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    • 56. 发明授权
    • Schottky barrier metal-germanium contact in metal-germanium-metal photodetectors
    • 金属锗金属光电探测器中的肖特基势垒金 - 锗接触
    • US07700975B2
    • 2010-04-20
    • US11394817
    • 2006-03-31
    • Titash RakshitMiriam Reshotko
    • Titash RakshitMiriam Reshotko
    • H01L29/739H01L31/0328H01L31/0336H01L31/072H01L31/109H01L29/80H01L31/112H01L31/00H01L27/095H01L29/47H01L29/812H01L31/07
    • H01L31/1085H01L31/022408
    • Metal-Semiconductor-Metal (“MSM”) photodetectors and methods to fabricate thereof are described. The MSM photodetector includes a thin heavily doped (“delta doped”) layer deposited at an interface between metal contacts and a semiconductor layer to reduce a dark current of the MSM photodetector. In one embodiment, the semiconductor layer is an intrinsic semiconductor layer. In one embodiment, the thickness of the delta doped layer is less than 100 nanometers. In one embodiment, the delta doped layer has a dopant concentration of at least 1×1018 cm−3. A delta doped layer is formed on portions of a semiconductor layer over a substrate. Metal contacts are formed on the delta doped layer. A buffer layer may be formed between the substrate and the semiconductor layer. In one embodiment, the substrate includes silicon, and the semiconductor layer includes germanium.
    • 描述了金属 - 半导体 - 金属(“MSM”)光电探测器及其制造方法。 MSM光电检测器包括沉积在金属触点和半导体层之间的界面处的薄重掺杂(“δ掺杂”)层,以减少MSM光电探测器的暗电流。 在一个实施例中,半导体层是本征半导体层。 在一个实施例中,Δ掺杂层的厚度小于100纳米。 在一个实施例中,δ掺杂层具有至少1×10 18 cm -3的掺杂剂浓度。 在衬底上的半导体层的部分上形成δ掺杂层。 在δ掺杂层上形成金属接触。 可以在衬底和半导体层之间形成缓冲层。 在一个实施例中,衬底包括硅,并且半导体层包括锗。
    • 60. 发明申请
    • Complementarily doped metal-semiconductor interfaces to reduce dark current in MSM photodetectors
    • 互补掺杂的金属 - 半导体界面,以减少MSM光电探测器中的暗电流
    • US20080001181A1
    • 2008-01-03
    • US11477722
    • 2006-06-28
    • Titash RakshitMiriam Reshotko
    • Titash RakshitMiriam Reshotko
    • H01L27/148
    • H01L31/1085H01L31/18
    • Metal-Semiconductor-Metal (“MSM”) photodetectors and methods to fabricate thereof are described. The MSM photodetector includes a thin heavily doped (“delta doped”) regions deposited at an interface between metal contacts and a semiconductor layer to reduce a dark current of the MSM photodetector. Band engineering at the metal-semiconductor interfaces using complementarily delta doped semiconductor regions to fix two different interface workfunctions. Delta doping the grounded contact interface with p+ and the reverse biased interface with n+ enhances the Schottky barrier faced by both electrons and holes at the point of injection from source contact into the channel and at the point of collection from the channel into the drain contact.
    • 描述了金属 - 半导体 - 金属(“MSM”)光电探测器及其制造方法。 MSM光电检测器包括沉积在金属触点和半导体层之间的界面处的薄重掺杂(“δ掺杂”)区域,以减少MSM光电探测器的暗电流。 使用互补的δ掺杂半导体区域在金属 - 半导体界面处的带工程化以固定两个不同的界面工作功能。 使用p +掺杂接地接触界面的增益和具有n +的反向偏置界面的增强了在源极接触到通道中以及从通道到漏极接触点的注入点处的电子和空穴所面临的肖特基势垒的肖特基势垒。