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    • 52. 发明授权
    • Soldering alloy, cream solder and soldering method
    • 焊接合金,膏状焊料和焊接方法
    • US06371361B1
    • 2002-04-16
    • US09252787
    • 1999-02-19
    • Atsushi YamaguchiTetsuo Fukushima
    • Atsushi YamaguchiTetsuo Fukushima
    • B23K2800
    • B23K35/262B23K35/025
    • The present invention relates to a soldering alloy composed mainly of Sn and free from lead, a toxic substance. Adding a small quantity of Ag to the soldering alloy can make the alloy structure fine, minimize structural changes of the alloy and increase its thermal fatigue resistance. Adding a small quantity of Bi to the soldering alloy lowers the melting point and improves the alloy's wettability. Further, adding a small quantity of Cu restrains the growth of intermetallic compounds in the bonding interface between a copper land and the solder. Furthermore, addition of a small quantity of In improves the elongation property and thermal fatigue resistance of the alloy.
    • 本发明涉及一种主要由Sn组成且不含铅的焊接合金,它是一种有毒物质。 在焊接合金中添加少量的Ag可以使合金结构细小,使合金的结构变化最小化,提高其耐热疲劳性。 向钎焊合金中添加少量Bi可降低熔点,提高合金的润湿性。 此外,添加少量Cu抑制了铜焊盘和焊料之间的接合界面中金属间化合物的生长。 此外,添加少量的In可以提高合金的伸长率和耐热疲劳性。
    • 54. 发明授权
    • Device for positioning circular semiconductor wafers
    • 用于定位圆形半导体晶片的装置
    • US5194743A
    • 1993-03-16
    • US679251
    • 1991-04-02
    • Masaaki AoyamaNaomasa ShiraishiKen HattoriAtsushi YamaguchiKesayoshi Amano
    • Masaaki AoyamaNaomasa ShiraishiKen HattoriAtsushi YamaguchiKesayoshi Amano
    • G03F7/20H01L21/68
    • G03F7/70716H01L21/681
    • A device for positioning a circular substrate having a cut portion, comprising: a first rotational stage which is finely rotated around the origin of a rectangular coordinate system; an X-Y stage on the first rotational stage which is two-dimensionally moved in the coordinate system; a second rotational stage on the X-Y stage which is rotated while holding the substrate; a first detecting device for detecting information about the displacement change of the periphery of the substrate from the rotational center during the rotation of the second rotational stage; a first positioning controlling device for controlling the rotation of the second rotational stage in accordance with information detected by the first detecting device so that the cut portion is placed in a predetermined direction on the coordinate system; a second detecting device having three or more detecting points in the coordinate system so as to detect the three or more positions of the periphery, the second detecting device generating information about a detection at each of the three or more detecting points; and a second positioning controlling device for controlling the X-Y stage and the first rotational stage in accordance with the detection information from the second detecting device after the cut portion has been placed in the predetermined direction.
    • 一种用于定位具有切割部分的圆形基底的装置,包括:围绕所述直角坐标系的原点精细旋转的第一旋转台; 在坐标系中二维移动的第一旋转台上的X-Y平台; 在X-Y平台上的第二旋转台,其在保持基板的同时旋转; 第一检测装置,用于在所述第二旋转台的旋转期间从所述旋转中心检测关于所述基板的周边的位移变化的信息; 第一定位控制装置,用于根据由第一检测装置检测的信息来控制第二旋转台的旋转,使得切割部分沿坐标系上的预定方向放置; 所述第二检测装置在所述坐标系中具有三个以上的检测点,以检测所述周边的三个以上的位置,所述第二检测装置生成关于所述三个以上检测点中的每一个的检测的信息; 以及第二定位控制装置,用于在切割部分被放置在预定方向之后,根据来自第二检测装置的检测信息来控制X-Y级和第一旋转级。