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    • 55. 发明授权
    • Image sensor pixel structure employing a shared floating diffusion
    • 采用共享浮动扩散的图像传感器像素结构
    • US08405751B2
    • 2013-03-26
    • US12534427
    • 2009-08-03
    • Jason D. HibbelerDaniel N. MaynardKevin N. OggRichard J. Rassel
    • Jason D. HibbelerDaniel N. MaynardKevin N. OggRichard J. Rassel
    • H04N5/335
    • H01L27/14609H01L27/14641H01L27/14643H04N5/37457
    • A pixel structure for an image sensor includes a semiconductor material portion having a coplanar and contiguous semiconductor surface and including four photodiodes, four channel regions, and a common floating diffusion region. Each of the four channel regions is directly adjoined to one of the four photodiodes and the common floating diffusion region. The four photodiodes are located within four different quadrants as defined employing a vertical line passing through a point within the common floating diffusion region as a center axis. The common floating diffusion region, a reset gate transistor, a source follower transistor, and a row select transistor are located within four different quadrants as defined employing a vertical line passing through a point within one of the photodiodes as an axis.
    • 图像传感器的像素结构包括具有共面且相邻的半导体表面的半导体材料部分,包括四个光电二极管,四个沟道区域和公共的浮动扩散区域。 四个通道区域中的每一个直接邻接四个光电二极管和公共浮动扩散区域中的一个。 四个光电二极管位于四个不同的象限内,如使用通过公共浮动扩散区域内的点作为中心轴的垂直线所限定的。 公共浮动扩散区域,复位栅极晶体管,源极跟随器晶体管和行选择晶体管位于四个不同的象限内,如使用通过一个光电二极管内的点作为轴的垂直线所限定的。
    • 57. 发明授权
    • Stitched IC layout methods, systems and program product
    • 拼接IC布局方法,系统和程序产品
    • US07703060B2
    • 2010-04-20
    • US11678069
    • 2007-02-23
    • Timothy G. DunhamRobert K. LeidyKevin N. OggRichard J. RasselValarmathi C. Shanmugam
    • Timothy G. DunhamRobert K. LeidyKevin N. OggRichard J. RasselValarmathi C. Shanmugam
    • G06F17/50
    • G03F7/70475G03F7/70466G03F7/70691
    • Stitched integrated circuit (IC) chip layout methods, systems and program products are disclosed. In one embodiment, a method includes obtaining from a first entity a circuit design for an IC chip layout that exceeds a size of a photolithography tool field at a second entity, wherein the IC chip layout includes for at least one stitched region of a plurality of stitched regions: a boundary identification identifying a boundary of the at least one stitched region at which stitching occurs and a type indicator indicating whether the at least one stitched region is one of: redundant and unique; dissecting the IC chip layout into stitched regions indicated as unique or redundant at the second entity; and generating a photolithographic reticle at the second entity based on the plurality of stitched regions, the photolithographic reticle having a size that fits within the size of the photolithographic tool field at the second entity.
    • 公布了拼接集成电路(IC)芯片布局方法,系统和程序产品。 在一个实施例中,一种方法包括从第一实体获得超过第二实体上的光刻工具区域的尺寸的IC芯片布局的电路设计,其中IC芯片布局包括用于多个 缝合区域:识别发生缝合的至少一个缝合区域的边界的边界标识和指示所述至少一个缝合区域是否是以下之一的类型指示器:冗余且唯一; 将IC芯片布局解剖为在第二实体处表示为唯一或冗余的缝合区域; 以及基于所述多个缝合区域在所述第二实体处产生光刻掩模版,所述光刻掩模版具有适合在所述第二实体处的所述光刻工具区域的尺寸内的尺寸。