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    • 54. 发明申请
    • Solid-state imaging apparatus, camera, and method of manufacturing solid-state imaging apparatus
    • 固态成像装置,照相机和制造固态成像装置的方法
    • US20100097512A1
    • 2010-04-22
    • US12585604
    • 2009-09-18
    • Shinji MiyazawaTakeshi Takeda
    • Shinji MiyazawaTakeshi Takeda
    • H04N5/335H01L27/148H01L21/28
    • H01L27/14818H01L27/14623H01L27/14689H01L27/14843
    • A solid-state imaging apparatus includes a plurality of photoelectric conversion units configured to generate signal charge from light received at light-receiving surfaces thereof, the plurality of photoelectric conversion units being provided in the image-sensing area of a substrate; a charge reading unit configured to read signal charge generated by the photoelectric conversion units, a charge readout channel area thereof being provided in the image-sensing area of the substrate; a transfer register unit configured to transfer signal charge read from the plurality of photoelectric conversion units by the charge reading unit, a charge transfer channel area thereof being provided in the image-sensing area of the substrate; and a light-shielding unit that is provided in the image-sensing area of the substrate and that has an opening through which light is transmitted formed in an area corresponding to a light-receiving surface of a respective photoelectric conversion unit.
    • 固态成像装置包括多个光电转换单元,被配置为从其在光接收表面处接收的光产生信号电荷,所述多个光电转换单元设置在基板的图像感测区域中; 电荷读取单元,被配置为读取由所述光电转换单元生成的信号电荷,其电荷读出通道区域设置在所述基板的图像感测区域中; 转移寄存器单元,被配置为通过所述电荷读取单元传送从所述多个光电转换单元读取的信号电荷,其电荷转移通道区域设置在所述基板的图像感测区域中; 以及遮光单元,其设置在所述基板的图像感测区域中,并且在与各个光电转换单元的光接收表面对应的区域中形成有透光的开口。
    • 56. 发明申请
    • INFRARED SENSOR AND METHOD FOR MANUFACTURING INFRARED SENSOR
    • 红外传感器和制造红外传感器的方法
    • US20090026372A1
    • 2009-01-29
    • US12233901
    • 2008-09-19
    • Koji HayashiHitoshi TagaTakeshi Takeda
    • Koji HayashiHitoshi TagaTakeshi Takeda
    • G01J5/10H01L21/00
    • H01L31/0203H01L31/02162H01L31/09H01L2224/48091H01L2224/48227H01L2924/00014
    • An economical and highly reliable infrared sensor with a wide field of view and a method for economically manufacturing a highly reliable infrared sensor with a wide field of view includes a package having supporting portions that support an optical filter at a location below the upper surfaces of sidewalls of the package and recessed portions that communicate with gaps between side surfaces of the optical filter supported by the supporting portions and the sidewalls of the package. An adhesive is supplied to the recessed portions while the optical filter is supported by the supporting portions such that the adhesive flows into the gaps between the optical filter and the sidewalls of the package by capillary action and such that the optical filter is fixed to an opening of the package via the adhesive. The optical filter is fixed to the package via the adhesive by applying the adhesive such that the adhesive spreads over substantially the entire circumference of the optical filter.
    • 具有宽视野的经济且高度可靠的红外传感器和用于经济地制造具有宽视野的高度可靠的红外传感器的方法包括具有支撑部分的封装,所述支撑部分在侧壁的上表面下方的位置处支撑滤光器 以及与由支撑部分支撑的滤光器的侧表面与封装的侧壁之间的间隙连通的凹部。 粘合剂被供给到凹部,同时滤光器被支撑部支撑,使得粘合剂通过毛细管作用流入滤光器和封装的侧壁之间的间隙中,并且使得滤光器固定到开口 的包装。 通过施加粘合剂将滤光器通过粘合剂固定到包装上,使得粘合剂在光学滤光器的基本上整个圆周上扩展。