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    • 52. 发明授权
    • Resist material and pattern formation method
    • 抗蚀材料和图案形成方法
    • US07378216B2
    • 2008-05-27
    • US11128438
    • 2005-05-13
    • Shinji KishimuraMasayuki EndoMasaru SasagoMitsuru UedaHirokazu ImoriToshiaki Fukuhara
    • Shinji KishimuraMasayuki EndoMasaru SasagoMitsuru UedaHirokazu ImoriToshiaki Fukuhara
    • C08F12/30G03F7/00G03F7/004
    • G03F7/2041G03F7/0046G03F7/0397
    • A resist material has a base polymer containing a compound including a copolymer of a first unit represented by a general formula of the following Chemical Formula 1 and a second unit represented by a general formula of the following Chemical Formula 2: wherein R1, R2, R3, R7, and R8 are the same or different and are a hydrogen atom, a fluorine atom, or a straight-chain alkyl group, a branched or cyclic alkyl group or a fluoridated alkyl group with a carbon number not less than 1 and not more than 20; R4 is a straight-chain alkylene group or a branched or cyclic alkylene group with a carbon number not less than 0 and not more than 20; R5 and R6 are the same or different and are a hydrogen atom, a straight-chain alkyl group, a branched or cyclic alkyl group or a fluoridated alkyl group with a carbon number not less than 1 and not more than 20, or a protecting group released by an acid; and R9 is a fluorine atom, or a straight-chain alkyl group, a branched or cyclic alkyl group or a fluoridated alkyl group with a carbon number not less than 1 and not more than 20.
    • 抗蚀剂材料具有含有包含由以下化学式1的通式表示的第一单元与由下列化学式2的通式表示的第二单元的共聚物的化合物的基础聚合物:其中R 1 R 2,R 3,R 7,R 7和R 8相同或不同 碳原子数为1以上且20以下的氢原子,氟原子或直链烷基,支链或环状烷基或氟化烷基, R 4是直链亚烷基或碳数不小于0且不大于20的支链或环状亚烷基; R 5和R 6相同或不同,为氢原子,直链烷基,支链或环状烷基或氟化烷基,其中具有 碳数不小于1,不大于20,或由酸释放的保护基; R 9为碳原子数为1以上且20以下的氟原子,直链烷基,支链状或环状烷基或氟化烷基。
    • 59. 发明申请
    • PATTERN FORMATION METHOD
    • 模式形成方法
    • US20080193882A1
    • 2008-08-14
    • US11958661
    • 2007-12-18
    • Masayuki EndoMasaru Sasago
    • Masayuki EndoMasaru Sasago
    • G03F7/20
    • G03F7/0035G03F7/2041
    • After forming a lower layer film, an intermediate layer film and a first resist film on a substrate, a first resist pattern is formed by performing first exposure. Then, after a first intermediate layer pattern is formed by transferring the first resist pattern onto the intermediate layer film, a second resist film is formed thereon, and a second resist pattern is formed by performing second exposure. Thereafter, a second intermediate layer pattern is formed by transferring the second resist pattern onto the intermediate layer film. After removing the second resist film, the lower layer film is etched by using the second intermediate layer pattern as a mask, so as to form a lower layer pattern.
    • 在基板上形成下层膜,中间层膜和第一抗蚀剂膜之后,通过进行第一曝光来形成第一抗蚀剂图案。 然后,在通过将第一抗蚀剂图案转印到中间层膜上形成第一中间层图案之后,在其上形成第二抗蚀剂膜,并通过进行第二曝光形成第二抗蚀剂图案。 此后,通过将第二抗蚀剂图案转印到中间层膜上来形成第二中间层图案。 在除去第二抗蚀剂膜之后,通过使用第二中间层图案作为掩模来蚀刻下层膜,以形成下层图案。