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51. 发明授权

US08857057B2 Apparatus and method for facilitating servicing of a liquid-cooled electronics rack 有权
标题翻译：便于维修液冷电子机架的装置和方法
公开(公告)号：US08857057B2
公开(公告)日：2014-10-14
申请号：US13447421
申请日：2012-04-16
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madusudan K. Iyengar , Robert E. Simons , Prabjit Singh
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madusudan K. Iyengar , Robert E. Simons , Prabjit Singh
IPC分类号： B21D53/02 , B23P6/00 , F28D15/00 , H01S4/00 , H05K7/20
CPC分类号： H05K7/20781 , Y10T29/49002 , Y10T29/4935 , Y10T29/49352 , Y10T29/49826
摘要： An apparatus for facilitating servicing of a liquid-cooled electronics rack is provided. The apparatus includes a coolant tank, a coolant pump in fluid communication with the coolant tank, multiple parallel-connected coolant supply lines coupling the coolant pump to a coolant supply port of the apparatus, and a coolant return port and a coolant return line coupled between the coolant return port and the coolant tank. Each coolant supply line includes a coolant control valve for selectively controlling flow of coolant therethrough pumped by the coolant pump from the coolant tank. At least one coolant supply line includes at least one filter, and one coolant supply line is a bypass line with no filter. When operational, the apparatus facilitates filling of coolant into a cooling system of a liquid-cooled electronics rack by allowing for selective filtering of coolant inserted into the cooling system.
摘要翻译：提供一种用于便利液体冷却电子机架的维修的装置。该装置包括冷却剂箱，与冷却剂箱流体连通的冷却剂泵，将冷却剂泵连接到设备的冷却剂供应端口的多个并联连接的冷却剂供应管线，以及冷却剂返回端口和冷却剂返回管线，冷却液返回口和冷却液箱。每个冷却剂供应管线包括冷却剂控制阀，用于选择性地控制由冷却剂泵从冷却剂箱泵送的冷却剂流。至少一个冷却剂供应管线包括至少一个过滤器，一个冷却剂供应管线是没有过滤器的旁路管路。当操作时，该装置通过允许选择性地过滤插入到冷却系统中的冷却剂，便于将冷却剂填充到液冷电子机架的冷却系统中。

52. 发明申请

US20120038377A1 CORROSION SENSORS 有权
标题翻译：腐蚀传感器
公开(公告)号：US20120038377A1
公开(公告)日：2012-02-16
申请号：US12854416
申请日：2010-08-11
申请人： Hendrik F. Hamann , Levente L. Klein , Michael A. Schappert , Prabjit Singh
发明人： Hendrik F. Hamann , Levente L. Klein , Michael A. Schappert , Prabjit Singh
IPC分类号： G01R27/08
CPC分类号： G01N27/00 , G01N17/04
摘要： Corrosion sensor apparatus are disclosed for detection of contamination affecting metal based components and devices. For example, an apparatus comprises: a set of corrosion sensor elements comprising a first corrosion sensor element and at least a second corrosion element, each corrosion sensor element being coupled between a source and a monitor, wherein a width of the first corrosion sensor element is different than a width of the second corrosion sensor element, wherein each corrosion sensor element is susceptible to corrosion caused by an operating environment of the corrosion sensor elements; and a set of reference elements comprising a first reference sensor element and at least a second reference sensor element, each reference sensor element being coupled between the source and the monitor, wherein a width of the first reference sensor element is substantially equal to the width of the first corrosion sensor element and a width of the second reference sensor element is substantially equal to the width of the second corrosion sensor element, wherein each reference sensor element is not substantially susceptible to corrosion caused by the operating environment of the corrosion sensor elements.
摘要翻译：公开了用于检测影响金属基部件和装置的污染的腐蚀传感器装置。例如，一种装置包括：一组腐蚀传感器元件，包括第一腐蚀传感器元件和至少第二腐蚀元件，每个腐蚀传感器元件耦合在源极和监测器之间，其中第一腐蚀传感器元件的宽度为不同于第二腐蚀传感器元件的宽度，其中每个腐蚀传感器元件易受腐蚀传感器元件的操作环境引起的腐蚀; 以及一组参考元件，包括第一参考传感器元件和至少第二参考传感器元件，每个参考传感器元件耦合在源和监视器之间，其中第一参考传感器元件的宽度基本上等于第一腐蚀传感器元件和第二参考传感器元件的宽度基本上等于第二腐蚀传感器元件的宽度，其中每个参考传感器元件基本上不受腐蚀传感器元件的操作环境引起的腐蚀。

53. 发明授权

US07547231B1 Large array connector for coupling wafers with a printed circuit board 失效
标题翻译：用于将晶片与印刷电路板耦合的大阵列连接器
公开(公告)号：US07547231B1
公开(公告)日：2009-06-16
申请号：US12036878
申请日：2008-02-25
申请人： Michael J. Domitrovits , Emanuele F. Lopergolo , Prabjit Singh
发明人： Michael J. Domitrovits , Emanuele F. Lopergolo , Prabjit Singh
IPC分类号： H01R13/648
CPC分类号： H01R12/57 , H01R12/712 , H01R13/504 , H01R13/514
摘要： A large array connector is disclosed. The connector includes a plate comprising front, rear, top, bottom, first side, and second side portions. A plurality of guide blocks provide rigid support to at least the plate. A first guide block is mechanically coupled to a first end of the front portion. A second guide block is mechanically coupled to a second end of the front portion. A plurality of wafers is located between the first guide block and the second guide block. A front portion of each of the wafers is mateable with a mid-plane. A fill material is provided between a first portion of each of the wafers and the front portion of the plate. The fill material substantially mechanically couples the first portion of each of the wafers and the front portion of the plate, and provides rigid support to each of the wafers during plug-in with the mid-plane.
摘要翻译：公开了一种大型阵列连接器。连接器包括一个包括前，后，顶，底，第一侧和第二侧部的板。多个引导块向至少该板提供刚性支撑。第一引导块机械地联接到前部的第一端。第二引导块机械地联接到前部的第二端。多个晶片位于第一引导块和第二引导块之间。每个晶片的前部可与中间平面配合。在每个晶片的第一部分和板的前部之间提供填充材料。填充材料基本上机械地联接每个晶片的第一部分和板的前部，并且在插入中间平面期间为每个晶片提供刚性支撑。

54. 发明申请

US20080067696A1 METHOD AND APPARATUS FOR PREVENTION OF SOLDER CORROSION 失效
标题翻译：防止焊锡腐蚀的方法和装置
公开(公告)号：US20080067696A1
公开(公告)日：2008-03-20
申请号：US11532329
申请日：2006-09-15
申请人： Gary F. Goth , William P. Kostenko , John J. Loparco , Prabjit Singh , John G. Torok
发明人： Gary F. Goth , William P. Kostenko , John J. Loparco , Prabjit Singh , John G. Torok
IPC分类号： H01L23/52
CPC分类号： H01L23/26 , H01L23/3672 , H01L25/0655 , H01L2224/16225 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/1433 , H01L2924/15311 , H01L2224/0401
摘要： Disclosed a multi-chip module with solder corrosion prevention including one or more chips connected to a substrate by soldering, the substrate disposed on a printed circuit board. The multi-chip module also includes a quantity of molecular sieve desiccant, and a first cover to contain the one or more chips, the substrate, and the molecular sieve desiccant, the first cover having a seal to the printed circuit board.
摘要翻译：公开了一种具有焊料防腐蚀性的多芯片模块，包括通过焊接连接到衬底的一个或多个芯片，该衬底设置在印刷电路板上。多芯片模块还包括一定数量的分子筛干燥剂，以及包含一个或多个芯片，基底和分子筛干燥剂的第一盖，第一盖具有与印刷电路板的密封。

55. 发明申请

US20080067651A1 METHOD AND APPARATUS FOR PREVENTION OF SOLDER CORROSION UTILIZING FORCED AIR 审中-公开
标题翻译：防止使用强制空气的焊接腐蚀的方法和装置
公开(公告)号：US20080067651A1
公开(公告)日：2008-03-20
申请号：US11532396
申请日：2006-09-15
申请人： Gary F. Goth , William P. Kostenko , John J. Loparco , Prabjit Singh , John G. Torok
发明人： Gary F. Goth , William P. Kostenko , John J. Loparco , Prabjit Singh , John G. Torok
IPC分类号： H01L21/00
CPC分类号： H01L23/562 , H01L23/041 , H01L23/053 , H01L24/16 , H01L24/32 , H01L25/0655 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/16152 , H01L2224/0401
摘要： Disclosed is a multi-chip module with solder corrosion prevention including one or more chips connected to a substrate by soldering, the substrate situated on a printed circuit board. The multi-chip module also includes a molecular sieve desiccant chamber containing a quantity of molecular sieve desiccant and a first cover to contain the one or more chips, the substrate, and the molecular sieve desiccant, the first cover having a seal to the printed circuit board. The molecular sieve desiccant chamber is connected to the first cover via a first fluid pathway and a second fluid pathway.
摘要翻译：公开了一种具有焊料防腐蚀的多芯片模块，包括通过焊接连接到基板的一个或多个芯片，位于印刷电路板上的基板。多芯片模块还包括含有一定数量的分子筛干燥剂的分子筛干燥剂室和含有一个或多个碎片的第一盖子，基底和分子筛干燥剂，第一盖子具有印刷电路的密封板。分子筛干燥剂室经由第一流体路径和第二流体路径连接到第一盖。

56. 发明申请

US20070151759A1 Adhesive free EMC gasket with built-in chassis retention 审中-公开
标题翻译：无内衬的EMC垫片，内置机箱固定
公开(公告)号：US20070151759A1
公开(公告)日：2007-07-05
申请号：US11325666
申请日：2006-01-04
申请人： Mark Marnell , Prabjit Singh , Ivan Svenson
发明人： Mark Marnell , Prabjit Singh , Ivan Svenson
IPC分类号： H05K9/00
CPC分类号： H05K9/0016
摘要： A method and associated apparatus for providing an electromagnetic seal in electrical enclosure of a device. The apparatus comprising of an electromagnetic gasket formed of a thin conductive material, having a first end and an opposing end. The apparatus also includes a conductive chassis disposed in the electrical enclosure and having a first and second protrusions for securing the end of the gasket to the chassis in a manner to provide facility of compression.
摘要翻译：一种用于在装置的电气外壳中提供电磁密封的方法和相关装置。该装置包括由薄导电材料形成的电磁垫圈，具有第一端和相对端。该设备还包括设置在电气外壳中的导电底盘，并具有用于以提供压缩设施的方式将垫圈的端部固定到底架的第一和第二突起。

57. 发明申请

US20070141378A1 Low melting temperature alloy structure for enchanced thermal interface 审中-公开
标题翻译：低熔点合金结构，用于加强热界面
公开(公告)号：US20070141378A1
公开(公告)日：2007-06-21
申请号：US11314701
申请日：2005-12-21
申请人： Jairo Pacheco , Roger Schmidt , Prabjit Singh
发明人： Jairo Pacheco , Roger Schmidt , Prabjit Singh
IPC分类号： B21C37/00
CPC分类号： H01L23/3733 , F28F13/00 , F28F2013/006 , H01L23/42 , H01L2924/0002 , Y10T428/12438 , H01L2924/00
摘要： A method and associated apparatus for providing an enhanced thermal interface. The interface is formed by application of a structure or foil embedded in an alloy in solid form between two surfaces. Once heat is applied from one or both surfaces, the alloy melts forming the desired interface.
摘要翻译：一种用于提供增强的热界面的方法和相关联的装置。该界面通过以两个表面之间的固体形式嵌入合金中的结构或箔形成。一旦从一个或两个表面施加热量，则合金熔化形成所需的界面。

58. 发明申请

US20050199371A1 Heat sink and method of making the same 失效
标题翻译：散热器和制作方法
公开(公告)号：US20050199371A1
公开(公告)日：2005-09-15
申请号：US10800564
申请日：2004-03-15
申请人： Randall Kemink , Prabjit Singh
发明人： Randall Kemink , Prabjit Singh
IPC分类号： H05K7/20
CPC分类号： F28F21/085 , B23K1/0012 , B23K1/19 , B23K2101/08 , F28F3/02 , F28F2275/06 , H01L21/4882 , H01L23/3672 , H01L2924/0002 , Y10T29/4935 , Y10T29/49373 , Y10T29/4938 , Y10T29/49393 , H01L2924/00
摘要： A method for manufacturing a heat sink including heating a metal base to melt solder in grooves formed in the base. The base has a first coefficient of thermal expansion. The solder has a second coefficient of thermal expansion lower than the first coefficient of thermal expansion. The metal base and the solder are cooled and the metal base experiences tensile stresses and the solder experiences compressive stresses to form a concavity in a thermal face of the base. The thermal face is then planed. Over time, the tensile stresses and the compressive stresses reduce such that the thermal face becomes convex.
摘要翻译：一种用于制造散热器的方法，包括加热金属基底以熔化在基底中形成的凹槽中的焊料。基座具有第一热膨胀系数。焊料具有低于第一热膨胀系数的第二热膨胀系数。金属基体和焊料被冷却，并且金属基体经受拉伸应力，并且焊料经受压应力以在基体的热面中形成凹陷。然后将热面打平。随着时间的推移，拉伸应力和压缩应力减小，使得热面变得凸起。

59. 发明授权

US06192701B1 Sealed multi-chip module cooling system 失效
标题翻译：密封多芯片模块冷却系统
公开(公告)号：US06192701B1
公开(公告)日：2001-02-27
申请号：US09378988
申请日：1999-08-23
申请人： Gary F. Goth , John J. Loparco , Prabjit Singh
发明人： Gary F. Goth , John J. Loparco , Prabjit Singh
IPC分类号： F25D2312
CPC分类号： G06F1/20 , F25D19/006 , H05K7/203
摘要： A cooling system for absorbing thermal energy from an integrated circuit device while preventing the formation of condensation thereon. The cooling system comprises a evaporator unit mounted on an integrated circuit device, housed within an airtight enclosure which is evacuated and then pressurized with dry air.
摘要翻译：一种用于从集成电路装置吸收热能同时防止在其上形成冷凝的冷却系统。冷却系统包括安装在集成电路装置上的蒸发器单元，该蒸发器单元被容纳在气密的外壳内，该空气被抽真空，然后用干燥空气加压。

60. 发明授权

US08662931B2 Delayed contact action connector 失效
标题翻译：延迟接触动作连接器
公开(公告)号：US08662931B2
公开(公告)日：2014-03-04
申请号：US13540522
申请日：2012-07-02
申请人： H. John Healey , Emanuele F. Lopergolo , Prabjit Singh
发明人： H. John Healey , Emanuele F. Lopergolo , Prabjit Singh
IPC分类号： H01R24/00
CPC分类号： H01R12/87 , H01R12/714 , H01R12/721 , H01R12/88 , H01R13/11 , H01R13/7036
摘要： A method for using a connector with terminals for connecting to a circuit card. The connector includes a socket having a casing with an aperture for receiving the circuit card therein and electrically conductive terminals. The terminals include an elongated portion and a substantially L-shaped portion joined together by a U-shaped portion. The elongated portion has a proximal end and a distal end, and includes a support section and a bending section between the proximal end and the distal end. The U-shaped portion is disposed at the distal end of the elongated portion. The terminal continues from the U-shaped portion to approximately halfway towards the proximal end of the elongated portion and turns away from the elongated portion thereby forming the substantially L-shaped portion. The L-shaped portion ends in a lip section curving towards the proximal end of the elongated portion.
摘要翻译：一种使用带端子的连接器连接到电路卡的方法。连接器包括具有壳体的插座，其具有用于在其中接收电路卡的孔和导电端子。端子包括由U形部分连接在一起的细长部分和大致L形部分。细长部分具有近端和远端，并且包括支撑部分和在近端和远端之间的弯曲部分。 U形部分设置在细长部分的远端。端子从U形部分延伸到近似于长形部分的近端的一半并且远离细长部分，从而形成大致L形的部分。 L形部分在朝向细长部分的近端弯曲的唇部中终止。

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