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    • 52. 发明授权
    • Current-aware floorplanning to overcome current delivery limitations in integrated circuits
    • 电流识别布局规划,以克服集成电路中的当前传输限制
    • US08863068B2
    • 2014-10-14
    • US13526194
    • 2012-06-18
    • Pradip BoseAlper BuyuktosunogluJohn A. DarringerMoinuddin K. QureshiJeonghee Shin
    • Pradip BoseAlper BuyuktosunogluJohn A. DarringerMoinuddin K. QureshiJeonghee Shin
    • G06F17/50
    • G06F17/5072G06F17/50G06F2217/78
    • A dynamic system coupled with “pre-Silicon” design methodologies and “post-Silicon” current optimizing programming methodologies to improve and optimize current delivery into a chip, which is limited by the physical properties of the connections (e.g., Controlled Collapse Chip Connection or C4s). The mechanism consists of measuring or estimating power consumption at a certain granularity within a chip, converting the power information into C4 current information using a method, and triggering throttling mechanisms (including token based throttling) where applicable to limit the current delivery per C4 beyond pre-established limits or periods. Design aids are used to allocate C4s throughout the chip based on the current delivery requirements. The system coupled with design and programming methodologies improve and optimize current delivery is extendable to connections across layers in a multilayer 3D chip stack.
    • 与“前置硅”设计方法和“后硅”当前优化编程方法相结合的动态系统,以改进和优化当前传输到芯片的传输,这受到连接的物理特性的限制(例如,受控崩溃芯片连接或 C4s)。 该机制包括测量或估计芯片内特定粒度的功耗,使用一种方法将功率信息转换为C4当前信息,并在适用的情况下触发限流机制(包括基于令牌的限制),以限制每个C4超过预先的当前传输 - 建立的限制或期限。 设计辅助工具用于根据当前交付要求在整个芯片上分配C4。 该系统与设计和编程方法相结合,改进并优化电流传递可扩展到多层3D芯片堆叠中的层间连接。