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51. 发明授权

US08109323B2 Heat dissipation device having a clip 失效
标题翻译：具有夹子的散热装置
公开(公告)号：US08109323B2
公开(公告)日：2012-02-07
申请号：US12409502
申请日：2009-03-24
申请人： Zhi-Sheng Lian , Gen-Ping Deng , Chun-Chi Chen
发明人： Zhi-Sheng Lian , Gen-Ping Deng , Chun-Chi Chen
IPC分类号： F28F7/00 , H05K7/20 , F28D15/00
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/0275 , F28F1/32 , H01L23/3672 , H01L23/4006 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device removing heat from a heat generating electronic device on a printed circuit board includes a base, a plurality of fins attached to the base and a clip for mounting the base and the fins onto the heat generating electronic device. Each of the fins defines a closed through hole therein. The holes of the fins cooperatively define a channel. The clip includes a locking beam extending through the channel of the fins and two fasteners engaging the locking beam mounting the base and the fins onto the heat generating electronic device.
摘要翻译：从印刷电路板上的发热电子装置中除去热的散热装置包括底座，安装在基座上的多个翅片以及用于将基座和翅片安装在发热电子设备上的夹子。每个翅片在其中限定了一个封闭的通孔。翅片的孔协同地限定通道。夹具包括延伸穿过翅片的通道的锁定梁和两个紧固件，其接合将基座和翅片安装到发热电子设备上的锁定梁。

52. 发明授权

US08050038B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US08050038B2
公开(公告)日：2011-11-01
申请号：US12504681
申请日：2009-07-17
申请人： Chun-Chi Chen , Hong-Cheng Yang , Xin-Lei Liu
发明人： Chun-Chi Chen , Hong-Cheng Yang , Xin-Lei Liu
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0266 , H01L23/3672 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a heat-conducting board attached to the electronic component, a heat pipe thermally connecting the fin unit and the heat-conducting board, and a clip disposed on the heat pipe. Two engaging portions protrude upwardly from a top face of the heat-conducting board towards each other. The heat pipe extends between the two engaging portions. The two engaging portions press two opposite ends of the clip downwardly, thereby securing the heat pipe to the top face of the heat-conducting board.
摘要翻译：一种用于从安装在印刷电路板上的电子部件散热的散热装置，包括翅片单元，安装在电子部件上的导热板，热连接翅片单元和导热板的热管，以及设置在热管上的夹子。两个接合部分从导热板的顶面朝向彼此向上突出。热管在两个接合部分之间延伸。两个接合部分向下按压夹子的两个相对端，从而将热管固定到导热板的顶面。

53. 发明授权

US08002019B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US08002019B2
公开(公告)日：2011-08-23
申请号：US12051853
申请日：2008-03-20
申请人： Xu-Xin Min , Meng Fu , Chun-Chi Chen
发明人： Xu-Xin Min , Meng Fu , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： F28D15/0275 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a base, a fin group located on the base, a first heat pipe and a second heat pipe. The fin group includes a first fin group, a second fin group arranged on the first fin group and a third fin group arranged on the second fin group. The first heat pipe includes an evaporating portion sandwiched between the base and the first fin group, a condensing portion sandwiched between the first fin group and the second fin group, and a connecting portion interconnecting the evaporating portion and the condensing portion. The second heat pipe includes an evaporating portion sandwiched between the base and the first fin group, a condensing portion located between the second fin group and the third fin group, and a connecting portion interconnecting the evaporating portion and the condensing portion thereof.
摘要翻译：散热装置包括基座，位于基座上的翅片组，第一热管和第二热管。翅片组包括布置在第一鳍片组上的第一鳍片组，第二鳍片组和布置在第二鳍片组上的第三鳍片组。第一热管包括夹在基部和第一翅片组之间的蒸发部分，夹在第一翅片组和第二翅片组之间的冷凝部分和将蒸发部分和冷凝部分互连的连接部分。第二热管包括夹在基座和第一翅片组之间的蒸发部分，位于第二翅片组和第三翅片组之间的冷凝部分和将蒸发部分和其冷凝部分互连的连接部分。

54. 发明授权

US07990719B2 Electronic system with heat dissipation device 有权
标题翻译：具有散热装置的电子系统
公开(公告)号：US07990719B2
公开(公告)日：2011-08-02
申请号：US12610388
申请日：2009-11-02
申请人： Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
发明人： Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： H05K7/20154
摘要： A heat dissipation device is provided for dissipating heat generated by electronic components mounted on a printed circuit board in an electronic system. The electronic components have different heights. The heat dissipation device includes a connecting plate, at least two elastic members mounted on the connecting plate, and a heat sink having a substrate mounted on the connecting plate and located above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the substrate to attach the substrate on the one electronic component on the printed circuit board. A distance between the substrate and the connecting plate is adjustable by adjusting the joining members to make the substrate intimately contact the one electronic component.
摘要翻译：散热装置用于散发电子系统中安装在印刷电路板上的电子元件产生的热量。电子元件具有不同的高度。所述散热装置包括连接板，安装在所述连接板上的至少两个弹性部件和散热器，所述散热器具有安装在所述连接板上且位于所述电子部件之一上方的基板。多个接合构件延伸穿过印刷电路板并与衬底接合以将衬底附着在印刷电路板上的一个电子部件上。基板和连接板之间的距离可通过调节连接部件来调节，以使基板与一个电子部件紧密接触。

55. 发明授权

US07969728B2 Heat dissipation device with a fan holder attached with a position-adjustable air guiding member 失效
标题翻译：带散热装置的风扇架带有一个位置可调导风构件
公开(公告)号：US07969728B2
公开(公告)日：2011-06-28
申请号：US12399027
申请日：2009-03-06
申请人： Dong-Bo Zheng , Meng Fu , Chun-Chi Chen
发明人： Dong-Bo Zheng , Meng Fu , Chun-Chi Chen
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： H01L23/467 , H01L23/3672 , H01L23/4006 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a heat sink having a plurality of fins defining a plurality of passageways therebetween. The passageways have an inlet and an outlet at front and rear sides of the heat sink. Two adjusting members are mounted at two lateral sides of the heat sink. A fan is located at the inlet of the passageways of the heat sink for providing airflow to the heat sink. A guiding member is positioned at the outlet of the passageways of the heat sink for guiding the airflow to electronic components around the heat dissipation device. The guiding member engages the adjusting members and can move vertically relative to adjusting members, thereby adjusting a height of the guiding member along a height of the heat sink.
摘要翻译：散热装置包括具有限定多个通道之间的多个翅片的散热器。通道在散热器的前侧和后侧具有入口和出口。两个调节构件安装在散热器的两个侧面。风扇位于散热器通道的入口处，用于向散热器提供气流。引导构件定位在散热器的通道的出口处，用于将气流引导到散热装置周围的电子部件。引导构件与调节构件接合并且可相对于调节构件垂直移动，从而沿着散热器的高度调节引导构件的高度。

56. 发明授权

US07866376B2 Heat dissipation device with U-shaped and S-shaped heat pipes 有权
标题翻译：具有U形和S形热管的散热装置
公开(公告)号：US07866376B2
公开(公告)日：2011-01-11
申请号：US11926701
申请日：2007-10-29
申请人： Lei Jiang , Dong-Bo Zheng , Meng Fu , Chun-Chi Chen
发明人： Lei Jiang , Dong-Bo Zheng , Meng Fu , Chun-Chi Chen
IPC分类号： F28D15/00 , H05K7/20 , H01L23/34 , F28F7/00
CPC分类号： F28D15/0233 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a base for contacting an electronic device, a fin set thermally contacting the base, a first heat pipe and a second heat pipe connecting the base and the fin set. The fin set has a bottom larger than the base and an upper portion apart from the bottom thereof. The first heat pipe has a flat top face thermally contacting the bottom of the fin set, including a first transferring portion thermally engaging with the base and a second transferring portion extending from the first transferring portion and projecting beyond the base. The second heat pipe includes an evaporation portion thermally engaging with the base and a condensation portion extending from the evaporation portion and engaging with the upper portion of the fin set.
摘要翻译：散热装置包括用于接触电子设备的基座，与基座热接触的翅片组，第一热管和连接基座和翅片组的第二热管。翅片组具有比基部大的底部和与其底部分离的上部。第一热管具有与翅片组的底部热接触的平坦顶面，包括与基部热接合的第一传递部分和从第一传递部分延伸并突出超出基部的第二传递部分。第二热管包括与基座热接合的蒸发部分和从蒸发部分延伸并与翅片组的上部接合的冷凝部分。

57. 发明授权

US07866375B2 Heat dissipation device with heat pipes 有权
标题翻译：带热管的散热装置
公开(公告)号：US07866375B2
公开(公告)日：2011-01-11
申请号：US11566003
申请日：2006-12-01
申请人： Shi-Wen Zhou , Chun-Chi Chen , Bao-Chun Chen
发明人： Shi-Wen Zhou , Chun-Chi Chen , Bao-Chun Chen
IPC分类号： F28D15/00 , F28F7/00 , H01L23/24 , H05K7/20
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0275 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a base (10), a plurality of fins (20), first and second heat pipes (30), (40), a fan holder (50) and a fan (60) secured to the fan holder. The first heat pipe includes a heat-receiving section (32) and two heat-discharging sections (34). The second heat pipe includes an evaporating portion (42) and two condensing portions (44). The condensing portions of the second heat pipe extend into the fins and are disposed adjacent to opposite ends of each of the fins. One heat-discharging section extends in the fins and is disposed between the condensing portions, thus allowing heat absorbed from the base to be evenly distributed throughout the fins by the heat-discharging sections and the condensing portions.
摘要翻译：一种散热装置，包括底座（10），多个翅片（20），第一和第二热管（30），（40），风扇架（50）和固定到风扇架的风扇（60）。第一热管包括受热部（32）和两个散热部（34）。第二热管包括蒸发部分（42）和两个冷凝部分（44）。第二热管的冷凝部分延伸到翅片中并且与每个翅片的相对端相邻设置。一个放热部分在翅片中延伸并且设置在冷凝部分之间，从而允许从基座吸收的热量通过散热部分和冷凝部分均匀分布在整个翅片上。

58. 发明申请

US20100297890A1 ELECTRICAL CONNECTOR INTEGRALLY FORMED WITH SCREW HOLES 有权
标题翻译：电连接器与螺丝孔一体成型
公开(公告)号：US20100297890A1
公开(公告)日：2010-11-25
申请号：US12786451
申请日：2010-05-25
申请人： Wen-Huei Yang , Chun-Chi Chen
发明人： Wen-Huei Yang , Chun-Chi Chen
IPC分类号： H01R24/00 , H01R43/20
CPC分类号： H01R12/7047 , H01R12/724 , Y10T29/49208
摘要： An electrical connector includes a plurality of terminals and an insulating housing loading terminals and defining a pair of mounting portions. Each of mounting portions has a screw hole extending along an upper to lower direction in which the electrical connector is mounted. The hole is divided into at least a first segment and a second segment below the first segment. The first segment and the second segment are tapped with a plurality of threads thereinside and open in opposite directions along a front and rear direction respectively.
摘要翻译：电连接器包括多个端子和绝缘壳体装载端子并限定一对安装部分。每个安装部分具有沿安装电连接器的上下方向延伸的螺孔。孔被分成至少第一段和第一段下面的第二段。第一段和第二段分别与其内部的多个螺纹分接，并沿着前后方向在相反的方向上打开。

59. 发明授权

US07802616B2 Heat dissipation apparatus with heat pipes 有权
标题翻译：带热管的散热装置
公开(公告)号：US07802616B2
公开(公告)日：2010-09-28
申请号：US11757196
申请日：2007-06-01
申请人： Yong-Dong Chen , Guang Yu , Shih-Hsun Wung , Chun-Chi Chen
发明人： Yong-Dong Chen , Guang Yu , Shih-Hsun Wung , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/0275 , F28F1/12 , F28F3/02 , F28F2215/10 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation apparatus adapted for removing heat from a heat-generating electronic component, includes a conducting core, a plurality of conducting arms, a plurality of fins and a heat pipe assembly. The conducting core comprises a heat-absorbing portion contacting with the heat-generating electronic component. The conducting arms extend radially and outwardly from the conducting core. The fins extend outwardly from the respective conducting arms. Each of the heat pipes comprises an evaporating section thermally attached to the heat-absorbing portion of the conducting core and at least one condensing section thermally coupled to the respective conducting arm.
摘要翻译：一种用于从发热电子部件除去热量的散热装置，包括导电芯，多个导电臂，多个翅片和热管组件。导电芯包括与发热电子部件接触的吸热部。导电臂从导电芯径向和向外延伸。翅片从相应的导电臂向外延伸。每个热管包括热连接到导电芯的吸热部分的蒸发部分和至少一个热连接到相应导电臂的冷凝部分。

60. 发明授权

US07746640B2 Heat dissipation device with heat pipes 有权
标题翻译：带热管的散热装置
公开(公告)号：US07746640B2
公开(公告)日：2010-06-29
申请号：US11777034
申请日：2007-07-12
申请人： Lei Cao , Dong-Bo Zheng , Meng Fu , Chun-Chi Chen
发明人： Lei Cao , Dong-Bo Zheng , Meng Fu , Chun-Chi Chen
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0275 , G06F1/20 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a base for contacting an electronic device, a fin set located on the base and first, second heat pipes thermally engaged in the base. The first heat pipe comprises a first transferring portion and two second transferring portions extending from two opposite free ends of the first transferring portion. The second heat pipe has first and second transferring sections. The first transferring section of the second heat pipe is located adjacent to the first transferring portion of the first heat pipe and between the first transferring portion and one of the second transferring portions of the first heat pipe, and the second transferring section of the second heat pipe is located adjacent to the one of the second transferring portions of the first heat pipe.
摘要翻译：散热装置包括用于接触电子设备的基座，位于基座上的翅片组和第一热接合在基座中的第二热管。第一热管包括第一传送部分和从第一传送部分的两个相对的自由端延伸的两个第二传送部分。第二热管具有第一和第二传送部。第二热管的第一传送部分位于第一热管的第一传送部分附近并且位于第一传送部分和第一热管的第二传送部分之一之间，第二传热部分的第二传热部分管相邻于第一热管的第二转移部分之一。

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