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51. 发明授权

US07114250B2 Method of making components with releasable leads 失效
公开(公告)号：US07114250B2
公开(公告)日：2006-10-03
申请号：US10858167
申请日：2004-06-01
申请人： Belgacem Haba , Konstantine Karavakis
发明人： Belgacem Haba , Konstantine Karavakis
IPC分类号： H01R9/00
CPC分类号： H05K3/4092 , H01L23/32 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/3011 , Y10T29/49121 , Y10T29/49147 , Y10T29/49149 , Y10T29/49153 , Y10T29/49155 , Y10T29/49204 , Y10T29/49218 , Y10T29/49222 , Y10T29/49224 , H01L2924/00
摘要： A connection component for making connections to a microelectronic element is made by providing leads on a surface of a polymeric layer and etching the polymeric layer to partially detach the leads from the polymeric layer, leaving a portion of each lead releasably connected to the polymeric layer by a small polymeric connecting element which can be broken or peeled away from the lead. Leads in a connecting element may be covered by an insulating jacket applied by a coating process, and the insulating jacket may in turn be covered by a conductive layer so that each lead becomes a miniature coaxial cable. This arrangement provides immunity to interference and facilitates operation at high speeds.

52. 发明授权

US06500528B1 Enhancements in sheet processing and lead formation 失效
标题翻译：片材加工和铅的形成增强
公开(公告)号：US06500528B1
公开(公告)日：2002-12-31
申请号：US09559511
申请日：2000-04-27
申请人： Konstantine Karavakis
发明人： Konstantine Karavakis
IPC分类号： B32B300
CPC分类号： H01L23/49827 , H01L23/49811 , H01L2924/0002 , Y10T428/24917 , H01L2924/00
摘要： A connection component for making microelectronic assemblies includes a dielectric structural layer having a first surface and a plurality of conductive leads having first and second ends overlying the first surface of the dielectric structural layer. An adhesive is provided between the second ends of the leads and the dielectric structural layer such that the adhesive forms connections between the second ends of the leads and the structural layer. The formed connections have areas smaller than the areas of the second ends. The second ends of the leads are releasably attached to the structural layer by the connections. Thus, the second ends of the leads may be engaged with features on a microelectronic device and the microelectronic elements may be moved away from the structural layer so as to bend the second ends of the leads away from the structural layer.
摘要翻译：用于制造微电子组件的连接部件包括具有第一表面的介电结构层和多个导电引线，其具有覆盖在介电结构层的第一表面上的第一端和第二端。在引线的第二端和电介质结构层之间提供粘合剂，使得粘合剂在引线的第二端和结构层之间形成连接。形成的连接具有小于第二端的区域的区域。引线的第二端通过连接件可释放地附接到结构层。因此，引线的第二端可以与微电子器件上的特征接合，并且微电子元件可以远离结构层移动，以使引线的第二端弯曲远离结构层。

53. 发明授权

US06204455B1 Microelectronic component mounting with deformable shell terminals 有权
标题翻译：具有可变形外壳端子的微电子部件安装
公开(公告)号：US06204455B1
公开(公告)日：2001-03-20
申请号：US09345548
申请日：1999-06-30
申请人： Kenneth B. Gilleo , Konstantine Karavakis
发明人： Kenneth B. Gilleo , Konstantine Karavakis
IPC分类号： H01R1204
CPC分类号： H01L23/49827 , H01L2924/0002 , H01L2924/3011 , H05K3/3436 , H01L2924/00
摘要： A microelectronic element assembly such as a semiconductor chip assembly uses a connection component incorporating a dielectric sheet with electrically conductive elements therein. Each electrically conductive element may include a flexible shell. The flexible shells can be formed to assure reliable engagement with mating contact pads.
摘要翻译：诸如半导体芯片组件的微电子元件组件使用在其中结合有电导元件的电介质片的连接部件。每个导电元件可以包括柔性壳。可以形成柔性壳体以确保与配合接触垫片的可靠接合。

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