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51. 发明专利

JP2009249656A Plating apparatus and plating method 有权
标题翻译：电镀设备和电镀方法
公开(公告)号：JP2009249656A
公开(公告)日：2009-10-29
申请号：JP2008096327
申请日：2008-04-02
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： TAKEMOTO YOHEI , ICHII TAKUYA , SUNAMOTO MASATOSHI , FUJITA MINORU
IPC分类号： C23C18/31 , H05K3/18 , H05K3/24
摘要： PROBLEM TO BE SOLVED: To provide a plating apparatus and a plating method for suppressing deposition of gold between wiring patterns without changing nickel plating liquid in a short period of time.
SOLUTION: The plating apparatus 10 comprises a metallic plating tank 1 for storing the plating liquid 7, electrodes 2 to be immersed in the plating liquid 7, and a power supply unit 6. The lead wire 4 of a reference electrode and the lead wire 5 of a counter electrode which are connected to the power supply unit 6 respectively are connected to the plating tank 1, and the plating tank 1 is made an anode. The lead wire 3 of a sample electrode connected to the power supply unit 6 is connected to the electrode 2, and the electrode 2 is made a cathode. The potential difference between the plating tank 1 and the electrodes 2 is set to the natural polarization potential by the power supply unit 6.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于在短时间内不改变镀镍液体的情况下，在布线图案之间抑制金沉积的电镀设备和电镀方法。电镀装置10包括用于储存电镀液7的金属镀槽1，浸在镀液7中的电极2和电源单元6.参考电极的引线4和分别连接到电源单元6的对电极的引线5连接到电镀槽1，并且镀槽1被制成阳极。连接到电源单元6的样品电极的引线3连接到电极2，并且电极2被制成阴极。电镀槽1和电极2之间的电位差由电源单元6设定为自然极化电位。版权所有（C）2010，JPO＆INPIT

52. 发明专利

JP2009179845A Electroless plating method 有权
标题翻译：电镀法
公开(公告)号：JP2009179845A
公开(公告)日：2009-08-13
申请号：JP2008019240
申请日：2008-01-30
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： TAKEMOTO YOHEI , ICHII TAKUYA , SUNAMOTO MASATOSHI , FUJITA MINORU
IPC分类号： C23C18/44 , C23C18/18 , C23C18/36 , H05K3/18 , H05K3/24 , H05K3/26
摘要： PROBLEM TO BE SOLVED: To provide an electroless plating method which inhibits gold from abnormally depositing between wiring patterns in electroless plating, and consequently does not damage a desired wiring pattern. SOLUTION: The electroless plating method includes: an electroless nickel-plating step of forming an electroless nickel-plated film on the surface of a wiring pattern of a metal sintered compact, in a glass ceramic wiring substrate constituted by an insulative substrate made from glass ceramic and the wiring pattern of the metal sintered compact; a displacement-type electroless gold-plating step of forming a displacement-type electroless gold-plated film on the electroless nickel-plated film; and a reduction-type electroless gold-plating step of forming a reduction-type electroless gold-plated film on the displacement-type electroless gold-plated film; and further includes a glass etching step conducted in between the electroless nickel-plating step and the displacement-type electroless gold-plating step or in between the displacement-type electroless gold-plating step and the reduction-type electroless gold-plating step. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种化学镀方法，其抑制金在化学镀中的布线图案之间异常沉积，因此不会损坏所需的布线图案。解决方案：化学镀方法包括：在由金属烧结体的布线图案的表面上形成无电解镀镍膜的无电镀镍步骤，在由绝缘基板制成的玻璃陶瓷布线基板中来自玻璃陶瓷和金属烧结体的布线图案; 位移型无电镀金步骤，在化学镀镍膜上形成位移型无电镀金膜; 以及在位移型无电镀金膜上形成还原型无电镀金膜的还原型无电镀金工序; 并且还包括在无电镀镍步骤和位移型无电镀金步骤之间或在位移型无电镀金步骤和还原型无电镀金步骤之间进行的玻璃蚀刻步骤。版权所有（C）2009，JPO＆INPIT

53. 发明专利

JP2003109885A APPARATUS FOR PRODUCTION CONTROL 审中-公开
公开(公告)号：JP2003109885A
公开(公告)日：2003-04-11
申请号：JP2001302863
申请日：2001-09-28
申请人： MITSUBISHI ELECTRIC CORP
发明人： SUNAMOTO MASATOSHI , SAKURAI KOICHI
IPC分类号： G05B19/418 , G06F17/10 , G06F17/18 , G06Q50/00 , G06Q50/04 , H01L21/02 , G06F17/60
摘要： PROBLEM TO BE SOLVED: To estimate a manufacturing time and the number of products possible to be delivered. SOLUTION: The apparatus for production control comprises an arrival interval capturing unit 11 for capturing an average arrival interval, an in-process amount capturing unit 12 for capturing a queue length which is an average in-process amount, a processing interval capturing unit 13 for capturing an average lot processing interval, and an yield capturing unit 14 for capturing yield. An average waiting time of a product is calculated based on the average lot arrival interval and queue length, a manufacturing time for a product is calculated based on the calculated average waiting time and average lot processing interval, and the number of the products to be manufactured is calculated based on the yield.

54. 发明专利

JP2000183527A HEAVY CURRENT CIRCUIT BOARD AND MANUFACTURE OF THE SAME 失效
公开(公告)号：JP2000183527A
公开(公告)日：2000-06-30
申请号：JP35631698
申请日：1998-12-15
申请人： MITSUBISHI ELECTRIC CORP
发明人： SUNAMOTO MASATOSHI , ADACHI EINOSUKE
IPC分类号： H05K1/02 , H02G3/16 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To ensure voidless high breakdown voltage characteristics of a heavy current circuit board, and to reduce increase in product price, by realizing this with a simple structure and a simple manufacturing method. SOLUTION: This circuit board is provided with laminated conductive boards 2A, 2B, and 2C, insulating boards 3A, 3B, 3C, and 3D arranged between the upper and lower faces and each conductive board 2, frame boards 4A, 4B, and C arranged at the outer peripheries of the conductive boards 2, embedded plates 5 arranged in the inner peripheries of holes H of the conductive plates 2, and pre-preg members 6 made to be interposed between each insulating board 3 and the butted faces of the conductive boards 2, frame boards 4, and embedded boards 5. In this case, clearances GAPs between the edge faces of the conductive boards 2 and the edge faces of the frame boards 4 and the embedded plates 5 can be packed with resin flowing out of the pre-preg members 6, in a process for realizing the laminating integration of the whole through heat pressing.

55. 发明专利

JPH06224543A PRINTED CIRCUIT BOARD AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH06224543A
公开(公告)日：1994-08-12
申请号：JP14651292
申请日：1992-05-11
申请人： MITSUBISHI ELECTRIC CORP
发明人： FUJITA MINORU , KAWASAKI NAOSHIGE , SUNAMOTO MASATOSHI , MORITA TAKESHI , TAKAHAMA TAKASHI , HAYASHI OSAMU , UZAKI SHUNSUKE , SUDO SHUNEI
IPC分类号： H05K3/24
摘要： PURPOSE:To provide a reliable printed circuit board and its manufacturing method with no fear of a crack at a through hole even when a wiring pattern is coated with a thick electroless solder alloy. CONSTITUTION:A through hole 12 and a component mounting pad 13 in a wiring pattern are coated with a thin solder alloy coating 15 in a first solder plating- step, while a fine-pitch pad 11 is coated with a solder alloy coating 17 that is thicker than the solder coating 15 in a second solder plating step. In the first solder plating step, the fine-pitch pad is covered with a first resist mask 14. In the second solder plating step, the through hole 12 and the component mounting pad 13 are covered with a second resist mask 16.

56. 发明专利

JPH0613733A MANUFACTURE OF PRINTED WIRING BOARD 失效
公开(公告)号：JPH0613733A
公开(公告)日：1994-01-21
申请号：JP5214093
申请日：1993-03-12
申请人： MITSUBISHI ELECTRIC CORP
发明人： FUJITA MINORU , KAWASAKI NAOSHIGE , SUNAMOTO MASATOSHI , MORITA TAKESHI , TAKAHAMA TAKASHI , HAYASHI OSAMU , UZAKI SHUNSUKE , SUDO SHUNEI
IPC分类号： H05K3/24 , H05K3/42
摘要： PURPOSE:To devise a manufacturing method for printed wiring board capable of avoiding the deterioration in the reliability due to the decrease in copper when an electroless solder plating step is performed on a wiring pattern. CONSTITUTION:After the formation of a wiring pattern, the copper hood pad pattern part and through hole part are subjected to an electroless copper plating to a thickness which exceeds that of copper to be reduced by an electroless solder plating step, and then an electroless solder plating step is performed.

57. 发明专利

JPH05311450A 失效
公开(公告)号：JPH05311450A
公开(公告)日：1993-11-22
申请号：JP11735492
申请日：1992-05-11
申请人： MITSUBISHI ELECTRIC CORP
发明人： KAWASAKI NAOSHIGE , FUJITA MINORU , SUNAMOTO MASATOSHI , MORITA TAKESHI , TAKAHAMA TAKASHI , HAYASHI OSAMU , UZAKI SHUNSUKE , SUDO SHUNEI
IPC分类号： C23C18/31
摘要： PURPOSE:To obtain an electroless plating bath capable of generating uniform liquid flow on the surface of a platelike material to be plated. CONSTITUTION:A plating bath 4 in which the platelike material to be plated 6 is hung in a stored plating solution 5, a pair of guiding plates 10a, 10b arranged with a prescribed gap along both side of the material to be plated and a pair of impellers 8a. 8b which are arranged at both sides of the material to be plated 6 and form the flow of the plating solution 5 in the gap between the material to be plated 6 and the guiding plates 10a, 10b by rotating in the same direction are provided and the rotational direction of the impellers 8a, 8b is turned round periodically.

58. 发明专利

JPH0598455A ELECTROLESS PLATING TANK 失效
公开(公告)号：JPH0598455A
公开(公告)日：1993-04-20
申请号：JP25912291
申请日：1991-10-07
申请人： MITSUBISHI ELECTRIC CORP
发明人： FUJITA MINORU , KAWASAKI NAOSHIGE , SUNAMOTO MASATOSHI , MORITA TAKESHI , TAKAHAMA TAKASHI , HAYASHI OSAMU , UZAKI SHUNSUKE
IPC分类号： C23C18/31 , H05K3/18
摘要： PURPOSE:To form a uniform plating film on a printed wiring board. CONSTITUTION:A tank 4 contg. a plating soln. 5 and wherein a flat material 6 to be plated is suspended, plural couples of the injection port 8 and suction port 8 opposed to each other on both sides of the material 6 and used to form a uniform flow of the plating soln. 5 along both faces of the material 6 by injecting and sucking the plating soln. 5 and a means 20 connected to the injection port 8 and suction port 8 through a pipleine 10 and used to circulate the plating soln. 5 periodically in the opposite directions are provided.

59. 发明专利

JPH04314898A POST-TREATMENT METHOD FOR PLATING COAT 失效
公开(公告)号：JPH04314898A
公开(公告)日：1992-11-06
申请号：JP8012891
申请日：1991-04-12
申请人： MITSUBISHI ELECTRIC CORP
发明人： MORITA TAKESHI , FUJITA MINORU , SUNAMOTO MASATOSHI , HAYASHI OSAMU , HOSHINOUCHI SUSUMU
IPC分类号： C21D1/76 , C23F1/04 , C25D3/56 , C25D5/48 , C25D5/50 , H01R13/03 , H01R43/00
摘要： PURPOSE:To provide a method for post-treating a plating coat improved so that the plating coat of high quality may be obtained. CONSTITUTION:The surface of a plating coat 2 formed on a material to be plated 1 undergoes roughening treatment. On a surface 3 of the plating coat with the roughened surface, is formed a eutectic alloy plated layer 4 containing a main component of which the plating coat 2 is composed as one component. The eutectic alloy plating layer 4 is melted.

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