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51. 发明授权

US07349213B2 Coolant control unit, and cooled electronics system and method employing the same 有权
标题翻译：冷却液控制单元，冷却电子系统及采用该方法的方法
公开(公告)号：US07349213B2
公开(公告)日：2008-03-25
申请号：US11427465
申请日：2006-06-29
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/2079
摘要： A coolant control unit for a liquid cooled electronics system is provided, which includes an external coolant inlet and outlet for receiving and returning external coolant; an internal coolant loop for circulating coolant to the electronics system; a first and second control valve coupling the external coolant inlet and outlet to the internal coolant loop; a heat exchanger connected between the first and second control valves; and control logic for controlling operation of the coolant control unit in one of an external coolant mode and an internal coolant mode. In the external coolant mode, the first and second control valves allow passage of external coolant through the internal coolant loop to the electronics system, and in the internal coolant mode, the first and second control valves isolate coolant within the internal coolant loop from the external coolant inlet and outlet, and pass the coolant therein through the heat exchanger.
摘要翻译：提供了一种用于液冷电子系统的冷却剂控制单元，其包括用于接收和返回外部冷却剂的外部冷却剂入口和出口; 用于将冷却剂循环到电子系统的内部冷却剂回路; 将外部冷却剂入口和出口连接到内部冷却剂回路的第一和第二控制阀; 连接在第一和第二控制阀之间的热交换器; 以及用于控制冷却剂控制单元在外部冷却剂模式和内部冷却剂模式之一中的操作的控制逻辑。在外部冷却剂模式中，第一和第二控制阀允许外部冷却剂通过内部冷却剂回路到电子系统，并且在内部冷却剂模式中，第一和第二控制阀将内部冷却剂回路内的冷却剂与外部冷却剂入口和出口，并使冷却剂通过热交换器。

52. 发明申请

US20070272396A1 Heat Exchanger With Angled Fin 审中-公开
标题翻译：带翅片的换热器
公开(公告)号：US20070272396A1
公开(公告)日：2007-11-29
申请号：US11420237
申请日：2006-05-25
申请人： Levi A Campbell , Richard C. Chu , Michael J. Ellsworth , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A Campbell , Richard C. Chu , Michael J. Ellsworth , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： F28F13/00
CPC分类号： F28F1/34 , F28D2021/0031 , H01L23/3672 , H01L23/473 , H01L2924/0002 , H05K7/20754 , H01L2924/00
摘要： An angled finned heat exchanger and associated method is provided. The heat exchanger cools the air provided to the electronic components and is disposed at an angle with respect to direction of air flow. The heat exchanger comprises a plurality of fins that are at an angle with respect to frontal area of the heat exchanger. In alternate embodiments, the angle of the fin is optimized to minimize air pressure loss and/or drop. Some suggested methods of fabrication of the fins are also provided.
摘要翻译：提供了一种有角度的翅片式热交换器和相关联的方法。热交换器冷却提供给电子部件的空气，并且相对于空气流动的方向以一定角度设置。热交换器包括与热交换器的正面区域成一角度的多个翅片。在替代实施例中，翅片的角度被优化以最小化空气压力损失和/或下降。还提供了一些建议的翅片制造方法。

53. 发明授权

US07298618B2 Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled 有权
公开(公告)号：US07298618B2
公开(公告)日：2007-11-20
申请号：US11258316
申请日：2005-10-25
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： G06F1/20 , G06F2200/201 , H05K7/2079
摘要： Cooling apparatuses and methods are provided for cooling an assembly including a planar support structure supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, coolant outlet and at least one coolant carrying channel disposed therebetween; and a manifold for distributing coolant to and exhausting coolant from the cold plates. The cooling apparatus also includes multiple flexible hoses connecting the coolant inlets of the cold plates to the manifold, as well as the coolant outlets to the manifold, with each hose segment being disposed between a respective cold plate and the manifold. A biasing mechanism biases the cold plates away from the manifold and towards the electronics components, and at least one fastener secures the manifold to the support structure, compressing the biasing mechanism, and thereby forcing the parallel coupled cold plates towards their respective electronics components to ensure good thermal interface.

54. 发明授权

US07277283B2 Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated coolant inlet and outlet manifold 有权
标题翻译：冷却装置，冷却电子模块及其制造方法采用集成冷却剂入口和出口歧管
公开(公告)号：US07277283B2
公开(公告)日：2007-10-02
申请号：US11124513
申请日：2005-05-06
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H01L23/4735 , H01L2924/0002 , Y10S165/908 , H01L2924/00
摘要： A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The cooling apparatus includes an integrated coolant inlet and outlet manifold having a plurality of inlet orifices for injecting coolant onto a surface to be cooled, and a plurality of outlet openings for exhausting coolant after impinging on the surface to be cooled. The inlet orifices and the outlet openings are interspersed in a common surface of the integrated manifold. A plurality of exit openings are also provided on at least one edge surface of the manifold. These exit openings are in fluid communication through the manifold with the outlet openings to facilitate exhausting of coolant through the outlet openings and minimize pressure drop through the manifold. At least one surface plane projection of the at least one edge surface intersects a surface plane projection of the common surface.
摘要翻译：提供冷却装置和制造方法以便于从发热电子装置中除去热量。冷却装置包括具有多个用于将冷却剂喷射到待冷却表面上的多个入口孔的集成冷却剂入口和出口歧管，以及用于在撞击待冷却表面之后排出冷却剂的多个出口开口。入口孔和出口开口散布在集成歧管的共同表面中。多个出口也设置在歧管的至少一个边缘表面上。这些出口通过歧管与出口开口流体连通，以便冷却剂通过出口开口排出并使通过歧管的压降最小化。所述至少一个边缘表面的至少一个表面平面突起与所述公共表面的表面平面投影相交。

55. 发明授权

US06973801B1 Cooling system and method employing a closed loop coolant path and micro-scaled cooling structure within an electronics subsystem of an electronics rack 有权
标题翻译：在电子机架的电子子系统内使用闭环冷却剂路径和微型冷却结构的冷却系统和方法
公开(公告)号：US06973801B1
公开(公告)日：2005-12-13
申请号：US11008711
申请日：2004-12-09
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： F25D23/12 , H01L23/473 , H05K7/20
CPC分类号： H05K7/2079 , H01L23/473 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A cooling approach is provided for one or more subsystems of an electronics rack. The cooling approach employs a coolant distribution unit and a thermal dissipation unit. The coolant distribution unit has a first heat exchanger, a first cooling loop and a second cooling loop. The first cooling loop passes facility coolant through the first heat exchanger, and the second cooling loop provides system coolant to an electronics subsystem, and expels heat in the first heat exchanger from the subsystem to the facility coolant. The thermal dissipation unit is associated with the electronics subsystem and includes a second heat exchanger, the second cooling loop, and a third cooling loop. The second cooling loop provides system coolant to the second heat exchanger, and the third cooling loop circulates conditioned coolant within the electronics subsystem and expels heat in the second heat exchanger from the electronics subsystem to the system coolant.
摘要翻译：为电子机架的一个或多个子系统提供冷却方法。冷却方式采用冷却液分配单元和散热单元。冷却剂分配单元具有第一热交换器，第一冷却回路和第二冷却回路。第一冷却回路使设备冷却剂通过第一热交换器，并且第二冷却回路将系统冷却剂提供给电子子系统，并将第一热交换器中的热量从子系统排出到设备冷却剂。散热单元与电子子系统相关联并且包括第二热交换器，第二冷却回路和第三冷却回路。第二冷却回路为第二热交换器提供系统冷却剂，第三冷却回路将调节后的冷却剂循环在电子子系统内，并将第二热交换器中的热量从电子系统排出到系统冷却剂。

56. 发明授权

US09295182B2 Dual coil with adapter to move between redundant and non-redundant high performance heat exchanger 有权
标题翻译：双线圈与适配器在冗余和非冗余高性能热交换器之间移动
公开(公告)号：US09295182B2
公开(公告)日：2016-03-22
申请号：US13296207
申请日：2011-11-14
申请人： Madhusudan K. Iyengar , Roger R. Schmidt
发明人： Madhusudan K. Iyengar , Roger R. Schmidt
IPC分类号： F28D15/00 , B23P15/26 , H05K7/20 , F28D21/00
CPC分类号： H05K7/20736 , F28D2021/0028 , F28F2210/04 , H05K7/20618 , H05K7/20781 , Y10T29/4935
摘要： An apparatus, rear door heat exchanger, system, and method for controlling the redundancy of a cooling system for a server rack. The system includes a cooling system having at least two liquid cooling circuits. The system also includes a rear door heat exchanger connected to the cooling system. The rear door heat exchanger includes two heat exchange coils. Each heat exchange coil is carried by the server rack and configured to interface with a different liquid cooling circuit. The rear door heat exchanger also includes an adapter configured to couple together the two heat exchange coils into one heat exchange unit. The heat exchange unit is configured to interface with one liquid cooling circuit from the cooling system.
摘要翻译：一种用于控制用于服务器机架的冷却系统的冗余的装置，后门热交换器，系统和方法。该系统包括具有至少两个液体冷却回路的冷却系统。该系统还包括连接到冷却系统的后门热交换器。后门热交换器包括两个热交换线圈。每个热交换线圈由服务器机架承载，并配置成与不同的液体冷却回路接口。后门热交换器还包括配置成将两个热交换盘管连接在一起的一个热交换单元中的适配器。热交换单元配置成与来自冷却系统的一个液体冷却回路相连接。

57. 发明授权

US09110476B2 Controlled cooling of an electronic system based on projected conditions 有权
标题翻译：基于预测条件控制电子系统的冷却
公开(公告)号：US09110476B2
公开(公告)日：2015-08-18
申请号：US13527909
申请日：2012-06-20
申请人： Milnes P. David , Madhusudan K. Iyengar , Roger R. Schmidt
发明人： Milnes P. David , Madhusudan K. Iyengar , Roger R. Schmidt
IPC分类号： G05D23/00 , G05D23/19 , H05K7/20
CPC分类号： G05D23/00 , G05D23/1919 , H05K7/20836
摘要： Energy efficient control of a cooling system cooling an electronic system is provided based, in part, on projected conditions. The control includes automatically determining an adjusted control setting(s) for an adjustable cooling component(s) of the cooling system. The automatically determining is based, at least in part, on projected power consumed by the electronic system at a future time and projected temperature at the future time of a heat sink to which heat extracted is rejected. The automatically determining operates to reduce power consumption of the cooling system and/or the electronic system while ensuring that at least one targeted temperature associated with the cooling system or the electronic system is within a desired range. The automatically determining may be based, at least in part, on an experimentally obtained model(s) relating the targeted temperature and power consumption of the adjustable cooling component(s) of the cooling system.
摘要翻译：部分地基于预计的条件提供冷却电子系统的冷却系统的能量效率控制。该控制包括自动确定用于冷却系统的可调冷却部件的调整的控制设置。至少部分地，自动确定是基于电子系统在未来时间的消耗的预计功率以及散热器未来时间的预计温度，而散热器的热量被排除。自动确定用于降低冷却系统和/或电子系统的功率消耗，同时确保与冷却系统或电子系统相关联的至少一个目标温度在期望的范围内。该自动确定可以至少部分地基于与冷却系统的可调冷却部件的目标温度和功率消耗相关的实验获得的模型。

58. 发明授权

US08593815B2 Techniques for data center cooling 失效
公开(公告)号：US08593815B2
公开(公告)日：2013-11-26
申请号：US13189515
申请日：2011-07-24
申请人： Alan Claassen , Hendrik F. Hamann , Madhusudan K. Iyengar , James Andrew Lacey , Yves C. Martin , Roger R. Schmidt , Theodore Gerard van Kessel
发明人： Alan Claassen , Hendrik F. Hamann , Madhusudan K. Iyengar , James Andrew Lacey , Yves C. Martin , Roger R. Schmidt , Theodore Gerard van Kessel
IPC分类号： H05K5/00 , H05K7/20 , A47B81/00
CPC分类号： H05K7/20754 , H05K7/20736 , H05K7/20745
摘要： Techniques for cooling in a data center are provided. In one aspect, a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets; and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack.

59. 发明申请

US20130118353A1 SERVER RACK FRONT DOOR WITH CONTAMINATION FILTER AND SENSOR 有权
标题翻译：服务器机架前门带有污染过滤器和传感器
公开(公告)号：US20130118353A1
公开(公告)日：2013-05-16
申请号：US13295078
申请日：2011-11-13
申请人： Madhusudan K. Iyengar , Roger R. Schmidt , Prabjit Singh
发明人： Madhusudan K. Iyengar , Roger R. Schmidt , Prabjit Singh
IPC分类号： B01D46/42 , B01D46/00
CPC分类号： B01D46/10 , B01D46/103 , B01D2279/45
摘要： An apparatus, system, and method for preventing server contamination. The system includes a server rack and a contamination filter secured to the server rack. The contamination filter may be configured to filter particulate substances and/or chemical substances from air. The system may include a reaction coupon configured to indicate the presence of particulate substances and/or chemical substances in the air.
摘要翻译：一种用于防止服务器污染的设备，系统和方法。该系统包括一个服务器机架和一个固定在服务器机架上的污染过滤器。污染过滤器可以被配置为从空气中过滤颗粒物质和/或化学物质。该系统可以包括配置为指示空气中颗粒状物质和/或化学物质的存在的反应试剂。

60. 发明申请

US20130096721A1 DATA CENTER COOLING CONTROL 有权
标题翻译：数据中心冷却控制
公开(公告)号：US20130096721A1
公开(公告)日：2013-04-18
申请号：US13276247
申请日：2011-10-18
申请人： Madhusudan K. Iyengar , Roger R. Schmidt
发明人： Madhusudan K. Iyengar , Roger R. Schmidt
IPC分类号： G05D23/19
CPC分类号： H05K7/20836 , G05D23/1932
摘要： A method, system, and computer program product for controlling data center cooling. In an example embodiment the method includes calculating, using a processor, an over-provisioning factor, where the over-provisioning factor is a function of a ratio of a rated cooling power to a calculated cooling power of a set of cooling units, the set of cooing units comprising at least one cooling unit. The method proceeds by adjusting the data-center cooling until the over-provisioning factor is substantially equal to a target over-provisioning factor.
摘要翻译：一种用于控制数据中心冷却的方法，系统和计算机程序产品。在示例实施例中，该方法包括使用处理器计算过度供应因子，其中过度供应因子是额定冷却功率与一组冷却单元的计算的冷却功率的比率的函数，该组包括至少一个冷却单元的冷却单元。该方法通过调整数据中心冷却来进行，直到过度供应因子基本上等于目标过度供应因子。

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