会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 51. 发明授权
    • Method of fabricating a surface coupled InGaAs photodetector
    • 制造表面耦合的InGaAs光电探测器的方法
    • US06228673B1
    • 2001-05-08
    • US09311673
    • 1999-05-13
    • Robert Y. LooAdele E. SchmitzJulia J. Brown
    • Robert Y. LooAdele E. SchmitzJulia J. Brown
    • H01L21302
    • H01L31/1035H01L21/28575H01L29/452H01L31/02363H01L31/1844Y02E10/544
    • A photodetector is fabricated in a multilayer structure having a semi-insulating InP substrate, an n+ InP contact layer overlying the InP substrate, an undoped InGaAs absorbing layer overlying the n+ InP contact layer, and a p+ doped InGaAs layer overlying the undoped InGaAs absorbing layer. A gold-beryllium p-contact dot is deposited onto the p+ doped InGaAs layer of the multilayer structure. A mesa structure is etched with a citric acid-based etchant into the multilayer structure. The mesa structure includes the metal p-contact dot, the p+ doped InGaAs layer, and the undoped InGaAs absorbing layer. The n+ InP contact layer is patterned, and a passive metallic n-contact layer is deposited onto the patterned n+ InP contact layer. A polyimide insulator layer overlying a portion of the structure is deposited and patterned, so that the polyimide insulator layer does not cover the passive metal p-contact dot and the metallic n-contact layer. The patterned organic polymer insulator layer is cured and the device is passivated by heating it in a nitrogen atmosphere. Thick metallic gold contract traces are deposited, with one trace extending to the gold-beryllium p-contact dot and the other trace extending to the metallic n-contact layer.
    • 以具有半绝缘InP衬底,覆盖InP衬底的n + InP接触层,覆盖n + InP接触层的未掺杂InGaAs吸收层和覆盖未掺杂的InGaAs吸收层的p +掺杂InGaAs层制成多层结构的光电检测器 。 金 - 铍p接触点沉积到多层结构的p +掺杂的InGaAs层上。 用基于柠檬酸的蚀刻剂蚀刻台面结构到多层结构中。 台面结构包括金属p接触点,p +掺杂的InGaAs层和未掺杂的InGaAs吸收层。 图案化n + InP接触层,并且将钝性金属n接触层沉积到图案化的n + InP接触层上。 沉积并图案化覆盖在结构的一部分上的聚酰亚胺绝缘体层,使得聚酰亚胺绝缘体层不覆盖被动金属p接触点和金属n-接触层。 图案化的有机聚合物绝缘体层被固化,并且通过在氮气气氛中加热来钝化该装置。 沉积厚金属金合金痕迹,一条迹线延伸到金 - 铍p接触点,另一条迹线延伸到金属n-接触层。
    • 55. 发明授权
    • Protected organic electronic devices and methods for making the same
    • 受保护的有机电子器件及其制造方法
    • US06897474B2
    • 2005-05-24
    • US10407820
    • 2003-04-04
    • Julia J. BrownMichael Stuart WeaverMin-Hao Michael Lu
    • Julia J. BrownMichael Stuart WeaverMin-Hao Michael Lu
    • H01L51/52H01L35/24
    • H01L51/5246H01L51/5256H01L51/5259H01L51/5265H01L2251/5338
    • An organic electronic device structure and a method of making the same. According to a first aspect of the invention, an organic electronic device structure is provided, which comprises: (a) a substrate layer; (b) an organic electronic region disposed over the substrate layer; (c) an adhesive layer disposed over the organic electronic device; and (d) a barrier layer disposed over the adhesive layer. According to a second aspect of the present invention, an organic electronic device structure is provided, which comprises: (a) a substrate layer; (b) an organic electronic region disposed over the substrate layer; (c) a barrier layer disposed over the organic electronic region; (d) an adhesive layer disposed over the substrate layer and over the barrier layer; and (e) an additional layer disposed over the adhesive layer. According to yet another aspect of the invention, a method for providing an organic electronic device structure of provided. The method comprises: (1) providing a first region comprising (a) a substrate layer and (b) an organic electronic region provided over the substrate layer; (2) providing a second region comprising at least one additional layer; and (3) adhering the first region to the second region using a pressure sensitive adhesive layer. In many preferred embodiments, the organic electronic device region is an OLED region.
    • 一种有机电子器件结构及其制造方法。 根据本发明的第一方面,提供了一种有机电子器件结构,其包括:(a)衬底层; (b)设置在所述衬底层上的有机电子区域; (c)设置在有机电子装置上方的粘合剂层; 和(d)设置在粘合剂层上的阻挡层。 根据本发明的第二方面,提供一种有机电子器件结构,其包括:(a)衬底层; (b)设置在所述衬底层上的有机电子区域; (c)设置在有机电子区域上的阻挡层; (d)设置在所述衬底层上方并在所述阻挡层上方的粘合剂层; 和(e)设置在粘合剂层上的附加层。 根据本发明的另一方面,提供一种提供有机电子器件结构的方法。 该方法包括:(1)提供第一区域,其包含(a)基底层和(b)设置在基底层上的有机电子区域; (2)提供包括至少一个附加层的第二区域; 和(3)使用压敏粘合剂层将第一区域粘合到第二区域。 在许多优选实施例中,有机电子器件区域是OLED区域。