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    • 52. 发明授权
    • Method for fabricating a silicon carbide interconnect for semiconductor components using heating
    • 使用加热制造半导体元件的碳化硅互连的方法
    • US07129156B2
    • 2006-10-31
    • US11259508
    • 2005-10-26
    • Salman AkramAlan G. Wood
    • Salman AkramAlan G. Wood
    • H01L21/44
    • H01L23/147G01R1/06711G01R1/06755G01R1/07314G01R3/00H01L23/13H01L23/498H01L23/49838H01L23/49872H01L23/49877H01L2924/0002H01L2924/09701H01L2924/00
    • An interconnect for semiconductor components includes a substrate, and interconnect contacts on the substrate for electrically engaging component contacts on the components. The interconnect contacts include silicon carbide conductive layers, and conductors in electrical communication with the silicon carbide conductive layers. The silicon carbide conductive layers provides a wear resistant surface, and improved heat transfer between the component contacts and the interconnect contacts. The silicon carbide conductive layers can comprise doped silicon carbide, or alternately thermally oxidized silicon carbide. The interconnect can be configured for use with a testing apparatus for testing discrete components such as dice or chip scale packages, or alternately for use with a testing apparatus for testing wafer sized components, such as wafers, panels and boards. In addition, the interconnect can be configured for constructing semiconductor packages and electronic assemblies such as multi chip modules.
    • 用于半导体部件的互连件包括衬底和衬底上的互连触点,用于电连接部件上的组件触点。 互连触点包括碳化硅导电层和与碳化硅导电层电连通的导体。 碳化硅导电层提供耐磨表面,并且改善部件触点和互连触点之间的热传递。 碳化硅导电层可以包括掺杂的碳化硅,或交替地热氧化的碳化硅。 互连可以被配置用于与用于测试分立元件(例如骰子或芯片尺寸封装)的测试设备一起使用,或者替代地与用于测试晶片尺寸的元件(例如晶片,面板和板)的测试设备一起使用。 此外,互连可以被配置用于构造半导体封装和诸如多芯片模块的电子组件。
    • 53. 发明授权
    • Methods relating to singulating semiconductor wafers and wafer scale assemblies
    • 关于单片半导体晶片和晶片标尺组件的方法
    • US07129114B2
    • 2006-10-31
    • US10797504
    • 2004-03-10
    • Salman Akram
    • Salman Akram
    • H01L21/44H01L21/46
    • H01L21/78B23K26/364B23K26/40B23K2103/50B28D1/221B28D5/00H01L2224/11
    • Methods relating to the singulation of dice from semiconductor wafers. Trenches or channels are formed in the bottom surface of a semiconductor wafer, corresponding in location to the wafer streets. The trenches may be formed by etching or through an initial laser cut. The wafer is then singulated along the streets with a laser preferably having a beam narrower than the trenches. Multiple, laterally spaced lasers may be used in combination during a single pass to perform simultaneous singulating cuts. Additional edge protection for integrated circuitry on the active surface of the semiconductor dice may be provided by forming trenches or channels along the streets in the active surface instead of the bottom surface, disposing protective material along the streets and within the trenches prior to singulation and cutting through the wafer, leaving protective material on the sidewalls of the channels.
    • 关于从半导体晶片分割骰子的方法。 沟槽或通道形成在半导体晶片的底表面中,对应于晶片街道的位置。 沟槽可以通过蚀刻或通过初始激光切割形成。 然后使用激光器沿着街道将晶片分割成优选地具有比沟槽窄的光束。 在单次通过期间可以组合使用多个横向间隔开的激光器,以执行同时分割切割。 在半导体晶片的有源表面上的集成电路的附加边缘保护可以通过在有源表面中的街道上形成沟槽或沟道而不是底表面来提供,在切割和切割之前沿街道和沟槽内布置保护材料 通过晶片,将保护材料留在通道的侧壁上。
    • 55. 发明申请
    • Image sensor packages and frame structure thereof
    • 图像传感器封装及其框架结构
    • US20060192230A1
    • 2006-08-31
    • US11411265
    • 2006-04-26
    • Alan WoodKyle KirbyWarren FarnworthSalman Akram
    • Alan WoodKyle KirbyWarren FarnworthSalman Akram
    • H01L27/148H01L31/0203
    • H01L27/14618B33Y80/00H01L27/14625H01L2224/48091H01L2924/00014
    • A semiconductor package such as an image sensor package. A frame structure includes an array of frames, each having an aperture therethrough, into which an image sensor die in combination with a cover glass, filter, lens or other components may be installed in precise mutual alignment. Singulated image sensor dice and other components may be picked and placed into each frame of the frame structure. Alternatively, the frame structure may be configured to be aligned with and joined to a wafer bearing a plurality of image sensor dice, wherein optional, downwardly protruding skirts along peripheries of the frames may be received into kerfs cut along streets between die locations on the wafer, followed by installation of other package components. In either instance, the frame structure in combination with singulated image sensor dice or a joined wafer is singulated into individual image sensor packages. Various external connection approaches may be used.
    • 诸如图像传感器封装的半导体封装。 框架结构包括每个具有穿过其中的孔的框架阵列,图像传感器与盖玻片,过滤器,透镜或其它部件组合的模具可以精确相互对准地安装在该框架中。 单片图像传感器骰子和其他组件可以被拾取并放置在框架结构的每个帧中。 或者,框架结构可以被配置为与承载多个图像传感器骰子的晶片对准并且连接到其上,其中沿着框架的周边的任选的向下突出的裙边可以被接收到沿着晶片上的模具位置之间沿着街道切割的切口 ,然后安装其他包装组件。 在任一情况下,将帧结构与单独的图像传感器芯片或连接的晶片组合成单独的图像传感器封装。 可以使用各种外部连接方法。
    • 57. 发明申请
    • System for testing semiconductor components having interconnect with variable flexure contacts
    • 用于测试具有与可变挠曲触点互连的半导体部件的系统
    • US20060181294A1
    • 2006-08-17
    • US11389794
    • 2006-03-27
    • Salman AkramAlan Wood
    • Salman AkramAlan Wood
    • G01R31/02
    • G01R1/0735G01R1/0425G01R1/0483G01R1/07342G01R3/00H01L2224/05568H01L2224/05573H01L2224/1601H01L2224/16237H01L2224/81191H01L2224/81193H01L2224/81899H01L2924/00014H05K3/326H01L2224/05599
    • A test system for testing semiconductor components includes an interconnect having a substrate and contacts on the substrate for electrically engaging terminal contacts on the components. The interconnect also includes one or more cavities in the substrate which form flexible segments proximate to the interconnect contacts. The flexible segments permit the interconnect contacts to move independently in the z-direction to accommodate variations in the height and planarity of the terminal contacts. In addition, the cavities can be pressurized, or alternately filled with a polymer material, to adjust a compliancy of the flexible segments. Different embodiments of the interconnect contacts include: metallized recesses for retaining the terminal contacts, metallized projections for penetrating the terminal contacts, metallized recesses with penetrating projections, and leads contained on a polymer tape and cantilevered over metallized recesses. The test system can be configured for testing wafer sized components, such as wafers and boards, or for testing die sized components, such as unpackaged dice and chip scale packages.
    • 用于测试半导体部件的测试系统包括具有基板和在基板上的触点的互连,用于电连接部件上的端子触点。 互连还包括在基板中形成靠近互连触点的柔性段的一个或多个空腔。 柔性部分允许互连触头在z方向上独立地移动以适应端子触头的高度和平面度的变化。 此外,空腔可以被加压,或交替地填充聚合物材料,以调节柔性段的符合性。 互连触点的不同实施例包括:用于保持端子触头的金属化凹槽,用于穿透端子触头的金属化突起,具有穿透突起的金属化凹槽以及包含在聚合物带上的引线,并悬挂在金属化凹槽上。 测试系统可以配置用于测试晶片尺寸的组件,如晶圆和电路板,或用于测试裸片大小的组件,如未封装的芯片和芯片级封装。
    • 58. 发明授权
    • Plating
    • 电镀
    • US07090750B2
    • 2006-08-15
    • US10228505
    • 2002-08-26
    • Salman AkramDavid R. Hembree
    • Salman AkramDavid R. Hembree
    • C25D17/00
    • H01L21/67086C25D5/08C25D17/001C25F7/00H01L21/67051H01L21/67057H01L21/6708
    • An apparatus and method for treating a substrate to deposit, clean or etch material on a substrate using a first horizontal chuck to which a plurality of substrates is attached and electrically charged. Spaced closely to the first horizontal chuck is a coextensive horizontal second chuck which receives and showers reaction solution over all portions of each substrate. During the reaction process, both chucks are substantially submerged in reaction solution within a tank. At least one of the chucks is attached and controllable from a control arm. At least one of the chucks is rotated about a vertical axis at a slow speed during the reaction process. The axes of rotation of the two chucks may be coincident, or the axes may be offset from each other, and/or one or both axes may be offset from the chuck centerpoint(s). One of the chucks may also be periodically moved in a vertical direction relative to the other chuck.
    • 一种用于使用第一水平卡盘处理衬底以沉积,清洁或蚀刻衬底上的材料的装置和方法,多个衬底附着并带电的第一水平卡盘。 与第一个水平卡盘密切相邻的是一个共同延伸的水平第二卡盘,它在每个基板的所有部分上接收和反射反应溶液。 在反应过程中,两个卡盘基本上浸没在罐内的反应溶液中。 至少一个卡盘从控制臂附接和控制。 在反应过程中,至少一个卡盘以垂直轴线以慢速旋转。 两个卡盘的旋转轴线可以重合,或者轴线可能彼此偏移,和/或一个或两个轴线可能偏离卡盘中心点。 其中一个卡盘也可以相对于另一个卡盘在垂直方向周期性地移动。