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    • 52. 发明授权
    • Method for fabricating nonvolatile semiconductor memory device
    • 制造非易失性半导体存储器件的方法
    • US07344976B2
    • 2008-03-18
    • US11377452
    • 2006-03-17
    • Hiroshi YoshidaTakumi Mikawa
    • Hiroshi YoshidaTakumi Mikawa
    • H01L21/4763
    • H01L27/11507H01L27/11502H01L28/57
    • An adhesion layer composed of a titanium film and a titanium nitride film is formed by CVD on the inner wall of a contact hole formed in a multilayer film composed of an interlayer insulating film, a silicon nitride film, and a silicon dioxide film. Then, a conductive film made of tungsten or polysilicon is filled by CVD in the contact hole and the respective portions of the conductive film and the adhesion layer which are located over the silicon dioxide film are removed by CMP. Subsequently, the silicon dioxide film is removed by an etch-back method or a CMP method so that the silicon nitride film is exposed. This can prevent the delamination of the adhesion layer from the silicon nitride film as a hydrogen barrier film and also prevent the formation of a scratch in the silicon nitride film.
    • 在由层间绝缘膜,氮化硅膜和二氧化硅膜构成的多层膜中形成的接触孔的内壁上通过CVD形成由钛膜和氮化钛膜构成的粘合层。 然后,通过CVD在接触孔中填充由钨或多晶硅制成的导电膜,并且通过CMP去除位于二氧化硅膜上方的导电膜和粘附层的各个部分。 随后,通过蚀刻方法或CMP方法去除二氧化硅膜,以使氮化硅膜露出。 这可以防止作为氢阻挡膜的粘合层从氮化硅膜分层,并且还防止在氮化硅膜中形成划痕。
    • 57. 发明申请
    • VARIABLE CAPACITANCE DEVICE AND PORTABLE PHONE
    • 可变电容器和便携式电话
    • US20070281646A1
    • 2007-12-06
    • US11755107
    • 2007-05-30
    • Kazuhiko ItayaHiroshi YoshidaTakashi Kawakubo
    • Kazuhiko ItayaHiroshi YoshidaTakashi Kawakubo
    • H04B1/26
    • H01G5/18
    • A variable capacitance device has a piezoelectric driving part, a movable electrode, a fixed electrode, a dielectric film and a driving control unit. The piezoelectric driving part has a piezoelectric film, an upper electrode disposed on a top surface of the piezoelectric film, a lower electrode disposed on an undersurface of the piezoelectric film and electrode slits which separate the upper electrode and the lower electrode into two, respectively. The movable electrode is provided via the electrode slits at one end of the piezoelectric driving part. The fixed electrode is disposed opposite to the movable electrode via a gap. The dielectric film is disposed opposite to the movable electrode via the gap and provided on the fixed electrode. The driving control unit adjusts a distance between the movable electrode and the fixed electrode to reduce a fluctuation of a predetermined capacitance of a variable capacitor formed between the variable electrode and the fixed electrode.
    • 可变电容器件具有压电驱动部,可动电极,固定电极,电介质膜和驱动控制部。 压电驱动部分具有压电膜,设置在压电膜的顶表面上的上电极,设置在压电膜的下表面上的下电极以及分别将上电极和下电极分成两部分的电极狭缝。 可动电极通过电极狭缝设置在压电驱动部分的一端。 固定电极通过间隙与可动电极相对设置。 电介质膜经由间隙与可动电极相对设置,设置在固定电极上。 驱动控制单元调整可动电极和固定电极之间的距离,以减小形成在可变电极和固定电极之间的可变电容器的预定电容的波动。
    • 58. 发明授权
    • Method of mounting light emitting element
    • 发光元件的安装方法
    • US07264980B2
    • 2007-09-04
    • US11348210
    • 2006-02-06
    • Masafumi OzawaHiroshi YoshidaTakashi Kobayashi
    • Masafumi OzawaHiroshi YoshidaTakashi Kobayashi
    • H01L21/00H01L29/26
    • H01L21/681G02B6/4221H01S5/02252
    • The present invention provides a method of mounting a light emitting element, in which a light emission point can be positioned at high accuracy with respect to the mounting member. A semiconductor laser element is placed on a matching stage. Next, a position and an azimuth of a laser stripe of the semiconductor laser element is observed, and linear displacement in X and Y directions of the semiconductor laser element from a reference line and a reference point on the matching stage, and angular displacement in an azimuth (θ) within an X-Y plane are measured. In accordance with a measured result, a control signal is sent to a driving mechanism of the feeding collet to drive the feeding collet, and the position of the semiconductor laser element is adjusted on the matching stage. After the adjustment, the semiconductor laser element is fed to and placed on a mounting surface of a heat sink H.
    • 本发明提供了一种安装发光元件的方法,其中发光点可以相对于安装构件以高精度定位。 将半导体激光元件放置在匹配台上。 接下来,观察半导体激光元件的激光条的位置和方位角,并且从参考线和匹配台上的参考点在半导体激光元件的X和Y方向上的线性位移以及匹配台中的角位移 测量XY平面内的方位角(θ)。 根据测量结果,将控制信号发送到馈送夹头的驱动机构以驱动馈送夹头,并且在匹配台上调整半导体激光元件的位置。 在调整之后,半导体激光元件被馈送到放置在散热器H的安装表面上并被放置在散热器H的安装表面上。
    • 59. 发明申请
    • Fracture Prediction Device For Spot Welded Portion, Method Of The Same, Computer Program, And Computer Readable Recording Medium
    • 点焊部分断裂预测装置,方法,计算机程序和计算机可读记录介质
    • US20070199924A1
    • 2007-08-30
    • US10599921
    • 2005-04-12
    • Hiroshi YoshidaNaruhiko NomuraAkihiro Uenishi
    • Hiroshi YoshidaNaruhiko NomuraAkihiro Uenishi
    • B23K11/25
    • G01N3/24B23K11/11G01N3/08G01N2203/0067G01N2203/0214G01N2203/0216G01N2203/0218G01N2203/0296G06F17/5018
    • According to exemplary embodiments of the present invention, a fracture prediction device for a spot welded portion can be provided. For example, the device may include an input arrangement configured to input all or some of a material strength, a plate thickness, a nugget diameter of a spot welding, a plate width of a joint, and a rotation angle of the joint in a tension test, based on a cross tension test and/or a shear tension test at a spot welded joint. The device can also include a first calculation arrangement configured to calculate a fracture strength parameter of the spot welded portion from all or any of the material strength, the plate thickness, the nugget diameter of the spot welding, the plate width of the joint, and the rotation angle of the joint in the tension test. A parameter storage arrangement may also be provided which can be configured to store the fracture strength parameter by each steel type. Further, the device may further have a second calculation arrangement configured to determine a fracture of the spot welded portion by installing the fracture strength parameter stored in the parameter storage arrangement into a fracture prediction formula in which a deformation at a periphery of the spot welding is modeled by a finite element procedure. Exemplary embodiments of the method software arrangement and computer accessible medium performing similar procedures can also be provided.
    • 根据本发明的示例性实施例,可以提供一种用于点焊部分的断裂预测装置。 例如,设备可以包括输入装置,其被配置为输入材料强度,板厚度,点焊的熔核直径,接头的板宽度和接头处于张力的旋转角度的全部或一些 基于交叉拉伸试验和/或点焊接头处的剪切张力试验进行试验。 该装置还可以包括第一计算装置,其被配置为根据材料强度,板厚度,点焊的熔核直径,接头的板宽度以及所述点焊的直径来计算点焊部的断裂强度参数 接头在张力试验中的旋转角度。 还可以提供参数存储装置,其可被配置为通过每种钢种来存储断裂强度参数。 此外,该装置还可以具有第二计算装置,其被配置为通过将存储在参数存储装置中的断裂强度参数设置为断点预测公式来确定点焊部分的断裂,其中点焊周边的变形为 由有限元程序建模。 还可以提供方法软件配置和执行类似过程的计算机可访问介质的示例性实施例。