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51. 发明授权

US07298082B2 Organic electroluminescent display device with projecting structure layer 有权
标题翻译：具有突出结构层的有机电致发光显示装置
公开(公告)号：US07298082B2
公开(公告)日：2007-11-20
申请号：US10959975
申请日：2004-10-08
申请人： Jin-Woo Park
发明人： Jin-Woo Park
IPC分类号： H01J1/62 , H01J63/04
CPC分类号： H01L27/3244 , H01L27/3246 , H01L51/5203 , H01L51/5271 , H01L51/5275
摘要： The present invention relates to an organic electroluminescent display device in which luminance and emission efficiency may be improved by forming light emitting elements of the organic electroluminescent display device in a projecting structure and provides an organic electroluminescent display device comprising a projecting structure layer formed on an insulating substrate; first electrode formed in a projecting structure on the substrate including the projecting structure layer; an organic layer formed on the first electrode; and second electrode formed on the insulating substrate, wherein the second electrode may be formed in a projected shape by the projecting structure layer so that the second electrode surrounds the organic layer.
摘要翻译：本发明涉及通过将有机电致发光显示装置的发光元件形成为突出结构而提高亮度和发光效率的有机电致发光显示装置，并提供一种有机电致发光显示装置，其包括形成在绝缘体上的突出结构层基质; 第一电极，其形成在包括突出结构层的基板上的突出结构中; 形成在所述第一电极上的有机层; 以及形成在所述绝缘基板上的第二电极，其中所述第二电极可以通过所述突出结构层形成为突出形状，使得所述第二电极围绕所述有机层。

52. 发明申请

US20070170855A1 Organic light emitting display device and method of fabricating the same 有权
标题翻译：有机发光显示装置及其制造方法
公开(公告)号：US20070170855A1
公开(公告)日：2007-07-26
申请号：US11529891
申请日：2006-09-29
申请人： Dong-Soo Choi , Jin-Woo Park , Hee-Seong Jeong , Hyun-Sook Park
发明人： Dong-Soo Choi , Jin-Woo Park , Hee-Seong Jeong , Hyun-Sook Park
IPC分类号： H01J1/62 , H01J63/04
CPC分类号： H01L51/5246 , H01L27/3281 , H01L51/524 , H01L51/5281
摘要： Provided is an organic light emitting display device (OLED) for preventing Newton's rings to improve image quality. An organic light emitting display device according to one embodiment of the present invention comprises a first substrate comprising a single layer or multiple layers; a second substrate comprising a single layer or multiple layers, the second substrate comprising an inner surface facing the first substrate; an array of organic light emitting pixels formed on the first substrate and interposed between the first and second substrates, the array comprising a top surface opposing the inner surface of the second substrate, wherein the top surface and the inner surface has a gap therebetween, and the gap has a gap distance measured between the top surface and the inner surface; and a frit seal interconnecting the first and second substrates while surrounding the array, wherein the frit seal, the first substrate and the second substrate in combination define an enclosed space in which the array is located, wherein the frit seal has a height between the first and second substrates so as to form the gap distance equal to or greater than about 10 μm.
摘要翻译：提供了一种用于防止牛顿环改善图像质量的有机发光显示装置（OLED）。根据本发明的一个实施例的有机发光显示装置包括：包含单层或多层的第一衬底; 包括单层或多层的第二衬底，所述第二衬底包括面向所述第一衬底的内表面; 形成在所述第一基板上且介于所述第一和第二基板之间的有机发光像素阵列，所述阵列包括与所述第二基板的内表面相对的顶表面，其中所述顶表面和所述内表面之间具有间隙，以及间隙具有在顶表面和内表面之间测量的间隙距离; 以及玻璃料密封件，其在围绕所述阵列的同时连接所述第一和第二基板，其中所述玻璃料密封件，所述第一基板和所述第二基板组合限定所述阵列所位于的封闭空间，其中所述玻璃料密封件具有所述第一和第二基板，以便形成等于或大于约10um的间隙距离。

53. 发明授权

US09705084B2 Organic light emitting diode display and manufacturing method thereof 有权
公开(公告)号：US09705084B2
公开(公告)日：2017-07-11
申请号：US13461580
申请日：2012-05-01
申请人： Sang-Woo Pyo , Seung-Mook Lee , Byeong-Wook Yoo , Hyo-Yeon Kim , Myung-Jong Jung , Jin-Woo Park
发明人： Sang-Woo Pyo , Seung-Mook Lee , Byeong-Wook Yoo , Hyo-Yeon Kim , Myung-Jong Jung , Jin-Woo Park
IPC分类号： H01L51/52 , H01L51/00 , H01L51/50 , H01L27/32
CPC分类号： H01L51/0013 , H01L27/3211 , H01L51/5064 , H01L51/508
摘要： An organic light emitting diode (OLED) display includes a red pixel, a green pixel, and a blue pixel. The red pixel, the green pixel and the blue pixel each includes: a pixel electrode; a hole auxiliary layer on the pixel electrode; a blue organic emission layer on the hole auxiliary layer; an electron auxiliary layer on the blue organic emission layer; and a common electrode on the electron auxiliary layer. The red pixel and the green pixel include: a red boundary layer and a green boundary layer, respectively; a red resonance assistance layer and a green resonance assistance layer, respectively; and a red organic emission layer and a green organic emission layer formed between the red resonance assistance layer and the blue organic emission layer, and between the green resonance assistance layer and the blue organic emission layer, respectively.

54. 发明授权

US09224699B2 Method of manufacturing semiconductor package having magnetic shield unit 有权
标题翻译：制造具有磁屏蔽单元的半导体封装的方法
公开(公告)号：US09224699B2
公开(公告)日：2015-12-29
申请号：US14490105
申请日：2014-09-18
申请人： Jae-Gwon Jang , Jin-Woo Park , Jong-Ho Lee
发明人： Jae-Gwon Jang , Jin-Woo Park , Jong-Ho Lee
IPC分类号： H01L23/552 , H01L29/82 , H01L21/00 , H01L23/00 , H01L21/78 , H01L23/31
CPC分类号： H01L23/564 , H01L21/561 , H01L21/568 , H01L21/78 , H01L23/3128 , H01L23/3142 , H01L23/552 , H01L24/19 , H01L24/20 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/50 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/86 , H01L24/92 , H01L24/96 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L2224/04026 , H01L2224/04105 , H01L2224/05082 , H01L2224/05568 , H01L2224/05582 , H01L2224/12105 , H01L2224/131 , H01L2224/2919 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48 , H01L2224/48228 , H01L2224/73215 , H01L2224/73265 , H01L2224/73267 , H01L2224/85005 , H01L2224/92165 , H01L2224/92247 , H01L2224/94 , H01L2224/97 , H01L2225/0651 , H01L2225/06537 , H01L2225/06565 , H01L2225/1023 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2224/05599 , H01L2924/00 , H01L2924/00012 , H01L2924/014 , H01L2224/03 , H01L2224/83 , H01L2224/85 , H01L2224/48227
摘要： A method of manufacturing a semiconductor package having a magnetic shield function is provided. The method includes forming cracks in a lattice structure on an active surface in which electrode terminals are formed; grinding a back surface of a wafer facing the active surface, bonding a tape on the active surface of the wafer, expanding the tape such that the wafer on the tape is divided as semiconductor chips, forming a shield layer on surfaces of the semiconductor chips and the tape, cutting the shield layer between the semiconductor chips and individualizing as each of the semiconductor chips which has a first shield pattern formed on back surface and sides, bonding the semiconductor chips on a substrate, and forming a second shield pattern on each of the active surfaces of the semiconductor chips, wherein the semiconductor chips and the substrate are physically and electrically connected by a bonding wire.
摘要翻译：提供一种制造具有磁屏蔽功能的半导体封装的方法。该方法包括在其中形成电极端子的有源表面上形成栅格结构中的裂纹; 研磨面向活性表面的晶片的背面，将胶带粘合在晶片的有效表面上，使胶带膨胀，使得胶带上的晶片被划分为半导体芯片，在半导体芯片的表面上形成屏蔽层，在所述半导体芯片之间切割所述屏蔽层，并且将每个所述半导体芯片分别形成在所述半导体芯片的背面和侧面上形成第一屏蔽图案并且将所述半导体芯片接合在基板上，并在所述半导体芯片的每一个上形成第二屏蔽图案半导体芯片的有源表面，其中半导体芯片和基板通过接合线物理和电连接。

55. 发明授权

US08891048B2 Liquid crystal display with integrated touch screen panel and driving method thereof 有权
标题翻译：具有集成触摸屏面板的液晶显示器及其驱动方法
公开(公告)号：US08891048B2
公开(公告)日：2014-11-18
申请号：US13238288
申请日：2011-09-21
申请人： Jin-Woo Park , Sang-Jin Pak , Jin-Hee Lee , Sang-Kwon Ha , Ji-Gong Lee , Hideo Yoshimura , Cheol-Min Kim , Joo-Hyung Lee
发明人： Jin-Woo Park , Sang-Jin Pak , Jin-Hee Lee , Sang-Kwon Ha , Ji-Gong Lee , Hideo Yoshimura , Cheol-Min Kim , Joo-Hyung Lee
IPC分类号： G02F1/1343 , G02F1/1333 , G06F3/044 , G09G3/36
CPC分类号： G02F1/13338 , G02F2001/134318 , G06F3/044 , G09G3/3648 , G09G2310/0218 , G09G2310/0227
摘要： A liquid crystal display (LCD) with an integrated touch screen panel includes a plurality of pixels connected to a plurality of data lines and a plurality of gate lines, the gate lines being divided into a plurality of groups, a plurality of sensing electrodes, a plurality of common electrodes divided into a plurality of groups, a common electrode driver configured to simultaneously supply a driving signal to common electrodes within each group of the plurality of groups of the common electrodes, and to sequentially supply the driving signal to the plurality of groups of the common electrodes, and a gate driver configured to sequentially supply a gate signal to gate lines within each of the plurality of group of the gate lines.
摘要翻译：具有集成触摸屏面板的液晶显示器（LCD）包括连接到多条数据线和多条栅极线的多个像素，栅极线被分成多个组，多个检测电极，多个公共电极被分成多个组，公共电极驱动器，被配置为同时向多个公共电极组的每组中的公共电极提供驱动信号，并且将驱动信号顺序地提供给多个组以及栅极驱动器，其被配置为向所述多组栅极线中的每一组中的栅极线顺序地提供栅极信号。

56. 发明授权

US08754515B2 Stacked packages having through hole vias 有权
标题翻译：具有通孔通孔的堆叠封装
公开(公告)号：US08754515B2
公开(公告)日：2014-06-17
申请号：US13614931
申请日：2012-09-13
申请人： Tae-Hun Kim , Jin-Woo Park , Dae-Young Choi , Mi-Yeon Kim , Sun-Hye Lee
发明人： Tae-Hun Kim , Jin-Woo Park , Dae-Young Choi , Mi-Yeon Kim , Sun-Hye Lee
IPC分类号： H01L23/02 , H01L21/00 , H01L25/065 , H01L25/10 , H01L25/00 , H01L21/78 , H01L23/48 , H01L23/00 , H01L23/31
CPC分类号： H01L23/5226 , H01L21/78 , H01L23/3128 , H01L23/481 , H01L24/14 , H01L24/81 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L25/50 , H01L2224/13022 , H01L2224/13025 , H01L2224/14181 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/17181 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48225 , H01L2224/48227 , H01L2224/73204 , H01L2224/94 , H01L2225/06541 , H01L2225/06565 , H01L2225/1005 , H01L2225/1023 , H01L2225/1052 , H01L2225/1058 , H01L2924/01019 , H01L2924/10253 , H01L2924/12042 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00 , H01L2224/11 , H01L2924/00012
摘要： Provided is a method of forming a package-on-package. An encapsulation is formed to cover a wafer using a wafer level molding process. The wafer includes a plurality of semiconductor chips and a plurality of through silicon vias (TSVs) passing through the semiconductor chips. The encapsulant may have openings aligned with the TSVs. The encapsulant and the semiconductor chips are divided to form a plurality of semiconductor packages. Another semiconductor package is stacked on one selected from the semiconductor packages. The other semiconductor package is electrically connected to the TSVs.
摘要翻译：提供了一种形成封装封装的方法。使用晶片级成型工艺形成覆盖晶片的封装。晶片包括多个半导体芯片和穿过半导体芯片的多个通孔硅通孔（TSV）。密封剂可以具有与TSV对齐的开口。密封剂和半导体芯片被分割以形成多个半导体封装。另一个半导体封装堆叠在从半导体封装中选择的一个上。另一个半导体封装电连接到TSV。

57. 发明授权

US08749505B2 Touch screen panel 有权
标题翻译：触摸屏面板
公开(公告)号：US08749505B2
公开(公告)日：2014-06-10
申请号：US13284802
申请日：2011-10-28
申请人： Sang-Kwon Ha , Joo-Hyung Lee , Jin-Woo Park , Sang-Jin Pak , Ji-Gong Lee , Hideo Yoshimura
发明人： Sang-Kwon Ha , Joo-Hyung Lee , Jin-Woo Park , Sang-Jin Pak , Ji-Gong Lee , Hideo Yoshimura
IPC分类号： G06F3/0488
CPC分类号： G06F3/0412 , G06F3/0418
摘要： A touch screen panel includes a display unit including a timing controller for receiving a vertical synchronizing signal and a horizontal synchronizing signal to display an image, a touch sensing unit including driving electrodes, a control signal generator for generating a control signal from the vertical synchronizing signal and the horizontal synchronizing signal, and a touch controller for supplying a driving signal to the touch sensing unit in response to the control signal from the control signal generator.
摘要翻译：触摸屏面板包括显示单元，其包括用于接收垂直同步信号的定时控制器和用于显示图像的水平同步信号，包括驱动电极的触摸感测单元，用于从垂直同步信号产生控制信号的控制信号发生器和水平同步信号，以及触摸控制器，用于响应于来自控制信号发生器的控制信号向触摸感测单元提供驱动信号。

58. 发明授权

US08690865B2 Methods and devices for thermal treatment 有权
标题翻译：热处理方法和装置
公开(公告)号：US08690865B2
公开(公告)日：2014-04-08
申请号：US11597969
申请日：2005-05-31
申请人： Mark R. Prausnitz , Mark G. Allen , Jung-Hwan Park , Yong-Kyu Yoon , Jin-Woo Park
发明人： Mark R. Prausnitz , Mark G. Allen , Jung-Hwan Park , Yong-Kyu Yoon , Jin-Woo Park
IPC分类号： A61B18/08 , A61N1/30
CPC分类号： A61K9/0004 , A61B5/14514 , A61B18/082 , A61B18/10 , A61B2018/00005 , A61B2018/00613 , A61K9/7023 , A61K41/0047 , A61M37/0015 , A61M37/0092 , A61M2037/0007 , A61M2037/0046 , A61N1/0412 , A61N1/0476 , A61N1/0492 , A61N1/327
摘要： The present invention comprises methods and devices for thermal treatment of a barrier to increase the permeability of the barrier. One form of increasing the permeability of the barrier comprises forming micropores which may be used for administration of active agents across the barrier, or may be used for sampling or collecting fluids, or may be used for detecting, measuring or determining analytes, or may be used for monitoring of physiological or other conditions. Devices of the present invention may comprise microheaters that are activated by inductive or ohmic heating power supply components.
摘要翻译：本发明包括用于热处理屏障以增加屏障的渗透性的方法和装置。增加屏障渗透性的一种形式包括形成微孔，该微孔可用于通过阻挡层施用活性剂，或可用于取样或收集流体，或可用于检测，测量或确定分析物，或者可以是用于监测生理或其他条件。本发明的装置可以包括由电感或欧姆加热电源部件激活的微热电。

59. 发明申请

US20130306969A1 THIN FILM TRANSISTOR AND PIXEL CIRCUIT HAVING THE SAME 有权
标题翻译：薄膜晶体管和具有该薄膜晶体管的像素电路
公开(公告)号：US20130306969A1
公开(公告)日：2013-11-21
申请号：US13585549
申请日：2012-08-14
申请人： Jin-Woo Park , Dong-Hwan Kim
发明人： Jin-Woo Park , Dong-Hwan Kim
IPC分类号： H01L29/786 , H01L33/16
CPC分类号： H01L29/78696 , G09G3/3208 , H01L27/0705 , H01L29/41733
摘要： A thin film transistor which may be included in a pixel circuit includes: a substrate; a semiconductor layer formed on the substrate and including a source region, a first drain region spaced apart from the source region by a first current path, and a second drain region spaced apart from the source region by a second current path having a length different from that of the first current path; a gate electrode insulated from the semiconductor layer by a gate insulating layer; a source electrode connected to the source region of the semiconductor layer; a first drain electrode connected to the first drain region of the semiconductor layer; and a second drain electrode connected to the second drain region of the semiconductor layer. Currents having different magnitudes may be simultaneously provided through the first current path and the second current path.
摘要翻译：可以包括在像素电路中的薄膜晶体管包括：衬底; 半导体层，其形成在所述基板上，并且包括源极区域，通过第一电流路径与所述源极区域间隔开的第一漏极区域和与所述源极区域间隔开的第二漏极区域，所述第二电流路径的长度不同于第一条当前路径; 通过栅极绝缘层与半导体层绝缘的栅电极; 源极连接到半导体层的源极区; 连接到半导体层的第一漏区的第一漏电极; 以及连接到半导体层的第二漏区的第二漏电极。可以通过第一电流路径和第二电流路径同时提供具有不同幅度的电流。

60. 发明授权

US08497569B2 Package substrates and semiconductor packages having the same 有权
标题翻译：封装衬底和具有该衬底的半导体封装
公开(公告)号：US08497569B2
公开(公告)日：2013-07-30
申请号：US13042855
申请日：2011-03-08
申请人： Jin-Woo Park , Hwan-Sik Lim , Eunchul Ahn
发明人： Jin-Woo Park , Hwan-Sik Lim , Eunchul Ahn
IPC分类号： H01L21/311
CPC分类号： H01L21/50 , H01L21/563 , H01L23/48 , H01L23/58 , H01L2224/16225 , H01L2224/26175 , H01L2224/32225 , H01L2224/73204 , H01L2224/83385 , H01L2924/00012
摘要： A package substrate, a semiconductor package having the same, and a method for fabricating the semiconductor package. The semiconductor package includes a semiconductor chip, a package substrate, and a molding layer. The package substrate provides a region mounted with the semiconductor chip. The molding layer is configured to mold the semiconductor chip. The package substrate includes a first opening portion that provides an open region connected electrically to the semiconductor chip and extends beyond sides of the semiconductor chip to be electrically connected to the semiconductor chip.
摘要翻译：封装基板，具有该封装基板的半导体封装以及半导体封装的制造方法。半导体封装包括半导体芯片，封装基板和模制层。封装衬底提供安装有半导体芯片的区域。模制层被配置成模制半导体芯片。封装基板包括第一开口部分，该第一开口部分提供与半导体芯片电连接的开放区域，并且延伸超过半导体芯片的两侧以与半导体芯片电连接。

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