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51. 发明授权

US07172135B2 Thermostat for two-system cooling device 失效
标题翻译：双系统冷却装置恒温器
公开(公告)号：US07172135B2
公开(公告)日：2007-02-06
申请号：US10494047
申请日：2003-06-18
申请人： Takashi Masuko , Akira Mori , Toru Yoshihara
发明人： Takashi Masuko , Akira Mori , Toru Yoshihara
IPC分类号： G05D23/02 , F01P7/14
CPC分类号： F16K11/02 , F01P7/16 , F01P2003/027 , F01P2037/02 , G05D23/134
摘要： A thermostat independently controlling cooling water passages of two circuits, including a first valve body having first and second passages in constant communication. A third passage is selectively connected to those passages. Communication of the third passage is disconnected when the cooling water temperature is below a prescribed temperature, and the valve is opened when the cooling water temperature is equal to or higher than the prescribed temperature. A second valve body, having fourth and fifth passages selectively in communication, closes the valve to disconnect those passages when the cooling water temperature is below the prescribed temperature, and opens the valve by operating the first valve body to link the passages when the cooling water temperature is equal to or higher than the prescribed temperature. A tubular sleeve prevents first and second control chambers, respectively including the first and second valve bodies, from communicating with each other.
摘要翻译：一种独立控制两个电路的冷却水通道的恒温器，包括具有恒定连通的第一和第二通道的第一阀体。选择性地连接到第三通道。当冷却水温度低于规定温度时，第三通道的通信断开，当冷却水温度等于或高于规定温度时，阀门打开。具有选择性连通的第四和第五通道的第二阀体在冷却水温度低于规定温度时关闭阀门以断开这些通道，并且当冷却水通过操作第一阀体连接通道而打开阀门温度等于或高于规定温度。管状套筒防止分别包括第一和第二阀体的第一和第二控制室彼此连通。

52. 发明授权

US07012320B2 Semiconductor device and process for fabrication thereof 失效
公开(公告)号：US07012320B2
公开(公告)日：2006-03-14
申请号：US09785486
申请日：2001-02-20
申请人： Shinji Takeda , Takashi Masuko , Masami Yusa , Tooru Kikuchi , Yasuo Miyadera , Iwao Maekawa , Mitsuo Yamasaki , Akira Kageyama , Aizou Kaneda
发明人： Shinji Takeda , Takashi Masuko , Masami Yusa , Tooru Kikuchi , Yasuo Miyadera , Iwao Maekawa , Mitsuo Yamasaki , Akira Kageyama , Aizou Kaneda
IPC分类号： H01L23/495
CPC分类号： H01L24/27 , H01L23/49513 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/743 , H01L24/83 , H01L2224/05599 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83101 , H01L2224/83192 , H01L2224/83805 , H01L2224/8385 , H01L2224/85399 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2924/01014 , H01L2924/01026 , H01L2924/01028 , H01L2924/3512 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

53. 发明授权

US06855579B2 Semiconductor device and process for fabrication thereof 失效
标题翻译：半导体器件及其制造方法
公开(公告)号：US06855579B2
公开(公告)日：2005-02-15
申请号：US09785436
申请日：2001-02-20
申请人： Shinji Takeda , Takashi Masuko , Masami Yusa , Tooru Kikuchi , Yasuo Miyadera , Iwao Maekawa , Mitsuo Yamasaki , Akira Kageyama , Aizou Kaneda
发明人： Shinji Takeda , Takashi Masuko , Masami Yusa , Tooru Kikuchi , Yasuo Miyadera , Iwao Maekawa , Mitsuo Yamasaki , Akira Kageyama , Aizou Kaneda
IPC分类号： H01L21/52 , H01L21/58 , H01L23/495 , H01L21/48
CPC分类号： H01L24/27 , H01L23/49513 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/743 , H01L24/83 , H01L24/97 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83101 , H01L2224/83192 , H01L2224/83805 , H01L2224/8385 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/12044 , H01L2924/181 , Y10T428/28 , H01L2924/00 , H01L2924/01014 , H01L2224/83 , H01L2224/85 , H01L2924/3512 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.
摘要翻译：将半导体芯片与吸水率为1.5体积％以下的薄膜状有机芯片接合材料贴合在引线框架上; 具有1.0体积％以下的饱和吸湿性，在250℃的温度下具有不大于3.0重量％的残留挥发组分，弹性模量为10MPa以下。半导体装置这样获得的半导体器件的封装的回流焊接期间不会发生回流裂纹。

54. 发明授权

US08895564B2 Biguanide derivative compound 有权
标题翻译：双胍衍生物
公开(公告)号：US08895564B2
公开(公告)日：2014-11-25
申请号：US13991344
申请日：2011-12-01
申请人： Muneharu Miyake , Tadashi Kusama , Takashi Masuko
发明人： Muneharu Miyake , Tadashi Kusama , Takashi Masuko
IPC分类号： C07D241/34 , C07D241/28 , A61K31/4965
CPC分类号： C07D241/34 , A61K31/4965 , C07D241/28
摘要： Provided is a novel compound which simultaneously inhibits both NMDA receptors and ASIC1a, which are associated with neurodegenerative disease and so on, and thus is useful for the prevention and treatment of various nervous system diseases. A biguanide derivative represented by the following general formula (1), a salt thereof, or a hydrate of the derivative or the salt: wherein, X1 represents a halogen atom, R1 represents an alkyl group, an optionally substituted aryl group, or an optionally substituted aralkyl group.
摘要翻译：提供同时抑制与神经变性疾病等相关的NMDA受体和ASIC1a的新型化合物，因此可用于预防和治疗各种神经系统疾病。由以下通式（1）表示的双胍衍生物，其盐或其衍生物或盐的水合物：其中，X1表示卤素原子，R1表示烷基，任选取代的芳基或任意取代的芳基取代的芳烷基。

55. 发明授权

US08673539B2 Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part 有权
标题翻译：感光性粘合剂组合物，使用该粘合剂组合物，粘合剂膜，粘合片，具有粘合剂层的半导体晶片，半导体器件和电子部件
公开(公告)号：US08673539B2
公开(公告)日：2014-03-18
申请号：US13672847
申请日：2012-11-09
申请人： Takashi Kawamori , Takashi Masuko , Shigeki Katogi , Masaaki Yasuda
发明人： Takashi Kawamori , Takashi Masuko , Shigeki Katogi , Masaaki Yasuda
IPC分类号： G03F7/00 , G03F7/40 , G03F7/26
CPC分类号： H01L23/488 , C09J179/08 , G03F7/037 , H01L21/2007 , H01L21/76251 , H01L21/78 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , Y10T156/1002 , Y10T428/24479 , Y10T428/24802 , H01L2924/00014
摘要： A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.
摘要翻译：一种感光性粘合剂组合物，其包含：（A）具有羧基作为侧链的聚酰亚胺，其酸值为80〜180mg / KOH; （B）光聚合性化合物; 和（C）光聚合引发剂。

56. 发明申请

US20130281464A1 BIGUANIDE DERIVATIVE COMPOUND 有权
标题翻译： BIGUANIDE衍生化合物
公开(公告)号：US20130281464A1
公开(公告)日：2013-10-24
申请号：US13991344
申请日：2011-12-01
申请人： Muneharu Miyake , Tadashi Kusama , Takashi Masuko
发明人： Muneharu Miyake , Tadashi Kusama , Takashi Masuko
IPC分类号： C07D241/34
CPC分类号： C07D241/34 , A61K31/4965 , C07D241/28
摘要： Provided is a novel compound which simultaneously inhibits both NMDA receptors and ASIC1a, which are associated with neurodegenerative disease and so on, and thus is useful for the prevention and treatment of various nervous system diseases. A biguanide derivative represented by the following general formula (1), a salt thereof, or a hydrate of the derivative or the salt: wherein, X1 represents a halogen atom, R1 represents an alkyl group, an optionally substituted aryl group, or an optionally substituted aralkyl group.
摘要翻译：提供同时抑制与神经变性疾病等相关的NMDA受体和ASIC1a的新型化合物，因此可用于预防和治疗各种神经系统疾病。由以下通式（1）表示的双胍衍生物，其盐或其衍生物或盐的水合物：其中，X1表示卤素原子，R1表示烷基，任选取代的芳基或任意取代的芳基取代的芳烷基。

57. 发明授权

US08554546B2 Apparatus and method for calculating a fundamental frequency change 有权
标题翻译：用于计算基频变化的装置和方法
公开(公告)号：US08554546B2
公开(公告)日：2013-10-08
申请号：US12556382
申请日：2009-09-09
申请人： Yusuke Kida , Takashi Masuko
发明人： Yusuke Kida , Takashi Masuko
IPC分类号： G10L19/00
CPC分类号： G10L25/90
摘要： A logarithmic frequency spectrum within a predetermined time range is calculated from a speech signal. The logarithmic frequency spectrum has a frequency element at equal intervals along a logarithmic frequency axis. A logarithmic frequency spectrogram is calculated by connecting a plurality of logarithmic frequency spectrums. A value of the frequency element along a straight line on the logarithmic frequency spectrogram is voted onto a Hough plane. The Hough plane has a voted value in correspondence with a gradient of the straight line. The voted value above a threshold and the gradient corresponding to the voted value are extracted from the Hough plane. A fundamental frequency change is calculated using the voted value and the gradient extracted.
摘要翻译：根据语音信号计算预定时间范围内的对数频谱。对数频谱沿着对数频率轴具有相等间隔的频率元素。通过连接多个对数频谱来计算对数频谱图。在对数频谱图上沿着直线的频率元素的值被投票在霍夫平面上。霍普飞机具有与直线的梯度对应的投票价值。从霍夫平面中提取高于阈值的投票值和对应于投票值的梯度。使用投票值和提取的梯度计算基本频率变化。

58. 发明申请

US20130179158A1 Speech Feature Extraction Apparatus and Speech Feature Extraction Method 有权
标题翻译：语音特征提取装置及语音特征提取方法
公开(公告)号：US20130179158A1
公开(公告)日：2013-07-11
申请号：US13728287
申请日：2012-12-27
申请人： Masanobu Nakamura , Takashi Masuko
发明人： Masanobu Nakamura , Takashi Masuko
IPC分类号： G10L21/00
CPC分类号： G10L21/00 , G10L15/02 , G10L15/20
摘要： According to one embodiment, a speech feature extraction apparatus includes an extraction unit and a calculation unit. The extraction unit extracts speech segments over a predetermined period at intervals of a unit time from either an input speech signal or a plurality of subband input speech signals obtained by extracting signal components of a plurality of frequency bands from the input speech signal, to generate either a unit speech signal or a plurality of subband unit speech signals. The calculation unit calculates either each average time of the unit speech signal in each of the plurality of frequency bands or each average time of each of the plurality of subband unit speech signals to obtain a speech feature.
摘要翻译：根据一个实施例，语音特征提取装置包括提取单元和计算单元。提取单元从输入语音信号或通过从输入语音信号提取多个频带的信号分量而获得的多个子带输入语音信号，以单位时间间隔在预定时段内提取语音片段，以产生单位语音信号或多个子带单元语音信号。计算单元计算多个频带中的每一个中的单位语音信号的每个平均时间或者多个子带单元语音信号中的每一个的每个平均时间，以获得语音特征。

59. 发明授权

US08445177B2 Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part 有权
标题翻译：感光性粘合剂组合物，使用该粘合剂组合物，粘合剂膜，粘合片，具有粘合剂层的半导体晶片，半导体器件和电子部件
公开(公告)号：US08445177B2
公开(公告)日：2013-05-21
申请号：US12950353
申请日：2010-11-19
申请人： Takashi Kawamori , Takashi Masuko , Shigeki Katogi , Masaaki Yasuda
发明人： Takashi Kawamori , Takashi Masuko , Shigeki Katogi , Masaaki Yasuda
IPC分类号： G03F7/00 , G03F7/004 , G03F7/027
CPC分类号： H01L23/488 , C09J179/08 , G03F7/037 , H01L21/2007 , H01L21/76251 , H01L21/78 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , Y10T156/1002 , Y10T428/24479 , Y10T428/24802 , H01L2924/00014
摘要： A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.
摘要翻译：一种感光性粘合剂组合物，其包含：（A）具有羧基作为侧链的聚酰亚胺，其酸值为80〜180mg / KOH; （B）光聚合性化合物; 和（C）光聚合引发剂。

60. 发明授权

US08349700B2 Photosensitive adhesive, semiconductor device and method for manufacturing semiconductor device 有权
标题翻译：感光胶粘剂，半导体装置及半导体装置的制造方法
公开(公告)号：US08349700B2
公开(公告)日：2013-01-08
申请号：US12745594
申请日：2008-12-02
申请人： Takashi Masuko , Takashi Kawamori , Kazuyuki Mitsukura , Shigeki Katogi
发明人： Takashi Masuko , Takashi Kawamori , Kazuyuki Mitsukura , Shigeki Katogi
IPC分类号： H01L21/30
CPC分类号： H01L24/27 , C08G18/8116 , C09J175/16 , C09J179/08 , G03F7/037 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/0554 , H01L2224/05573 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/16225 , H01L2224/29076 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29499 , H01L2224/32225 , H01L2224/73204 , H01L2224/83191 , H01L2224/83192 , H01L2224/83194 , H01L2224/94 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/351 , H01L2224/83 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method for manufacturing a semiconductor device 1, comprising a first step of providing a photosensitive adhesive (insulating resin layer 7) on a board 3 which has a connecting terminal, a second step of patterning the photosensitive adhesive by light exposure and development so that openings 13 are formed where the connecting terminal is exposed, a third step of filling the openings 13 with a conductive material to form a conductive layer 9, and a fourth step of directly bonding a semiconductor chip 5 having a connecting electrode section to the photosensitive adhesive while electrically connecting the connecting terminal of the board 3 and the connecting electrode section of the semiconductor chip 5 via the conductive layer 9.
摘要翻译：一种用于制造半导体器件1的方法，包括在具有连接端子的基板3上设置感光性粘接剂（绝缘树脂层7）的第一工序，通过曝光和显影来图案化感光性粘接剂的第二工序， 13形成连接端子露出的第三步骤，用导电材料填充开口13以形成导电层9的第三步骤，以及将具有连接电极部分的半导体芯片5直接接合到感光性粘合剂的第四步骤，同时通过导电层9电连接板3的连接端子和半导体芯片5的连接电极部分。

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