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51. 发明申请

US20070201208A1 Active cooling methods and apparatus for modules 失效
公开(公告)号：US20070201208A1
公开(公告)日：2007-08-30
申请号：US11364489
申请日：2006-02-27
申请人： Paul Goodwin , James Wehrly
发明人： Paul Goodwin , James Wehrly
IPC分类号： H05K7/20
CPC分类号： G11C5/00 , G06F1/20 , G11C5/143 , H01L23/427 , H01L23/473 , H01L2224/16 , H01L2224/73253
摘要： A circuit module that includes a system for reducing thermal variation and cooling the circuit module. In preferred embodiments, the module includes a thermally-conductive rigid substrate having first and second lateral sides, an edge, and an integrated cooling component. The integrated cooling component reduces thermal variation and cools the circuit module. Flex circuitry populated with a plurality of ICs and exhibiting a connective facility that comprises plural contacts for use with an edge connector is wrapped about the edge of the thermally-conductive substrate. Heat from the plurality of ICs is thermally-conducted by the thermally-conductive substrate to the integrated cooling component.

52. 发明申请

US20070111606A1 Buffered Thin Module System and Method 审中-公开
标题翻译：缓冲薄模块系统和方法
公开(公告)号：US20070111606A1
公开(公告)日：2007-05-17
申请号：US11564199
申请日：2006-11-28
申请人： Paul Goodwin
发明人： Paul Goodwin
IPC分类号： H01R24/00
CPC分类号： G11C5/04 , H01L23/34 , H01L23/36 , H01L25/0652 , H01L25/105 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H05K1/0203 , H05K1/118 , H05K1/181 , H05K1/189 , H05K3/0061 , H05K2201/056 , H05K2201/1056 , H05K2201/10734 , H05K2201/2018 , H05K2203/1572 , H01L2224/0401
摘要： Multiple fully buffered DIMM circuits or instantiations are presented in a single module. In a preferred embodiment, memory integrated circuits (preferably CSPs) and accompanying AMBs are arranged in two ranks in two fields on each side of a flexible circuit. The flexible circuit has expansion contacts disposed along one side. The flexible circuit is disposed about a supporting substrate or board to place one complete FB-DIMM circuit or instantiation on each side of the constructed module. In alternative but also preferred embodiments, the ICs on the side of the flexible circuit closest to the substrate are disposed, at least partially, in what are, in a preferred embodiment, windows, pockets, or cutaway areas in the substrate. Other embodiments may only populate one side of the flexible circuit or may only remove enough substrate material to reduce but not eliminate the entire substrate contribution to overall profile. The flexible circuit may exhibit one or two or more conductive layers, and may have changes in the layered structure or have split layers. Other embodiments may stagger or offset the ICs or include greater numbers of ICs.
摘要翻译：多个完全缓冲的DIMM电路或实例被呈现在单个模块中。在优选实施例中，存储器集成电路（优选CSP）和伴随的AMB被布置在柔性电路的每一侧的两个场中的两个等级中。柔性电路具有沿着一侧设置的扩展触点。柔性电路围绕支撑衬底或板设置，以在构造的模块的每一侧上放置一个完整的FB-DIMM电路或实例化。在替代但也是优选实施例中，最靠近基板的柔性电路侧的IC至少部分地设置在优选实施例中在基板中的窗口，凹部或切口区域中。其他实施例可以仅填充柔性电路的一侧，或者可以仅移除足够的衬底材料以减少但不消除整个衬底对整体轮廓的贡献。柔性电路可以表现出一个或两个或更多个导电层，并且可以具有分层结构的变化或具有分裂层。其他实施例可能错开或偏移IC或包括更多数量的IC。

53. 发明申请

US20060198238A1 Modified core for circuit module system and method 有权
标题翻译：电路模块系统和方法的改进核心
公开(公告)号：US20060198238A1
公开(公告)日：2006-09-07
申请号：US11397597
申请日：2006-04-03
申请人： Julian Partridge , David Roper , Paul Goodwin
发明人： Julian Partridge , David Roper , Paul Goodwin
IPC分类号： G11C8/18
CPC分类号： H05K1/189 , H05K1/0203 , H05K1/11 , H05K1/181 , H05K3/0061 , H05K2201/056 , H05K2201/09445 , H05K2201/10159 , H05K2201/1056 , H05K2201/10734 , H05K2203/1572
摘要： Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of its major sides. The populated flexible circuitry is disposed proximal to a rigid substrate to place the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The rigid substrate exhibits adhesion features that allow more advantageous use of thermoplastic adhesives with concomitant rework advantages and while providing flexibility in meeting dimensional specifications such as those promulgated by JEDEC, for example.
摘要翻译：灵活的电路填充有沿其主要一侧或两侧设置的集成电路（IC）。填充的柔性电路设置在刚性衬底附近，以将集成电路放置在衬底的一侧或两侧上，在衬底的一侧或两侧上具有一层或两层集成电路。刚性基材表现出粘合特征，其允许更有利地使用具有伴随返工优点的热塑性粘合剂，并且同时提供满足例如由JEDEC公布的尺寸规格的柔性。

54. 发明申请

US20060125067A1 Flex circuit constructions for high capacity circuit module systems and methods 有权
公开(公告)号：US20060125067A1
公开(公告)日：2006-06-15
申请号：US11331969
申请日：2006-01-13
申请人： James Wehrly , Paul Goodwin , Russell Rapport
发明人： James Wehrly , Paul Goodwin , Russell Rapport
IPC分类号： H01L23/02
CPC分类号： H05K1/189 , H05K1/0203 , H05K1/11 , H05K1/181 , H05K3/0061 , H05K2201/056 , H05K2201/09445 , H05K2201/10159 , H05K2201/1056 , H05K2201/10734 , H05K2203/1572
摘要： Provided circuit modules employ flexible circuitry populated with integrated circuitry (ICs). The flex circuitry is disposed about a rigid substrate. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. A strain relief portion of the flex circuitry has preferably fewer layers than the portion of the flex circuitry along which the integrated circuitry is disposed and may further may exhibit more flexibility than the portion of the flex circuit populated with integrated circuitry. The substrate form is preferably devised from thermally conductive materials.

55. 发明申请

US20060072297A1 Circuit Module Access System and Method 审中-公开
标题翻译：电路模块接入系统及方法
公开(公告)号：US20060072297A1
公开(公告)日：2006-04-06
申请号：US10956442
申请日：2004-10-01
申请人： Paul Goodwin
发明人： Paul Goodwin
IPC分类号： H05K1/14
CPC分类号： H05K1/189 , H05K1/141 , H05K2201/10189 , H05K2201/10734
摘要： Abstract of the DisclosureOne or more connectors are mounted to a module having one or more integrated circuits. In one embodiment, multiple ICs are stacked and interconnected to form a high-density module. The connectors are preferably mounted above the top IC of the module, but may be mounted at other locations. Electrical or fiber-optic cables may be plugged into the connectors. Other devices may be plugged into the connectors. Other embodiments may have one or more connectors mounted to flexible circuitry. Schemes are disclosed to employ various embodiments for test or operational signaling purposes.
摘要翻译：公开摘要将一个或多个连接器安装到具有一个或多个集成电路的模块。在一个实施例中，多个IC被堆叠并互连以形成高密度模块。连接器优选地安装在模块的顶部IC上方，但是可以安装在其他位置。电缆或光纤电缆可能插入连接器中。其他设备可能插入到连接器中。其他实施例可以具有安装到柔性电路的一个或多个连接器。公开了采用用于测试或操作信令目的的各种实施例的方案。

56. 发明公开

US20240242173A1 Method and Apparatus for a Cloud Connected IOT Wine Storage system 审中-公开
公开(公告)号：US20240242173A1
公开(公告)日：2024-07-18
申请号：US18154944
申请日：2023-01-16
申请人： Paul Goodwin
发明人： Paul Goodwin
IPC分类号： G06Q10/087 , H04W4/35 , H04W4/38
CPC分类号： G06Q10/087 , H04W4/35 , H04W4/38 , H04W88/04
摘要： Sensor modules referred to herein as “buds”, are connected by wireline or wirelessly to a controller referred to herein as a “root” in what is referred to herein as a vine to provide inventory control information for a wine storage facility. Buds sense when objects are moved into or out of sensing range of a proximity sensor and, in alternative embodiments, may also track or control other quantities of interest, like the local temperature, humidity, or VOCs. A root may broadcast a message to all buds, or send a message to an individual bud, while buds return messages back to the root. Scaling of the system is accomplished through the use of roots as repeaters or targets. In a preferred embodiment, the vine originates at the root and each bud has at least two downstream facing ports, which dispatch messages along paths referred to here as “primary” and “divergent”.

57. 发明申请

US20110309231A1 SYSTEM AND METHOD FOR CONTINUOUS, ASYNCHRONOUS AUTOFOCUS OF OPTICAL INSTRUMENTS USING MULTIPLE CALIBRATION CURVES 有权
标题翻译：使用多个校准曲线的连续光学仪器的异步自适应系统和方法
公开(公告)号：US20110309231A1
公开(公告)日：2011-12-22
申请号：US13221710
申请日：2011-08-30
申请人： Jeremy Cooper , Paul Goodwin
发明人： Jeremy Cooper , Paul Goodwin
IPC分类号： G02B27/40
CPC分类号： G02B21/16 , G02B21/245
摘要： The current application is directed to autofocus subsystems within optical instruments that continuously monitor the focus of the optical instruments and adjust distances within the optical instrument along the optical axis in order to maintain a precise and stable optical-instrument focus at a particular point or surface on, within, or near a sample. Certain autofocus implementations operate asynchronously with respect to operation of other components and subsystems of the optical instrument in which they are embedded. The described autofocus subsystems employ multiple calibration curves to precisely adjust the z-position of an optical instrument.
摘要翻译：目前的应用是针对光学仪器内的自动对焦子系统，其连续地监视光学仪器的焦点并且沿着光轴调整光学仪器内的距离，以便在特定点或表面上保持精确和稳定的光学仪器焦点，在样本内或附近。某些自动对焦实现方式相对于嵌入其中的光学仪器的其他组件和子系统的操作而异步操作。所描述的自动对焦子系统使用多个校准曲线来精确地调整光学仪器的z位置。

58. 发明授权

US07606049B2 Module thermal management system and method 有权
标题翻译：模块热管理系统及方法
公开(公告)号：US07606049B2
公开(公告)日：2009-10-20
申请号：US11125018
申请日：2005-05-09
申请人： Paul Goodwin , James W. Cady
发明人： Paul Goodwin , James W. Cady
IPC分类号： H05K7/00
CPC分类号： G11C5/00 , G06F1/184 , G06F1/185 , G06F1/186 , G06F1/20 , G11C5/143 , H01L23/367 , H01L25/105 , H01L2225/107 , H01L2225/1094 , H01L2924/0002 , H05K1/0203 , H05K1/118 , H05K1/181 , H05K1/189 , H05K3/0061 , H05K2201/056 , H05K2201/1056 , H05K2201/10734 , H05K2203/1572 , H01L2924/00
摘要： A circuit module shunts thermal energy into a chassis component or a part of the box of the computing application in which the module is employed. In one preferred mode, a flex circuit is populated along each of its first and second major sides with two ranks of ICs which are, preferably, array type (CSP) devices. Insertion contacts are disposed in two sets on the first side of the flex circuit typically between the two ranks of ICs along the first side of the IC. A substrate with first and second lateral sides provides a form for the module. That substrate is preferably comprised of metallic material and exhibits an edge about which the flex circuit is wrapped and an extension at the other extremity of the substrate that is thermally connected to a chassis component of the application, either directly or, preferably, through a thermal conduit such as a thermally conductive compliant material.
摘要翻译：电路模块将热能分流到使用模块的计算应用的机箱组件或一部分盒子中。在一个优选的模式中，柔性电路沿其每个第一和第二主要侧面都具有两个等级的IC，最好是阵列型（CSP）装置。插入触点通常沿着IC的第一侧在两个IC级之间在柔性电路的第一侧上设置成两组。具有第一和第二侧面的基底提供了用于模块的形式。该基底优选由金属材料构成，并且表现出边缘，柔性电路围绕该边缘被包裹，并且在基底的另一端延伸，其与基底部件热连接，直接或优选通过热导管，例如导热柔性材料。

59. 发明授权

US07606040B2 Memory module system and method 有权
标题翻译：内存模块系统和方法
公开(公告)号：US07606040B2
公开(公告)日：2009-10-20
申请号：US11077952
申请日：2005-03-11
申请人： Paul Goodwin
发明人： Paul Goodwin
IPC分类号： H05K7/02
CPC分类号： G11C5/04 , H05K1/189 , H05K3/0061 , H05K2201/056 , H05K2201/09081 , H05K2201/09445 , H05K2203/1572
摘要： Memory module flex circuitry is devised to accommodate packaged integrated circuit devices (ICs) of varying heights or thicknesses. The invention may be employed to advantage in a variety of modules that employ flex circuitry including, but not limited to, fully-buffered, registered or more simple memory modules. Many such modules may replace conventionally-constructed DIMMs without change to the system in which the module is employed. Regions of the flex circuitry devised to provide one or more mounting locales for ICs are delineated, in part, from the main body of the flex circuit. The delineation may be implemented in a preferred embodiment by separating a designated IC mounting area or peninsula from the main body of the flex circuitry either with isolating areas or separations or with tabs that extend from the primary perimeter of the flex circuitry.
摘要翻译：存储器模块柔性电路被设计为适应不同高度或厚度的封装集成电路器件（IC）。本发明可以用于采用柔性电路的各种模块，包括但不限于完全缓冲的，注册的或更简单的存储器模块。许多这样的模块可以替代传统构造的DIMM而不改变使用模块的系统。设计用于为IC提供一个或多个安装区域的柔性电路的区域部分地从柔性电路的主体描绘。描述可以在优选实施例中通过从柔性电路的主体分离指定的IC安装区域或半岛，或者具有隔离区域或间隔，或者与柔性电路的主周边延伸的突出部分分离。

60. 发明授权

US07443023B2 High capacity thin module system 有权
标题翻译：大容量薄模块系统
公开(公告)号：US07443023B2
公开(公告)日：2008-10-28
申请号：US11231418
申请日：2005-09-21
申请人： James Douglas Wehrly, Jr. , James Wilder , Paul Goodwin , Mark Wolfe
发明人： James Douglas Wehrly, Jr. , James Wilder , Paul Goodwin , Mark Wolfe
IPC分类号： H01L23/34 , H01L21/00 , H05K7/20
CPC分类号： H05K1/189 , H05K1/0203 , H05K1/11 , H05K1/181 , H05K3/0061 , H05K2201/056 , H05K2201/09445 , H05K2201/10159 , H05K2201/1056 , H05K2201/10734 , H05K2203/1572
摘要： Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.
摘要翻译：灵活的电路填充有沿其主要侧面或其两侧设置的集成电路。沿柔性电路分布的触点提供模块与应用环境之间的连接。电路填充的柔性电路围绕刚性衬底的边缘设置，从而将集成电路放置在衬底的一侧或两侧，在衬底的一侧或两侧上具有一层或两层集成电路。衬底形式优选地由导热材料设计，并且当柔性电路绕在衬底上时，包括设置在较高热能器件（例如AMB）附近的高导热性芯或区域。其他变型包括将模块的相对侧上的相应IC夹持的导热夹子，以进一步从IC分流热量。来自衬底主体或衬底芯的优选延伸部件促进模块集成电路之间的热变化减小。

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