands (32) and metal wires (31) for connecting them are integrally formed as a metal wiring pattern (33). A solder resist film (50) having an opening for exposing a part of each land (32) is formed, and a metal ball (40) is provided on the land (32) in the opening. The low elasticity layer (20) absorbs thermal stress and the like caused in heating or cooling the semiconductor device, so as to prevent disconnection of the metal wires (31).
摘要翻译：在半导体衬底（10）的主表面上设置有在电极配置区域中设置有元件电极的开口的低弹性层（20）。在低弹性层（20）上设置用作外部电极的焊盘（32），并且元件电极上的焊盘（30），用于连接的焊盘（32）和金属丝（31）一体地形成为金属布线图案（33）。形成具有用于暴露每个焊盘（32）的一部分的开口的阻焊膜（50），并且金属球（40）设置在开口中的焊盘（32）上。低弹性层（20）吸收在加热或冷却半导体器件时引起的热应力等，以防止金属线（31）的断开。

60. 发明授权

US5856377A Process for manufacturing thermosetting resin particles for powder coating use 失效
标题翻译：制造用于粉末涂料的热固性树脂颗粒的方法
公开(公告)号：US5856377A
公开(公告)日：1999-01-05
申请号：US814773
申请日：1997-03-10
申请人： Haruhiko Sato , Yutaka Harada
发明人： Haruhiko Sato , Yutaka Harada
IPC分类号： C08F291/00 , C08J3/12 , C09D5/03 , C09D5/46 , C08K9/00
CPC分类号： C09D5/03 , C08J3/124
摘要： A process for manufacturing thermosetting resin particles for powder coating use exhibiting improved anti-blocking property and workability is disclosed. The process include providing a suspension of the thermosetting resin particles in an aqueous medium and an emulsion or dispersion of a vinyl-based polymer having a relatively high Tg, respectively. The thermosetting resin particles are then treated with the emulsion while the resin particles are still suspended in or wetted with the aqueous medium to adhere the vinyl based polymer onto the resin particles forming a shell layer. The resin particles are dried and made to ready to use in the powder coating.
摘要翻译：公开了一种制造具有改进的抗粘连性和可加工性的粉末涂料用热固性树脂颗粒的方法。该方法包括提供热固性树脂颗粒在水性介质中的悬浮液和分别具有较高Tg的乙烯基类聚合物的乳液或分散体。然后用乳液处理热固性树脂颗粒，同时树脂颗粒仍然悬浮在水性介质中或用水介质润湿，以将乙烯基聚合物粘附到形成壳层的树脂颗粒上。将树脂颗粒干燥并制成即用于粉末涂料中。

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