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    • 54. 发明授权
    • Methods of fabricating microneedle arrays using sacrificial molds, and microneedle arrays fabricated thereby
    • 使用牺牲模具制造微针阵列的方法和由此制造的微针阵列
    • US07332197B2
    • 2008-02-19
    • US10304277
    • 2002-11-26
    • Robert L. WoodHenry A. WynandsKaren W. Markus
    • Robert L. WoodHenry A. WynandsKaren W. Markus
    • B05D7/22B05D1/36
    • B81C99/0085A61B5/14514A61B5/150022A61B5/150282A61B5/150984A61M37/0015A61M2037/003A61M2037/0053B81B2201/055Y10T29/302Y10T29/49222
    • Microneedle arrays are fabricated by providing a sacrificial mold including a substrate and an array of posts, preferably solid posts, projecting therefrom. A first material is coated on the sacrificial mold including on the substrate and on the array of posts. The sacrificial mold is removed to provide an array of hollow tubes projecting from a base. The inner and outer surfaces of the array of hollow tubes are coated with a second material to create the array of microneedles projecting from the base. The sacrificial mold may be fabricated by fabricating a master mold, including an array of channels that extend into the master mold from a face thereof. A third material is molded into the channels and on the face of the master mold, to create the sacrificial mold. The sacrificial mold then is separated from the master mold. Alternatively, wire bonding may be used to wire bond an array of wires to a substrate to create the sacrificial mold. The first material preferably is coated on the sacrificial mold by plating. Prior to plating, a plating base preferably is formed on the sacrificial mold including on the substrate and on the array of posts. The inner and outer surfaces of the array of hollow tubes preferably are coated with the second material by overplating the second material on the inner and outer surfaces of the array of hollow tubes.
    • 微针阵列通过提供包括基底和从其突出的柱的阵列(优选固体柱)的牺牲模具来制造。 第一材料涂覆在牺牲模具上,包括在基板上和柱阵列上。 去除牺牲模具以提供从基部突出的中空管阵列。 中空管阵列的内表面和外表面涂覆有第二材料以产生从基底突出的微针阵列。 牺牲模具可以通过制造主模具来制造,该模具包括从其表面延伸到主模具中的通道阵列。 将第三种材料模制到通道中并在母模的表面上,以形成牺牲模具。 然后将牺牲模具与主模具分离。 或者,引线接合可用于将线阵列引线接合到基底以产生牺牲模。 第一种材料优选通过电镀涂覆在牺牲模具上。 在电镀之前,优选在包括在基板和柱阵列上的牺牲模具上形成镀覆基底。 优选地,中空管阵列的内表面和外表面通过在中空管阵列的内表面和外表面上的第二材料的上镀敷而涂覆有第二材料。
    • 58. 发明授权
    • MEMS variable optical attenuator
    • MEMS可变光衰减器
    • US06275320B1
    • 2001-08-14
    • US09405789
    • 1999-09-27
    • Vijayakumar R. DhulerEdward A. HillRamaswamy MahadevanMark David WaltersRobert L. Wood
    • Vijayakumar R. DhulerEdward A. HillRamaswamy MahadevanMark David WaltersRobert L. Wood
    • G02B2600
    • G02B26/0841B81B3/0054B81B2201/038B81B2201/047G02B6/266
    • A MEMS (Micro Electro Mechanical System) variable optical attenuator is provided that is capable of optical attenuation over a full range of optical power. The MEMS variable optical attenuator comprises a microelectronic substrate, a MEMS actuator and an optical shutter. The MEMS variable optical attenuator may also comprise a clamping element capable of locking the optical shutter at a desired attenuation position. The variable light attenuator is capable of attenuating optical beams that have their optical axis running parallel and perpendicular to the substrate. Additionally, the MEMS actuator of the present invention may comprise an array of MEMS actuators capable of supplying the optical shutter with greater displacement distances and, thus a fuller range of optical attenuation. In one embodiment of the invention, the MEMS actuator comprises a thermal arched beam actuator. Additionally, the variable optical attenuator of the present invention may be embodied in a thermal bimorph cantilever structure. This alternate embodiment includes a microelectronic substrate and a thermal bimorph cantilever structure having at least two materials of different thermal coefficient of expansion. The thermal bimorph is responsive to thermal activation and moves in the direction of the material having the lower thermal coefficient expansion. Upon activation, the thermal bimorph intercepts the path of the optical beam and provides for the desired level of optical attenuation. The invention also provides for a method of optical attenuation and a method for fabricating an optical attenuator in accordance with the described structures.
    • 提供了一种能够在全光范围内进行光衰减的MEMS(微机电系统)可变光衰减器。 MEMS可变光衰减器包括微电子衬底,MEMS致动器和光学快门。 MEMS可变光衰减器还可以包括能够将光学快门锁定在期望的衰减位置的夹紧元件。 可变光衰减器能够衰减其光轴平行且垂直于衬底的光束。 另外,本发明的MEMS致动器可以包括MEMS致动器的阵列,其能够向光学快门提供更大的位移距离,并且因此具有更宽的光学衰减范围。 在本发明的一个实施例中,MEMS致动器包括热拱形梁致动器。 另外,本发明的可变光衰减器可以以热双压电晶片悬臂结构体现。 该替代实施例包括具有不同热膨胀系数的至少两种材料的微电子衬底和热双压电晶片悬臂结构。 热双压电晶体响应于热激活并沿具有较低热系数膨胀的材料的方向移动。 在激活时,热双压电晶片截取光束的路径并提供所需的光衰减水平。 本发明还提供了一种光衰减的方法以及根据所述结构制造光衰减器的方法。