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51. 发明申请

US20090024067A1 WOUND DRESSING AND APPARATUS FOR FORMING SAME 审中-公开
标题翻译：用于形成相同的连接器和装置
公开(公告)号：US20090024067A1
公开(公告)日：2009-01-22
申请号：US12198604
申请日：2008-08-26
申请人： Oleg Siniaguine
发明人： Oleg Siniaguine
IPC分类号： A61F13/15 , B05C5/00 , A61F13/02
CPC分类号： A61F13/022 , A61F13/00995 , A61F13/023 , A61F13/0289 , A61F15/001 , A61F15/02 , A61F2013/00255 , A61F2013/00727 , A61F2013/00863
摘要： A multi-layered wound dressing includes a moisture-retaining portion for enhancing the healing of a wound. The wound dressing includes an intermediate layer that has both water soluble and water insoluble fibers. An apparatus that includes a cutting tool and a reservoir of liquid to pre-moisten a portion of the dressing may be used to manufacture the dressings.
摘要翻译：多层伤口敷料包括用于增强伤口愈合的保湿部分。伤口敷料包括具有水溶性和水不溶性纤维两者的中间层。包括切割工具和用于预润湿敷料的一部分的液体储存器的装置可用于制造敷料。

52. 发明申请

US20070069377A1 CLOCK DISTRIBUTION NETWORKS AND CONDUCTIVE LINES IN SEMICONDUCTOR INTEGRATED CIRCUITS 审中-公开
标题翻译：半导体集成电路中的时钟分配网络和导线
公开(公告)号：US20070069377A1
公开(公告)日：2007-03-29
申请号：US11559805
申请日：2006-11-14
申请人： Oleg Siniaguine
发明人： Oleg Siniaguine
IPC分类号： H01L23/48
CPC分类号： H01L21/563 , G06F1/10 , H01L21/561 , H01L21/568 , H01L23/3121 , H01L23/3128 , H01L23/481 , H01L23/49833 , H01L23/528 , H01L23/5283 , H01L24/97 , H01L2224/05001 , H01L2224/05008 , H01L2224/05009 , H01L2224/05023 , H01L2224/05024 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/73203 , H01L2924/01019 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/3011 , H01L2924/3025 , H01L2924/00
摘要： A clock distribution network (110) is formed on a semiconductor interposer (320) which is a semiconductor integrated circuit. An input terminal (120) of the clock distribution network is formed on one side of the interposer, and output terminals (130) of the clock distribution network are formed on the opposite side of the interposer. The interposer has a through hole (360), and the clock distribution network includes a conductive feature going through the through hole. The side of the interposer which has the output terminals (130) is bonded to a second integrated circuit (310) containing circuitry clocked by the clock distribution network. The other side of the interposer is bonded to a third integrated circuit or a wiring substrate (330). The interposer contains a ground structure, or ground structures (390, 510), that shield circuitry from the clock distribution network. Conductive lines (150) in an integrated circuit are formed in trenches (610) in a semiconductor substrate.
摘要翻译：时钟分配网络（110）形成在作为半导体集成电路的半导体插入器（320）上。时钟分配网络的输入端子（120）形成在插入器的一侧上，时钟分配网络的输出端子（130）形成在插入器的相对侧。插入器具有通孔（360），并且时钟分配网络包括穿过通孔的导电特征。具有输出端子（130）的插入器侧被接合到包含由时钟分配网络计时的电路的第二集成电路（310）。插入器的另一侧被结合到第三集成电路或布线基板（330）。插入器包含一个接地结构，或者将电路从时钟分配网络屏蔽的接地结构（390,510）。集成电路中的导电线（150）形成在半导体衬底中的沟槽（610）中。

53. 发明授权

US07173327B2 Clock distribution networks and conductive lines in semiconductor integrated circuits 有权
标题翻译：半导体集成电路中的时钟分配网络和导线
公开(公告)号：US07173327B2
公开(公告)日：2007-02-06
申请号：US11131711
申请日：2005-05-18
申请人： Oleg Siniaguine
发明人： Oleg Siniaguine
IPC分类号： H01L27/10
CPC分类号： H01L21/563 , G06F1/10 , H01L21/561 , H01L21/568 , H01L23/3121 , H01L23/3128 , H01L23/481 , H01L23/49833 , H01L23/528 , H01L23/5283 , H01L24/97 , H01L2224/05001 , H01L2224/05008 , H01L2224/05009 , H01L2224/05023 , H01L2224/05024 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/73203 , H01L2924/01019 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/3011 , H01L2924/3025 , H01L2924/00
摘要： A clock distribution network (110) is formed on a semiconductor interposer (320) which is a semiconductor integrated circuit. An input terminal (120) of the clock distribution network is formed on one side of the interposer, and output terminals (130) of the clock distribution network are formed on the opposite side of the interposer. The interposer has a through hole (360), and the clock distribution network includes a conductive feature going through the through hole. The side of the interposer which has the output terminals (130) is bonded to a second integrated circuit (310) containing circuitry clocked by the clock distribution network. The other side of the interposer is bonded to a third integrated circuit or a wiring substrate (330). The interposer contains a ground structure, or ground structures (390, 510), that shield circuitry from the clock distribution network. Conductive lines (150) in an integrated circuit are formed in trenches (610) in a semiconductor substrate.
摘要翻译：时钟分配网络（110）形成在作为半导体集成电路的半导体插入器（320）上。时钟分配网络的输入端子（120）形成在插入器的一侧上，时钟分配网络的输出端子（130）形成在插入器的相对侧。插入器具有通孔（360），并且时钟分配网络包括穿过通孔的导电特征。具有输出端子（130）的插入器侧被接合到包含由时钟分配网络计时的电路的第二集成电路（310）。插入器的另一侧被结合到第三集成电路或布线基板（330）。插入器包含一个接地结构，或者将电路从时钟分配网络屏蔽的接地结构（390,510）。集成电路中的导电线（150）形成在半导体衬底中的沟槽（610）中。

54. 发明授权

US06717254B2 Devices having substrates with opening passing through the substrates and conductors in the openings, and methods of manufacture 有权
标题翻译：具有通过基板的开口的基板和开口中的导体的装置以及制造方法
公开(公告)号：US06717254B2
公开(公告)日：2004-04-06
申请号：US09791977
申请日：2001-02-22
申请人： Oleg Siniaguine
发明人： Oleg Siniaguine
IPC分类号： H01L2348
CPC分类号： B81C1/00301 , B81B2207/097 , B81C2203/0118 , H01L21/4853 , H01L21/486 , H01L23/481 , H01L24/48 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/85399 , H01L2924/00014 , H01L2924/01322 , H01L2924/14 , H01L2924/16152 , Y10S438/977 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： In some embodiments, a fabrication method comprises: forming a structure that has one or more substrates, wherein the one or more substrates are either a single substrate or a plurality of substrates bonded together, wherein the structure comprises a non-electronically-functioning component which includes at least a portion of the one or more substrates and/or is attached to the one or more substrates; wherein the one or more substrates include a first substrate which has: a first side, an opening in the first side, and a conductor in the opening; wherein the method comprises removing material from the structure so that the conductor becomes exposed on a second side of the first substrate. In some embodiments, the second side is a backside of the first substrate, and the exposed conductor provides backside contact pads. In some embodiments, the fabrication method comprises: forming a structure comprising a first substrate which has: a first side, an opening in the first side, and a conductor in the opening; removing material from the structure so that the conductor becomes exposed on a second side of the first substrate; wherein removing of the material comprises removing the material from a first portion of the second side of the first substrate to cause the first portion to be recessed relative to a second portion of the second side of the first substrate.
摘要翻译：在一些实施例中，一种制造方法包括：形成具有一个或多个基底的结构，其中所述一个或多个基底是单个基底或多个结合在一起的基底，其中所述结构包括非电子功能组分，包括所述一个或多个基底的至少一部分和/或附接到所述一个或多个基底; 其中所述一个或多个基板包括第一基板，所述第一基板具有：第一侧，所述第一侧中的开口和所述开口中的导体; 其中所述方法包括从所述结构中去除材料，使得所述导体在所述第一基板的第二侧上露出。在一些实施例中，第二侧是第一衬底的背面，并且暴露的导体提供背面接触垫。在一些实施例中，制造方法包括：形成包括第一基板的结构，该第一基板具有：第一侧，第一侧中的开口和开口中的导体; 从所述结构中去除材料，使得所述导体在所述第一基板的第二侧上露出; 其中所述材料的去除包括从所述第一基板的第二侧的第一部分移除所述材料，以使所述第一部分相对于所述第一基板的第二侧的第二部分凹陷。

55. 发明授权

US06627039B1 Plasma processing methods and apparatus 有权
公开(公告)号：US06627039B1
公开(公告)日：2003-09-30
申请号：US09542519
申请日：2000-04-03
申请人： Oleg Siniaguine
发明人： Oleg Siniaguine
IPC分类号： C23F100
CPC分类号： H01L21/67017 , C23C16/4584 , C23C16/513 , C23C16/54 , H01J37/32743 , H01J37/32788 , H01J2237/20228 , H01J2237/31701 , H01L21/67745 , H01L21/67796 , H01L21/68707
摘要： To move an article in and out of plasma during plasma processing, the article is rotated by a first drive around a first axis, and the first drive is itself rotated by a second drive. As a result, the article enters the plasma at different angles for different positions of the first axis. The plasma cross-section at the level at which the plasma contacts the article is asymmetric so that those points on the article that move at a greater linear velocity (due to being farther from the first axis) move longer distances through the plasma. As a result, the plasma processing time becomes more uniform for different points on the article surface. In some embodiments, two shuttles are provided for loading and unloading the plasma processing system. One of the shuttles stands empty waiting to unload the processed articles from the system, while the other shuttle holds unprocessed articles waiting to load them into the system. After the plasma processing terminates, the empty shuttle unloads processed articles from the system, takes the articles away, and gets unloaded and reloaded with unprocessed articles. Meanwhile, the other shuttle loads unprocessed articles into the system and the plasma processing begins. Since the plasma processing system does not wait for the first shuttle, the productivity of the system is increased.

56. 发明授权

US06541729B2 Monitoring and controlling separate plasma jets to achieve desired properties in a combined stream 有权
公开(公告)号：US06541729B2
公开(公告)日：2003-04-01
申请号：US09922205
申请日：2001-08-02
申请人： Oleg Siniaguine
发明人： Oleg Siniaguine
IPC分类号： B23K1000
CPC分类号： H05H1/44 , B05B12/082
摘要： A plasma apparatus separately measures multiple plasma jets upstream of where the plasma jets converge into a combined plasma stream. The separate plasma jets can be separately adjusted to place the separate jets in a configuration that provides the combined stream with desired properties for a plasma treatment. The system can include an injector for a neutral jet that becomes part of the combined plasma stream. With an injector, the positions of the plasma jets can be measured relative to the injector so that the plasma jets and the neutral jet are properly aligned to form a combine plasma stream having the properties desired.

57. 发明授权

US06498381B2 Semiconductor structures having multiple conductive layers in an opening, and methods for fabricating same 有权
标题翻译：在开口中具有多个导电层的半导体结构及其制造方法
公开(公告)号：US06498381B2
公开(公告)日：2002-12-24
申请号：US09792311
申请日：2001-02-22
申请人： Patrick B. Halahan , Oleg Siniaguine
发明人： Patrick B. Halahan , Oleg Siniaguine
IPC分类号： H01L3100
CPC分类号： H01L23/552 , H01L21/76898 , H01L23/481 , H01L2223/6622 , H01L2224/16 , H01L2924/04941 , H01L2924/12032 , H01L2924/3025 , Y10S438/977 , H01L2924/00
摘要： In some embodiments, a circuit structure comprises a semiconductor substrate, an opening passing through the substrate between a first side of the substrate and a second side of the substrate, and a plurality of conductive layers in the opening. In some embodiments, one conductive layer provides an electromagnetic shield that shields the substrate from AC signals carried by a contact pad made from another conductive layer on a backside of the substrate. The conductive layers can also be used to form capacitor/rectifier networks. Manufacturing methods are also provided.
摘要翻译：在一些实施例中，电路结构包括半导体衬底，在衬底的第一侧和衬底的第二侧之间穿过衬底的开口以及开口中的多个导电层。在一些实施例中，一个导电层提供电磁屏蔽，其屏蔽基板与由衬底背面上的另一导电层制成的接触焊盘承载的交流信号。导电层也可用于形成电容器/整流器网络。还提供了制造方法。

58. 发明授权

US06462300B2 Monitoring and controlling separate plasma jets to achieve desired properties in a combined stream 有权
公开(公告)号：US06462300B2
公开(公告)日：2002-10-08
申请号：US09922069
申请日：2001-08-02
申请人： Oleg Siniaguine
发明人： Oleg Siniaguine
IPC分类号： B23K1000
CPC分类号： H05H1/44 , B05B12/082
摘要： A plasma apparatus separately measures multiple plasma jets upstream of where the plasma jets converge into a combined plasma stream. The separate plasma jets can be separately adjusted to place the separate jets in a configuration that provides the combined stream with desired properties for a plasma treatment. The system can include an injector for a neutral jet that becomes part of the combined plasma stream. With an injector, the positions of the plasma jets can be measured relative to the injector so that the plasma jets and the neutral jet are properly aligned to form a combine plasma stream having the properties desired.

59. 发明授权

US06448188B1 Method of preventing motion of article in an article holder 失效
标题翻译：防止物品在物品夹持器中运动的方法
公开(公告)号：US06448188B1
公开(公告)日：2002-09-10
申请号：US10020405
申请日：2001-12-14
申请人： Oleg Siniaguine , Alex Berger
发明人： Oleg Siniaguine , Alex Berger
IPC分类号： H01L2131
CPC分类号： H01L21/68764 , H01L21/6838 , H01L21/68771 , Y10S414/135 , Y10S414/136 , Y10T29/41
摘要： The present invention comprises a dynamic brake that applies restraining frictional force to a wafer in a wafer holder while the wafer holder is substantially at rest, but releases the restraining force as the processing carousel containing several wafer holders rotates about a central axis of the carousel. This dynamic brake preferably comprises a boot that passes through an opening in the wafer holder to rest on the surface of the wafer in an exclusion zone near the wafer's edge. The exclusion zone is typically no more than about 3 mm in extent. The frictional force between the boot and wafer is sufficient to prevent unwanted motion of the wafer in the holder. As the wafer holder rotates about a central axis of the processing carousel, centrifugal forces applied to the brake arising from such rotation cause the boot to pivot upward, releasing the frictional force on the wafer.
摘要翻译：本发明包括动力制动器，当晶片保持器基本上处于静止状态时，在晶片保持器中对晶片施加抑制摩擦力，但是随着包含多个晶片保持架的处理转盘绕转盘的中心轴旋转，释放限制力。该动态制动器优选地包括穿过晶片保持器中的开口的保护罩，以在靠近晶片边缘的排除区域中搁置在晶片的表面上。排阻区的范围通常不超过约3毫米。靴子和晶片之间的摩擦力足以防止晶片在保持器中的不期望的运动。当晶片保持架围绕处理转盘的中心轴线旋转时，由这种旋转引起的对制动器施加的离心力使得护罩向上枢转，释放了晶片上的摩擦力。

60. 发明授权

US06323134B1 Plasma processing methods and apparatus 有权
标题翻译：等离子体处理方法和装置
公开(公告)号：US06323134B1
公开(公告)日：2001-11-27
申请号：US09519281
申请日：2000-03-07
申请人： Oleg Siniaguine
发明人： Oleg Siniaguine
IPC分类号： H01L21302
CPC分类号： H01L21/67017 , C23C16/4584 , C23C16/513 , C23C16/54 , H01J37/32743 , H01J37/32788 , H01J2237/20228 , H01J2237/31701 , H01L21/67745 , H01L21/67796 , H01L21/68707
摘要： To move an article in and out of plasma during plasma processing, the article is rotated by a first drive around a first axis, and the first drive is itself rotated by a second drive. As a result, the article enters the plasma at different angles for different positions of the first axis. The plasma cross-section at the level at which the plasma contacts the article is asymmetric so that those points on the article that move at a greater linear velocity (due to being farther from the first axis) move longer distances through the plasma. As a result, the plasma processing time becomes more uniform for different points on the article surface. In some embodiments, two shuttles are provided for loading and unloading the plasma processing system. One of the shuttles stands empty waiting to unload the processed articles from the system, while the other shuttle holds unprocessed articles waiting to load them into the system. After the plasma processing terminates, the empty shuttle unloads processed articles from the system, takes the articles away, and gets unloaded and reloaded with unprocessed articles. Meanwhile, the other shuttle loads unprocessed articles into the system and the plasma processing begins. Since the plasma processing system does not wait for the first shuttle, the productivity of the system is increased.
摘要翻译：为了在等离子体处理期间将物品移入和移出等离子体，物品通过围绕第一轴线的第一驱动器旋转，并且第一驱动器本身由第二驱动器旋转。结果，物品以不同的角度进入等离子体，用于第一轴的不同位置。等离子体接触制品的等离子体横截面是不对称的，使得以更大的线速度（由于离第一轴越远）移动的制品上的那些点移动通过等离子体的较长距离。结果，物品表面上的不同点的等离子体处理时间变得更加均匀。在一些实施例中，提供两个梭子来装载和卸载等离子体处理系统。其中一个班车空着，等待从系统中卸载已处理的物品，而另一个梭子将未加工物品等待装载到系统中。等离子处理结束后，空梭从系统中卸载加工物品，取出物品，卸载并重新加载未加工物品。同时，其他梭子将未处理的物品装入系统并开始等离子体处理。由于等离子体处理系统不等待第一班车，所以系统的生产率提高。

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