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51. 发明申请

US20090053852A1 MANUFACTURING APPARATUS AND METHOD FOR AN ELECTRONIC APPARATUS 审中-公开
标题翻译：电子设备的制造装置和方法
公开(公告)号：US20090053852A1
公开(公告)日：2009-02-26
申请号：US12192225
申请日：2008-08-15
申请人： Shuichi Takeuchi , Kenji Kobae , Takashi Kubota , Hiroshi Kobayashi
发明人： Shuichi Takeuchi , Kenji Kobae , Takashi Kubota , Hiroshi Kobayashi
IPC分类号： H05K3/30 , H05K13/04
CPC分类号： H01L21/563 , H01L24/28 , H01L24/75 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83102 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , Y10T29/4913 , Y10T29/5313 , H01L2924/00
摘要： A manufacturing method for an electronic apparatus and manufacturing apparatus are provided. The manufacturing method includes applying to a surface of a sheet an adhesive to be charged into a space between a mounting board and an electronic component mounted on the mounting board, bringing the one surface of the sheet into contact with a back surface of the electronic component mounted on the mounting board and charging the adhesive into the space by bringing the adhesive into contact with a peripheral portion of the electronic component under a low pressure, and pressing a heating head against the other surface of the sheet and heating the sheet with the heating head via the sheet to set the adhesive under atmospheric pressure, in a state that the sheet is in contact with the electronic component.
摘要翻译：提供了一种用于电子设备和制造设备的制造方法。制造方法包括向片材的表面施加要填充到安装板和安装在安装板上的电子部件之间的空间中的粘合剂，使片材的一个表面与电子部件的背面接触安装在安装板上，并通过使粘合剂在低压下与电子部件的周边部分接触来将粘合剂装入空间，并将加热头压在片材的另一个表面上并加热片材在片材与电子部件接触的状态下，经由片材头部，以在大气压下设置粘合剂。

52. 发明申请

US20080052903A1 Method of Forming Aluminum Based Alloy Wiring Circuit and Method of Forming Element Structure of Display Device 审中-公开
标题翻译：铝基合金线路形成方法及显示装置元件结构形成方法
公开(公告)号：US20080052903A1
公开(公告)日：2008-03-06
申请号：US11847423
申请日：2007-08-30
申请人： Yoshinori Matsuura , Takashi Kubota
发明人： Yoshinori Matsuura , Takashi Kubota
IPC分类号： H05K3/20 , C22C21/00 , H01B13/00
CPC分类号： C22C21/12 , C22C21/00 , C23F1/36 , G02F2001/136295 , G03F7/322 , H01L27/124 , H05K1/09 , H05K3/064 , H05K3/067 , H05K2203/0793 , Y10T29/49128
摘要： The present invention proposes the technique in which aluminum based alloy is used as a wiring material, and the number of process is sharply reduced in the technique of forming the aluminum based alloy wiring circuit, thereby making it possible to efficiently manufacture the element. The present invention is a method of forming the wiring circuit by the aluminum based alloy, wherein the development process of a resist layer and the etching process of an aluminum based alloy film are simultaneously performed with a developing solution for the aluminum based alloy film laminated with the resist layer. This aluminum based alloy is preferably 5 Å/sec to 40 Å/sec in etching rate by the developing solution.
摘要翻译：本发明提出了使用铝基合金作为配线材料的技术，并且在形成铝基合金布线电路的技术中，工艺数量急剧减少，从而可以有效地制造元件。本发明是一种通过铝基合金形成布线电路的方法，其中抗蚀剂层的显影工艺和铝基合金膜的蚀刻工艺同时与用于与抗蚀剂层。这种铝基合金在显影液的蚀刻速度下优选为5埃/秒至40埃/秒。

53. 发明申请

US20070269603A1 Conductive Fine Particle, Method for Producing Conductive Fine Particle and Electroless Silver Plating Liquid 审中-公开
标题翻译：导电微粒，导电微粒和无电镀银液的制备方法
公开(公告)号：US20070269603A1
公开(公告)日：2007-11-22
申请号：US11658882
申请日：2005-08-05
申请人： Takashi Kubota
发明人： Takashi Kubota
IPC分类号： C23C18/40 , B05D7/00 , B05D3/04 , B05D1/36 , B32B5/16 , B05D1/18 , C22C19/03 , H01B1/22
CPC分类号： C23C18/36 , C23C18/1635 , C23C18/1651 , C23C18/44 , H05K3/323 , Y10T428/2991
摘要： It is an object of the present invention to provide a conductive fine particle which can prevent conductive defects and makes it possible to reduce the connection resistance, a method for producing the conductive fine particle, and an electroless silver plating liquid used for the producing of the conductive fine particle. The present invention is directed to a conductive fine particle, which comprises: a base particle; a base layer made of nickel on the surface of the base particle; and a silver layer formed by electroless silver plating on the surface of the base layer, the purity of silver in the silver layer being 90 wt % or more.
摘要翻译：本发明的目的是提供一种能够防止导电缺陷并且可以降低连接电阻的导电细颗粒，用于制造导电细颗粒的方法和用于制备导电细粒的无电镀银液导电细粒。本发明涉及一种导电细粒，其包括：基础颗粒; 在基体颗粒的表面上由镍制成的基层; 以及通过在基底层的表面上通过无电镀银形成的银层，银层中的银的纯度为90重量％以上。

54. 发明授权

US07278380B2 Cooling structure of cylinder block 有权
标题翻译：气缸体冷却结构
公开(公告)号：US07278380B2
公开(公告)日：2007-10-09
申请号：US11082870
申请日：2005-03-18
申请人： Takashi Matsutani , Takanori Nakada , Yoshikazu Shinpo , Makoto Hatano , Takashi Kubota
发明人： Takashi Matsutani , Takanori Nakada , Yoshikazu Shinpo , Makoto Hatano , Takashi Kubota
IPC分类号： F02F1/14 , F02B75/18
CPC分类号： F02F1/108 , Y02T10/16
摘要： A cooling structure for uniformly cooling a bore wall of a cylinder block using a cooling medium, the bore wall surrounding plural bore regions, includes a water jacket portion which is provided so as to surround an entire outer periphery of the bore wall, and which is supplied with the cooling medium; and a water jacket spacer which is inserted in the water jacket portion such that a space is provided between the bore wall and the water jacket spacer. The cylinder block includes an inter-bore region which is positioned in a vicinity of a boundary between the bore regions adjacent to each other, and a region other than the inter-bore region; and a cross sectional area of the space between the bore wall and the water jacket spacer in the inter-bore region is smaller than a cross sectional area of the space between the bore wall and the water jacket spacer in the region other than the inter-bore region.
摘要翻译：一种用于使用冷却介质均匀冷却气缸体的孔壁的冷却结构，围绕多个孔区的孔壁包括设置成围绕孔壁的整个外周围设置的水套部分，供应冷却介质; 以及水套隔离件，其插入在水套部分中，使得在孔壁和水套间隔件之间设置空间。气缸体包括位于彼此相邻的孔区域之间的边界附近的孔间区域和除了孔间区域之外的区域; 并且所述孔间区域中的所述孔壁和所述水套隔离件之间的空间的横截面面积小于所述孔内壁之间的区域中的所述孔壁与所述水套隔离件之间的空间的横截面积，钻孔区域。

55. 发明申请

US20070137026A1 Method of bonding flying leads 失效
标题翻译：拼接飞线的方法
公开(公告)号：US20070137026A1
公开(公告)日：2007-06-21
申请号：US11391362
申请日：2006-03-29
申请人： Takashi Kubota , Kenji Kobae , Kimio Nakamura
发明人： Takashi Kubota , Kenji Kobae , Kimio Nakamura
IPC分类号： B23K20/10
CPC分类号： B23K20/10 , B23K2101/32 , H05K3/26 , H05K3/328 , Y10T29/49027 , Y10T29/4903
摘要： A method of bonding flying leads produces reliable bonds between the flying leads and substrate pads and can efficiently bond a plurality of flying leads and a plurality of substrate pads using a bonding tool. Flying leads are respectively aligned with a plurality of substrate pads disposed in parallel and a bonding tool applies ultrasonic vibration to the flying leads to bond the respective substrate pads and the flying leads. Bonding is carried out using a bonding tool in which at least one contact member that contacts the flying leads and applies the ultrasonic vibration thereto is rotatably supported. The bonding tool is moved in a direction so as to cross the flying leads disposed in parallel with the at least one contact member rolling while in contact with the flying leads, and the ultrasonic vibration is applied from the at least one contact member to the flying leads to ultrasonically bond the respective flying leads to the substrate pads.
摘要翻译：结合飞行引线的方法在飞行引线和衬底焊盘之间产生可靠的结合，并且可以使用焊接工具有效地结合多个飞行引线和多个衬底焊盘。飞行引线分别与平行设置的多个基板焊盘对准，并且焊接工具对飞行引线施加超声波振动以将相应的基板焊盘和飞行引线接合。使用接合工具进行接合，其中至少一个接触飞行引线并且对其施加超声波振动的接触构件被可旋转地支撑。接合工具沿与所述至少一个接触构件平行布置的与所述飞行导线接触的方向交叉的方向移动，并且所述超声波振动从所述至少一个接触构件施加到所述飞行导致将相应的飞行引线超声波地结合到衬底焊盘。

56. 发明申请

US20060065697A1 Bonding tool for ultrasonic bonding and method of ultrasonic bonding 失效
标题翻译：超声波接合用接合工具及超声波接合方法
公开(公告)号：US20060065697A1
公开(公告)日：2006-03-30
申请号：US11019623
申请日：2004-12-23
申请人： Kenji Kobae , Takashi Kubota
发明人： Kenji Kobae , Takashi Kubota
IPC分类号： B23K1/06
CPC分类号： H01L24/81 , B23K20/10 , B23K20/106 , B23K2101/42 , H01L24/75 , H01L2224/16 , H01L2224/75 , H01L2224/81205 , H01L2224/81801 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2224/0401
摘要： Changes in the form of a pressure welding part of a bonding tool for ultrasonic bonding due to abrasion of the pressure welding part and/or accumulation of foreign matter, such as plating material, on the pressure welding part during use of the bonding tool are prevented, so that the bonding tool can carry out ultrasonic bonding stably. A plurality of protrusions with curved outer surfaces are formed on the pressure welding part that contacts the bonded part during ultrasonic bonding. The protrusions can be formed with spherical outer surfaces by forming concave grooves in a grid in an end surface of the bonding tool and then sandblasting the end surface of the bonding tool.
摘要翻译：防止了在焊接工具的使用过程中由于压焊部分的磨损引起的超声波接合用焊接工具的压接部件形状变化和电镀材料等异物堆积在压焊部上，使粘合工具能够稳定地进行超声波接合。具有弯曲外表面的多个突起形成在超声波接合期间与接合部接触的压焊部上。突起可以通过在接合工具的端面中的网格中形成凹槽，然后对结合工具的端面进行喷砂而形成球形外表面。

57. 发明申请

US20050217614A1 Cooling structure of cylinder block 有权
标题翻译：气缸体冷却结构
公开(公告)号：US20050217614A1
公开(公告)日：2005-10-06
申请号：US11082870
申请日：2005-03-18
申请人： Takashi Matsutani , Takanori Nakada , Yoshikazu Shinpo , Makoto Hatano , Takashi Kubota
发明人： Takashi Matsutani , Takanori Nakada , Yoshikazu Shinpo , Makoto Hatano , Takashi Kubota
IPC分类号： F02F1/14 , F01P3/02 , F02B75/18 , F02F1/10
CPC分类号： F02F1/108 , Y02T10/16
摘要： A cooling structure for uniformly cooling a bore wall of a cylinder block using a cooling medium, the bore wall surrounding plural bore regions, includes a water jacket portion which is provided so as to surround an entire outer periphery of the bore wall, and which is supplied with the cooling medium; and a water jacket spacer which is inserted in the water jacket portion such that a space is provided between the bore wall and the water jacket spacer. The cylinder block includes an inter-bore region which is positioned in a vicinity of a boundary between the bore regions adjacent to each other, and a region other than the inter-bore region; and a cross sectional area of the space between the bore wall and the water jacket spacer in the inter-bore region is smaller than a cross sectional area of the space between the bore wall and the water jacket spacer in the region other than the inter-bore region.
摘要翻译：一种用于使用冷却介质均匀冷却气缸体的孔壁的冷却结构，围绕多个孔区的孔壁包括设置成围绕孔壁的整个外周围设置的水套部分，供应冷却介质; 以及水套隔离件，其插入在水套部分中，使得在孔壁和水套间隔件之间设置空间。气缸体包括位于彼此相邻的孔区域之间的边界附近的孔间区域和除了孔间区域之外的区域; 并且所述孔间区域中的所述孔壁与所述水套隔离物之间的空间的横截面面积小于所述孔内壁之间的区域中的所述孔壁与所述水套隔离件之间的空间的横截面积，钻孔区域。

58. 发明授权

US06895350B2 Fraction defective estimating method, system for carrying out the same recording medium 有权
标题翻译：分数缺陷估计方法，用于执行相同记录介质的系统
公开(公告)号：US06895350B2
公开(公告)日：2005-05-17
申请号：US10365433
申请日：2003-02-13
申请人： Tatsuya Suzuki , Toshijiro Ohashi , Seii Miyakawa , Masaaki Asano , Takashi Kubota
发明人： Tatsuya Suzuki , Toshijiro Ohashi , Seii Miyakawa , Masaaki Asano , Takashi Kubota
IPC分类号： G06Q10/06 , G06F19/00
CPC分类号： G06Q10/06
摘要： A method and a system for estimating an assembling-related fraction defective coefficient of an article in the stage preceding to manufacturing, e.g. at a stage of design. Assembling operation, properties/conditions of parts to be assembled and conditions of an assembling shop having significant influence to the likelihood of occurrence of failure in assembling work are inputted as data. Estimated value of assembling-related fraction defective is arithmetically determined with high accuracy by executing an assembling-related fraction defective value estimating program on the basis of the data as inputted.
摘要翻译：用于估计制造前的阶段中的物品的装配相关分数不良系数的方法和系统，例如，在设计阶段。作为数据输入组装操作，要组装的部件的属性/条件以及对组装工作中出现故障可能性具有重大影响的组装车间的条件。基于所输入的数据，通过执行组装相关分数缺陷值估计程序，以高精度算术地确定装配相关分数有缺陷的估计值。

59. 发明授权

US06714226B2 Thermal head and controller for controlling the same 失效
标题翻译：热敏头和控制器用于控制
公开(公告)号：US06714226B2
公开(公告)日：2004-03-30
申请号：US10384614
申请日：2003-03-11
申请人： Takashi Kubota , Yosikazu Miyasita , Sigeyuki Kawamura
发明人： Takashi Kubota , Yosikazu Miyasita , Sigeyuki Kawamura
IPC分类号： B41J238
CPC分类号： B41J2/3352 , B41J2/33525 , B41J2/33535 , B41J2/3357 , B41J2/355 , B41J2/38
摘要： A thermal head includes a metal substrate; an insulating layer formed on the surface of the metal substrate; a plurality of heating elements disposed on the surface of the insulating layer, the heating elements being arranged with a predetermined pitch along a plurality of lines in a main scanning direction, the plurality of lines being spaced apart from each other in a paper-feeding direction perpendicular to the main scanning direction; and a heat radiating element projecting from the surface of the metal substrate to the side where the insulating layer is disposed. Although most of the heat generated by the respective heating elements is transferred to an ink ribbon or print paper, residual partial heat is absorbed by heat radiating means via the insulating layer and radiated into the atmosphere, which suppresses thermal interference among the heating elements.
摘要翻译：热敏头包括金属基板; 形成在所述金属基板的表面上的绝缘层; 设置在所述绝缘层的表面上的多个加热元件，所述加热元件沿着主扫描方向沿着多条线以预定间距排列，所述多条线在给纸方向上彼此间隔开垂直于主扫描方向; 以及从金属基板的表面向绝缘层配置的一侧突出的散热元件。虽然由各个加热元件产生的大部分热量被转印到墨带或打印纸上，但是残留的部分热经由绝缘层被散热装置吸收并辐射到大气中，这抑制了加热元件之间的热干扰。

60. 发明授权

US06218022B1 Resin etching solution and process for etching polyimide resins 失效
标题翻译：树脂蚀刻溶液和蚀刻聚酰亚胺树脂的方法
公开(公告)号：US06218022B1
公开(公告)日：2001-04-17
申请号：US08925907
申请日：1997-09-09
申请人： Atushi Suzuki , Mayumi Aimoto , Takashi Kubota , Masanori Akita , Koji Itoh
发明人： Atushi Suzuki , Mayumi Aimoto , Takashi Kubota , Masanori Akita , Koji Itoh
IPC分类号： B32B1504
CPC分类号： C09K13/02 , C08J7/12 , H05K1/0346 , H05K3/002 , H05K2201/0154 , H05K2203/0793 , Y10T428/258 , Y10T428/31678
摘要： A resin etching solution containing a hydroxyalkylamine, an alkali metal compound and water, or an aliphatic alcohol, an aliphatic amine, an alkali metal compound and water, and a process for etching a polyimide film containing a resist pattern or metal layer pattern formed on either or both sides using the resin etching solution.
摘要翻译：包含羟烷基胺，碱金属化合物和水或脂族醇，脂族胺，碱金属化合物和水的树脂蚀刻溶液以及用于蚀刻含有抗蚀剂图案或金属层图案的聚酰亚胺膜的方法，所述抗蚀剂图案或金属层图案或两侧使用树脂蚀刻溶液。

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