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51. 发明授权

US06582993B1 Method of underfilling semiconductor device 失效
标题翻译：半导体器件底部填充方法
公开(公告)号：US06582993B1
公开(公告)日：2003-06-24
申请号：US09658996
申请日：2000-09-11
申请人： Shunji Baba , Kenji Kobae , Hidehiko Kira , Norio Kainuma
发明人： Shunji Baba , Kenji Kobae , Hidehiko Kira , Norio Kainuma
IPC分类号： H01L2148
CPC分类号： H01L24/29 , H01L21/563 , H01L24/27 , H01L24/743 , H01L24/83 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83192 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01039 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/00
摘要： Prior to setting of a semiconductor device upon the surface of a wiring substrate, the fluid of a light curable reaction resin is supplied from a nozzle to the surface of the wiring substrate. When the predetermined amount of the fluid has been discharged from the nozzle, the fluid within the nozzle is irradiated through a transparent window defined in the nozzle. A hardening reaction is induced in the irradiated segment of the fluid. The reduction in the fluidity can be achieved in the irradiated segment of the fluid. The irradiated segment forms a partition mass in the fluid within the nozzle. A reliable split can thus be achieved between the partition mass and the fluid discharged from the tip end of the nozzle. The split can be utilized to control the supplied amount of the fluid at a higher accuracy.
摘要翻译：在将布线基板的表面上设置半导体装置之前，将光固化反应树脂的流体从喷嘴供给到布线基板的表面。当预定量的流体已经从喷嘴排出时，通过在喷嘴中限定的透明窗口照射喷嘴内的流体。在被照射的流体段中诱发硬化反应。可以在被照射的流体段中实现流动性的降低。照射的片段在喷嘴内的流体中形成分隔物质。因此可以在分隔物质和从喷嘴的尖端排出的流体之间实现可靠的分流。分流可以用于以更高的精度控制流体的供应量。

52. 发明授权

US06291269B1 Semiconductor bare chip, method of manufacturing semiconductor bare chip and mounting structure of semiconductor bare chip 有权
标题翻译：半导体裸芯片，制造半导体裸芯片的方法和半导体裸芯片的安装结构
公开(公告)号：US06291269B1
公开(公告)日：2001-09-18
申请号：US09409896
申请日：1999-10-01
申请人： Hidehiko Kira , Kiyoshi Fukui , Kazuhisa Tsunoi , Shunji Baba
发明人： Hidehiko Kira , Kiyoshi Fukui , Kazuhisa Tsunoi , Shunji Baba
IPC分类号： H01L2144
CPC分类号： H01L24/29 , H01L21/563 , H01L24/11 , H01L24/13 , H01L2224/05624 , H01L2224/11 , H01L2224/1134 , H01L2224/1184 , H01L2224/13 , H01L2224/13144 , H01L2224/16225 , H01L2224/45144 , H01L2224/73203 , H01L2224/73204 , H01L2224/83192 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/00014 , H01L2224/13099 , H01L2924/00
摘要： A semiconductor bare chip includes a plurality of stud bumps provided on the surface of the semiconductor bare chip body, each of the stud bumps including a seat and a head protruding from the seat. A height of the head is less than a thickness of electrodes on said board.
摘要翻译：半导体裸芯片包括设置在半导体裸芯片主体的表面上的多个柱形凸块，每个凸起凸块包括座和从该座突出的头部。头部的高度小于所述板上的电极的厚度。

53. 发明授权

US07486191B2 RFID tag 失效
标题翻译： RFID标签
公开(公告)号：US07486191B2
公开(公告)日：2009-02-03
申请号：US11378623
申请日：2006-03-20
申请人： Naoki Ishikawa , Shunji Baba , Hidehiko Kira , Hiroshi Kobayashi , Takayoshi Matumura
发明人： Naoki Ishikawa , Shunji Baba , Hidehiko Kira , Hiroshi Kobayashi , Takayoshi Matumura
IPC分类号： G08B13/14
CPC分类号： G06K19/07749 , G06K19/077 , G06K19/07728 , H01Q1/2208 , H01Q9/16 , Y10T156/10 , Y10T156/1754
摘要： The present invention relates to an RFID tag performing exchange of information with an external device without contact, and is to improve the resistance to bending while avoiding an increase in the thickness of the RFID tag. A circuit chip is bonded to a base portion of a base with a thermosetting adhesive. The base is folded, and an ultraviolet curing adhesive is applied on the circuit chip. The fold-back portions of the base are folded back onto the circuit chip, to which portions ultraviolet light is irradiated, as a result, both of the surfaces of the circuit chip are bonded to the base with the adhesives.
摘要翻译： RFID标签技术领域本发明涉及RFID标签，其与外部设备进行信息交换而不接触，并且提高耐弯曲性，同时避免RFID标签的厚度增加。电路芯片用热固性粘合剂粘合到基底的基部。折叠底座，并在电路芯片上施加紫外线固化粘合剂。将基座的折回部分折回到电路芯片上，照射部分紫外线，结果，电路芯片的两个表面都用粘合剂粘合到基底上。

54. 发明授权

US07463156B2 RFID tag 有权
标题翻译： RFID标签
公开(公告)号：US07463156B2
公开(公告)日：2008-12-09
申请号：US11584608
申请日：2006-10-23
申请人： Shunji Baba , Wei Jie
发明人： Shunji Baba , Wei Jie
IPC分类号： G08B13/14
CPC分类号： G06K19/077 , G06K19/0773
摘要： A RFID tag includes an inlet in which an antenna for communication and a circuit chip performing radio communication with the antenna are electrically connected to each other. The RFID tag further includes a thermal storage section which encloses the inlet, which is made of a nonmetal, and which prevents thermal diffusion into the inlet and a thermal insulating section which encloses the thermal storage section, which prevents thermal conduction to the thermal storage section, and which has higher thermal diffusivity than thermal diffusivity of the thermal storage section and lower thermal conductivity than thermal conductivity of the thermal storage section.
摘要翻译： RFID标签包括用于通信的天线和与天线进行无线电通信的电路芯片彼此电连接的入口。 RFID标签进一步包括一个热存储部分，该热存储部分包围由非金属制成的入口，并且防止热扩散到入口中;隔热部分包围热储存部分，该隔热部分防止热存储部分并且具有比热储存部分的热扩散率更高的热扩散率和比热存储部分的热导率低的热导率。

55. 发明授权

US07436062B2 Semiconductor chip element, semiconductor chip element mounting structure, semiconductor chip element mounting device and mounting method 失效
标题翻译：半导体芯片元件，半导体芯片元件安装结构，半导体芯片元件安装装置及安装方法
公开(公告)号：US07436062B2
公开(公告)日：2008-10-14
申请号：US10223454
申请日：2002-08-20
申请人： Norio Kainuma , Shunji Baba , Hidehiko Kira , Toru Okada
发明人： Norio Kainuma , Shunji Baba , Hidehiko Kira , Toru Okada
IPC分类号： H01L23/48 , H01L23/04
CPC分类号： H01L24/28 , H01L21/563 , H01L24/13 , H01L24/14 , H01L24/75 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/13082 , H01L2224/13144 , H01L2224/14505 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/73203 , H01L2224/73204 , H01L2224/81121 , H01L2224/81191 , H01L2224/81205 , H01L2224/83102 , H01L2224/92125 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/351 , H01L2224/13099 , H01L2924/00 , H01L2924/00012 , H01L2224/05624 , H01L2924/00014 , H01L2224/05664
摘要： An apparatus and method for improving the underfill filling of a semiconductor chip element 100 which is ultrasonically bonded to and mounted on a circuit board. A semiconductor chip element 100 includes a silicon chip 101 and a group of stud bumps 117 formed on a bottom surface 101a of the chip 101. Signal stud bumps 113 are made of gold while power stud bumps 114, ground stud bumps 115 and dummy stud bumps 116 are all made of a gold-palladium alloy, which are harder than the signal stud bumps 113 and thus do not deform easily during ultrasonic treatment. Therefore, in a state in which the semiconductor chip element 100 is mounted, a gap of approximately 30 μm is maintained between the bottom surface 101a of the chip 100 and a top surface of the circuit board 120 on which the semiconductor chip element 100 is mounted.
摘要翻译：一种用于改善超声波接合并安装在电路板上的半导体芯片元件100的底部填充填充的装置和方法。半导体芯片元件100包括硅芯片101和形成在芯片101的底表面101a上的一组柱形突起117。信号柱凸起113由金制成，而电源凸块114，接地柱形凸块115和虚拟凸块凸块116都由金 - 钯合金制成，其比信号柱凸块113更硬，因此在超声波期间不容易变形治疗。因此，在安装半导体芯片元件100的状态下，在芯片100的底面101a与半导体芯片元件100的电路基板120的上表面之间保持约30μm的间隙安装。

56. 发明授权

US07317395B2 RFID tag and method of manufacturing the same 失效
标题翻译： RFID标签及其制造方法
公开(公告)号：US07317395B2
公开(公告)日：2008-01-08
申请号：US11091935
申请日：2005-03-29
申请人： Naoki Ishikawa , Shunji Baba , Hidehiko Kira , Hiroshi Kobayashi
发明人： Naoki Ishikawa , Shunji Baba , Hidehiko Kira , Hiroshi Kobayashi
IPC分类号： G08B13/14
CPC分类号： H01L23/13 , G06K19/07749 , G06K19/0775 , H01L23/49855 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2223/6677 , H01L2224/0401 , H01L2224/05557 , H01L2224/10165 , H01L2224/1134 , H01L2224/13016 , H01L2224/13019 , H01L2224/131 , H01L2224/16238 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/81136 , H01L2224/8114 , H01L2224/81801 , H01L2224/81903 , H01L2224/83192 , H01L2224/838 , H01L2224/83851 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01Q1/2208 , H01Q1/36 , H01Q7/00 , Y10T29/49018 , H01L2924/00014 , H01L2224/13099 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： The present invention provides a radio frequency identification (RFID) tag which exchanges information with an external device in a noncontact manner, in which a paste is used as a material for an antenna, and which is designed to avoid the problem due to swelling of the paste caused by a pressing force from bumps of an IC chip. A paste escape recess is provided in which part of the paste provided to form the antenna is caused to flow therein by the pressure received from the bumps when the IC chip with the bumps is connected to the antenna.
摘要翻译：本发明提供了一种射频识别（RFID）标签，其以非接触方式与外部设备交换信息，其中使用糊料作为天线的材料，并且被设计为避免由于由IC芯片的凸块的压力引起的糊状物。提供了一种糊状逃逸凹部，其中当具有凸起的IC芯片连接到天线时，通过从凸起接收的压力使得设置成形成天线的浆料的一部分流入其中。

57. 发明授权

US07288722B2 Packaging structure and packaging method of electronic components 有权
标题翻译：电子元件的包装结构和包装方法
公开(公告)号：US07288722B2
公开(公告)日：2007-10-30
申请号：US11049901
申请日：2005-02-04
申请人： Shunji Baba
发明人： Shunji Baba
IPC分类号： H05K1/00 , H05K3/30 , H01R12/04 , H05K1/11
CPC分类号： H05K1/189 , H05K2201/055 , H05K2201/096 , Y10T29/49135
摘要： An electronic part mounting structure includes a printed circuit board, a plurality of electronic parts mounted on the printed circuit board, a folded portion of the printed circuit board bent and layered between the electronic parts, through holes formed in both sides of the folded portion, and a wiring connecting the electronic parts via the through holes and connecting the electronic parts to the through holes.
摘要翻译：电子部件安装结构包括印刷电路板，安装在印刷电路板上的多个电子部件，弯曲并分层在电子部件之间的印刷电路板的折叠部分，形成在折叠部分两侧的通孔，以及经由通孔连接电子部件并将电子部件连接到通孔的布线。

58. 发明授权

US07277017B2 RFID tag 失效
标题翻译： RFID标签
公开(公告)号：US07277017B2
公开(公告)日：2007-10-02
申请号：US11232035
申请日：2005-09-22
申请人： Shunji Baba , Toru Maniwa , Takashi Yamagajo , Manabu Kai
发明人： Shunji Baba , Toru Maniwa , Takashi Yamagajo , Manabu Kai
IPC分类号： G08B13/14
CPC分类号： G06K19/0775 , G06K19/073 , G06K19/07381 , G06K19/0739 , G06K19/07749 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2924/01004
摘要： The present invention relates to an RFID tag and is provided with a function of detecting peeling while maintaining a good antenna characteristic. A first conductive pattern includes two extending sections extending from an IC chip, each end of which is connected to the IC chip, and a correction pattern for antenna characteristic correction which bypasses the IC chip and connects the two extending sections, and a peeling detection pattern is formed in an area enclosed by the two extending sections and the correction pattern.
摘要翻译： RFID标签技术领域本发明涉及一种RFID标签，具有检测剥离的功能，同时保持良好的天线特性。第一导电图案包括从IC芯片延伸的两个延伸部分，每个IC芯片的每个端部连接到IC芯片，以及用于天线特性校正的校正图案，其绕过IC芯片并连接两个延伸部分，以及剥离检测图案形成在由两个延伸部分和校正图案包围的区域中。

59. 发明申请

US20070020800A1 IC chip mounting method 有权
公开(公告)号：US20070020800A1
公开(公告)日：2007-01-25
申请号：US11319652
申请日：2005-12-29
申请人： Naoki Ishikawa , Shunji Baba , Hidehiko Kira , Hiroshi Kobayashi , Shunichi Kikuchi , Tatsuro Tsuneno
发明人： Naoki Ishikawa , Shunji Baba , Hidehiko Kira , Hiroshi Kobayashi , Shunichi Kikuchi , Tatsuro Tsuneno
IPC分类号： H01L21/00
CPC分类号： G06K19/07749 , H01L21/67132 , H01L21/67144 , H01L21/6835 , H01L21/6836 , H01L24/75 , H01L24/81 , H01L24/97 , H01L2221/68327 , H01L2221/68354 , H01L2223/6677 , H01L2224/16 , H01L2224/73204 , H01L2224/75 , H01L2224/75252 , H01L2224/75314 , H01L2224/7565 , H01L2224/75745 , H01L2224/7598 , H01L2224/81001 , H01L2224/81005 , H01L2224/81121 , H01L2224/81203 , H01L2224/81801 , H01L2224/81907 , H01L2224/83192 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2224/81
摘要： An IC chip mounting method which mounts two or more IC chips on a base, includes: preparing a wafer by mounting a tape on a face thereof, which is the reverse of the wafer having a mounting surface to be attached to the base, and by dividing the wafer into IC chips by dicing while leaving the tape; positioning the wafer to face the base in such a direction that the mounting surface to be attached to the base faces the base; sequentially pressing the IC chips on the wafer against the base and temporarily fixing the IC chips while the base is being fed in a prescribed one-dimensional direction along the wafer and while the wafer is being moved two-dimensionally along the base; and fixing the IC chips temporarily fixed on the base on the base by heating and pressurizing in a batch manner.

60. 发明申请

US20060244600A1 RFID tag 审中-公开
公开(公告)号：US20060244600A1
公开(公告)日：2006-11-02
申请号：US11454848
申请日：2006-06-19
申请人： Shunji Baba
发明人： Shunji Baba
IPC分类号： G08B13/14
CPC分类号： G06K19/07749 , G06K19/0775 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2924/01055 , H01L2924/3011 , H01Q1/2225 , Y10T29/49016 , Y10T29/49018
摘要： An RFID tag, including: a base; an antenna pattern that is provided on the base to form a communication antenna and has a tapered connection end portion which provides a connection terminal to the antenna; an electric conductor that is attached onto the connection end portion of the antenna pattern and is smaller than the connection end portion; and a circuit chip that is electrically connected to the antenna pattern via the electric conductor and performs radio communication by use of the antenna.

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