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51. 发明专利

JPS5859440A PHOTOSENSITIVE POLYMER COMPOSITION 失效
公开(公告)号：JPS5859440A
公开(公告)日：1983-04-08
申请号：JP15751681
申请日：1981-10-05
申请人： HITACHI LTD , HITACHI CHEMICAL CO LTD
发明人： KATAOKA FUMIO , SHIYOUJI FUSAJI , OBARA ISAO , TAKEMOTO KAZUNARI , YOKONO ATARU , ISOGAI TOKIO , KOJIMA MITSUMASA
IPC分类号： C08L79/08 , G03F7/008 , G03G5/07
摘要： PURPOSE:To enhance solubility in an aprotic polar solvent and compatibility with a polyamide carboxylic acid, by using an aromatic bisazide having a polar group or an org. silicon group introduced into the molecule as a photoinitiator for preparing a polyamide carboxylic acid having photosensitivity. CONSTITUTION:A polymer contg. a polyamide carboxylic acid or its derivative having a photosensitive unsatd. bond in a side chain of each unit of one of monomer unit constituents represented by general formulaIgives a relief structure of a heat resistant polymer, and an aromatic bisazide compd. having formula II as a photoinitiator, and when needed, a sensitizer are added to said polyamide acid. Since this is a polar polymer, uses of said aromatic bisazide compd. into which a polar group or an org. silicon group is introduced raises mutual action and enhances sensitivity. A relief pattern obtained by exposure and development is precursor of a heat resistant polyimide, so it is converted into a heat resistant polymer by heat treatment. In the formulaI, R , R , R are each aromatic group; R is a group having an unsatd. bond, or H or ammonium ion; Y is a group having an unsatd. group; X is a divalent group linking R and Y; W is H or X-Y; (n) is 1 or 2; (x) is 3-100; and COOR is combined to the ortho- or para- position of the amide group. In formula II, P is N3, or -SO2N3; R is a trivalent org. group; and Z is -OH, or -OR , and R being lower alkyl.

52. 发明专利

JPS5858540A PHOTOSENSITIVE POLYMER COMPOSITION 失效
公开(公告)号：JPS5858540A
公开(公告)日：1983-04-07
申请号：JP15751581
申请日：1981-10-05
申请人： HITACHI LTD , HITACHI CHEMICAL CO LTD
发明人： KOJIMA MITSUMASA , KATAOKA FUMIO , SHIYOUJI FUSAJI , OBARA ISAO , TAKEMOTO KAZUNARI , YOKONO ATARU , ISOGAI TOKIO
IPC分类号： C08L79/08 , G03F7/012 , G03F7/038 , G03G5/07
摘要： PURPOSE:To obtain a photosensitive polymer composition suitable for manufacture of semiconductors, high in sensitivity, good in viscosity stability, and superior in heat resistance, insulation resistance, etc., by adding each specified polyamide, bisazide, and amine compd. and when needed, a sensitizer. CONSTITUTION:A dimethylformamide or the like solution contains a compsn. of a polymer having formulaI(R is >=2C tri- or tetra-valent group; M is H or an alkali metal; and (n) is 1 or 2) a bisazide compd. having formula II (R3 is a divalent org. group), and an amine compd. having H combined to a tertiary or secondary carbon, or an unsubstd. group in the molecule, and further when needed, a sensitizer. This compsn. is coated on a base, dried, exposed, developed, and heated to obtain a relief pattern of polybenzoxadinone. The obtained film has high sensitivity, superior insulation resistance due to absence of inorg. salts, and high heat resistance, and said soln. of the compsn. has good viscosity stability during storage.

53. 发明专利

JPS582456B2 失效
公开(公告)号：JPS582456B2
公开(公告)日：1983-01-17
申请号：JP6348176
申请日：1976-06-02
申请人： HITACHI LTD
发明人： NISHIKAWA AKIO , YOKONO ATARU , MUKAI JUNJI , SHIMIZU RYUICHI
IPC分类号： C08G18/00 , C08G18/79 , H01L23/08 , H01L23/29 , H01L23/31

54. 发明专利

JPS57188694A FORMATION OF METALLIC FILM ON TRANSPARENT CONDUCTIVE FILM 失效
公开(公告)号：JPS57188694A
公开(公告)日：1982-11-19
申请号：JP7075581
申请日：1981-05-13
申请人： HITACHI LTD
发明人： MATSUYAMA HARUHIKO , NAKATANI MITSUO , OKUNAKA MASAAKI , YOKONO ATARU , ISOGAI TOKIO , MATSUKUMA KUNIHIRO , SUDA KOUICHI , SAITOU TADASHI
IPC分类号： C25D7/00 , C23F1/02 , C25D5/02
摘要： PURPOSE:To form metallic films of high volume productivity and connection reliability by electroplating the desired parts of the metallic film formed over the entire surface of a transparent conductive film of oxide of In, Sn, etc. then etching away the metallic film of the non-plating parts. CONSTITUTION:A metal 3 is formed on a transparent condctive film 2 selected from In2O3, SnO2, In2O3-SnO2, SnO2-Sb2O3 formed on the surface of a substrate 1. A plating mask 4 is applied on this and electroplating films 5 are formed on desired parts; further, the film 3 other than the plated parts is etched away. In this way, the metallic films consisting of the films 3 and 5 are formed on the film 2. A vapor deposition method, a sputtering method, an electroless plating method or the like is usable for the formation of the film 3.

55. 发明专利

JPS57180196A METHOD OF PRODUCING CIRCUIT BOARD 失效
公开(公告)号：JPS57180196A
公开(公告)日：1982-11-06
申请号：JP6392881
申请日：1981-04-30
申请人： HITACHI LTD , SANKI ENG CO LTD
发明人： TANAKA ISAMU , MATSUO AKIRA , OKA HITOSHI , KIKUCHI HIROSHI , MIYAZAWA OSAMU , YOKONO ATARU , ISOGAI TOKIO
IPC分类号： H05K3/42 , H05K3/18

56. 发明专利

JPS5795432A MOLD STRUCTURE FOR REACTION INJECTION MOLDING 失效
公开(公告)号：JPS5795432A
公开(公告)日：1982-06-14
申请号：JP17099280
申请日：1980-12-05
申请人： HITACHI LTD
发明人： NAKAMURA SHIYOUZOU , GOTOU MASAO , YOKONO ATARU , KOUYA KENICHI
IPC分类号： B29C45/34 , B29B13/00 , B29C33/00 , B29C33/10 , B29C33/38 , B29C43/00 , B29C45/26 , B29C67/24
摘要： PURPOSE:To make sure the exhaustion of gas in a cavity and manufacture RIM products without voids by inserting porous bodies that have pores communicating with outer air to suitable spots on the face of a metallic mold. CONSTITUTION:Metallic molds 2 and 3 for RIM (reaction injection molding) have at their portions where gas is liable to be trapped (for example, concave portions such as boss, rib, etc.) porous bodies 19 inserted to communicate the cavity 6 with outer air. Because gas left in the cavity 6 is completely expelled through the porous bodies 19, the products in the molds are free of voids. The porous body 19 here is made by pressing and forming metallic grains Al, Zn, etc.) of 5-50mum in diameter with a binder for them.

57. 发明专利

JPS5781224A Production of plastic optical connector 失效
标题翻译：生产塑料光连接器
公开(公告)号：JPS5781224A
公开(公告)日：1982-05-21
申请号：JP15758380
申请日：1980-11-11
申请人： Hitachi Ltd
发明人： SATOU HIDEMI , KANEDA AIZOU , YOKONO ATARU , OOHASHI TOKUYOSHI , MIYAKE KIYOHIDE , KODAMA TOSHIROU , SUZUKI KIICHI
IPC分类号： G02B6/38
CPC分类号： G02B6/3865 , G02B6/3863
摘要： PURPOSE:To improve dimensional accuracy by placing all of a hollow hole for specifying the accuracy of a connector and an optical fiber insertion hole penetrated in this and a projection provided to a stationary core pin in a stationary die part. CONSTITUTION:A projection 8' of a small circular cylinder is provided at the center of the leading end of a stationary core pin 8, and is so formed as to fit the leading end part of a movable core pin 8. Plastic molding dies 2 are used and after the dies are clamped, a moving core pin 6 is advanced to fit the leading end thereof onto the leading end part of the projection 8'. Next, a resin is injected into a cavity 7, and is molded, after which the pin 6 is retreated and the molded optical connector is removed. Thereby, the accuracy of the axial center alignment of the optical fiber insertion hole and the optical connector body is improved.
摘要翻译：目的：通过放置用于指定连接器的精度的所有中空孔和穿入其中的光纤插入孔以及设置在固定模具部件中的固定芯销的突起来提高尺寸精度。构成：在固定芯销8的前端的中央设置有小圆筒的突起8'，并且形成为与可动芯针8的前端部嵌合。塑料成形模具2为使用并且在模具被夹紧之后，移动的芯销6前进以将其前端装配到突起8'的前端部分上。接下来，将树脂注入空腔7中，并将其模制，然后将销6退回并且将模制的光连接器移除。由此，提高了光纤插入孔和光连接体的轴向中心对准的精度。

58. 发明专利

JPS5763234A Rim molded substance and molding thereof 失效
标题翻译： RIM模塑物品和模具
公开(公告)号：JPS5763234A
公开(公告)日：1982-04-16
申请号：JP13679280
申请日：1980-10-02
申请人： Hitachi Ltd
发明人： NAKAMURA SHIYOUZOU , KOUYA KENICHI , GOTOU MASAO , YOKONO ATARU
IPC分类号： B29C45/14 , B29C43/00 , B29C45/26 , B29C67/24 , B29C70/64
CPC分类号： B29C67/246 , B29C70/64
摘要： PURPOSE:To obtain a RIM molded substance with reformed properties such as flexural strength, stiffness and heat resistance by mixing magnetic metal powder with a skin layer at the time of RIM molding for strengthening the skin layer. CONSTITUTION:After measuring polyol (an undiluted solution A) and isocyanate (an undiluted solution B) at 1:1 both undiluted solutions are fed nto a mixing head 12 through, for instance, a hose 13 and here said solutions are implinged and mixed at high speed to be injected into a mold. Prior to said injection, in the opened state of the mold the magnetic metal powder 19 such as silane-treated iron powder etc. is uniformly spread on the surface f the cavity of the upper mold 2, 2A and the lower mold 3, 3A built-in with magnetic substances 18 of form a layer of metal powder of about 0.3mm. of the magnetic substances. Metal powder 19 of the magnetic substances remains closely adhered to the surface of the cavity 6 owing to magnetism of the magnetic substances 18 so as to be solidified after holding about 3-4 minutes after injection of the undiluted solution to obtain a RIM molded substance 15A having a strong skin layer 16A.
摘要翻译：目的：通过在RIM模制时将磁性金属粉末与表皮层混合来获得具有改性性能如弯曲强度，刚度和耐热性的RIM模制物质，以增强表皮层。构成：在以1:1的方式测量多元醇（未稀释的溶液A）和异氰酸酯（未稀释的溶液B）之后，将未稀释的溶液通过例如软管13供给到混合头12中，并且这里所述溶液被包埋并混合在高速注入模具。在所述注射之前，在模具的打开状态下，诸如硅烷处理的铁粉等的磁性金属粉末19均匀地分布在上模具2A，2A和下模具3A，3A的内腔的表面上其中磁性物质18形成约0.3mm的金属粉末层。的磁性物质。磁性物质的金属粉末19由于磁性物质18的磁性而保持紧密地附着到空腔6的表面，以便在注射未稀释溶液后保持约3-4分钟后固化，得到RIM模制物质15A 具有强的表皮层16A。

59. 发明专利

JPS5740557A Resin composition for sealing electronic part and sealing method of electronic part 失效
标题翻译：密封电子部件的树脂组合物和电子部件的密封方法
公开(公告)号：JPS5740557A
公开(公告)日：1982-03-06
申请号：JP11478480
申请日：1980-08-22
申请人： Hitachi Ltd
发明人： EBINUMA NAOTAKE , KANEDA AIZOU , YOKONO ATARU
IPC分类号： C08L81/00 , B29C35/00 , B29C45/14 , C08L81/02 , H01B3/30 , H01G4/224 , H01L21/56 , H01L23/29 , H01L23/31
摘要： PURPOSE: The titled resin composition consisting of polyphenylene sulfide and a fine particulate inorganic filler of specific particle diameter without causing the deterioration in electrical characteristics in use and disconnection of bonding wires.
CONSTITUTION: A resin composition consisting of 40W70wt% polyphenylene sulfide and 60W30wt% fine particulate inorganic filler, e.g. silica or alumina, having the maximum particle diameter of 100μ and an average particle diameter of 40W50μ. The addition of polycarbonate, polyimide and silicone resin reduces the elasticity of the composition, and the addition of a surfactant, e.g. a silane coupling agent, improves the adhesive force. An electronic part is sealed in the resultant resin composition at an internal pressure in a mold cavity of 20W500kg/cm
2 , a resin temperature in a nozzle of 280W360°C and a mold temperature of 100W200°C by using an injection molding machine equipped with a nozzle having a shut-off valve or further a gas vent mechanism.
COPYRIGHT: (C)1982,JPO&Japio
摘要翻译：目的：由聚苯硫醚和特定粒径的细颗粒无机填料组成的标题树脂组合物，不会导致接合线的使用和断开中的电特性的劣化。构成：由40-70重量％聚苯硫醚和60-30重量％细颗粒无机填料组成的树脂组合物，二氧化硅或氧化铝，其最大粒径为100微米，平均粒径为40-50微米。聚碳酸酯，聚酰亚胺和有机硅树脂的添加降低了组合物的弹性，并且添加了表面活性剂，例如，硅烷偶联剂，提高粘合力。将电子部件密封在所得树脂组合物中，模腔内部压力为20-500kg / cm 2，喷嘴中的树脂温度为280-360℃，模具温度为100-200度通过使用配备有具有截止阀的喷嘴或另外的排气机构的注射成型机。

60. 发明专利

JPS5732360A Method and device for regeneration of chemical copper plating solution 失效
标题翻译：用于再生化学镀铜溶液的方法和装置
公开(公告)号：JPS5732360A
公开(公告)日：1982-02-22
申请号：JP10773980
申请日：1980-08-07
申请人： Hitachi Ltd
发明人： KIKUCHI HIROSHI , OKA HITOSHI , YOKONO ATARU , SUZUKI HARUO , YOSHIMURA TOYOFUSA , MATSUO AKIRA , MIYAZAWA OSAMU , TANAKA ISAMU , ISOGAI TOKIO
IPC分类号： C23C18/16 , B01D61/44 , C23C18/31 , C23C18/40
CPC分类号： B01D61/44
摘要： PURPOSE: To selectively remove harmful ions without causing change of properties of a chemical copper plating soln. wherein harmful ions are accumulated through plating operation, and regenerate the plating soln. by subjecting said plating soln. to combined treatments of ion exchanging and electrodialysis.
CONSTITUTION: Cu ions, reducing agents and hydroxyl ions are replenished respectively from replenishing vessels 2, 3, 4, into a chemical Cu plating vessel 1, whereby chemical Cu plating is accomplished. To remove the harmful Na, So
4 , HCOO, CO
3 ions, etc. having been accumulated by the plating, first the soln. is introduced into an ion exchange vessel 5, where it is allowed to contact with anion exchange resins to exchange SO
4 ions and CO
3 ions to HCOO ions. Next, it is introduced into an electrodialysis vessel 6, where the HCOO ions and harmful ions of alkali metal ions such as Na are separated from chelated Cu ions, chelating agents, etc. as essential components and are selectively removed by electrodialysis, after which they are reflowed to a concd. liquid vessel 7. The regenerated plating soln. is reflowed to the vessel 1.
COPYRIGHT: (C)1982,JPO&Japio
摘要翻译：目的：选择性地去除有害离子，而不会改变化学镀铜溶液的性能。其中通过电镀操作累积有害离子，并再生电镀溶液。通过对所述电镀溶液进行处理。进行离子交换和电渗析的组合处理。构成：将Cu离子，还原剂和羟基离子分别从补充容器2,3,4补充到化学镀铜容器1中，从而实现化学镀铜。为了除去已经通过电镀积累的有害的Na，So4，HCOO，CO3离子等，首先是溶胶。被引入到离子交换容器5中，在那里与阴离子交换树脂接触以将SO 4离子和CO 3离子交换成HCOO离子。接下来，将其引入电渗析容器6中，其中HCOO离子和碱金属离子如Na的有害离子与螯合的Cu离子，螯合剂等作为必要组分分离，并通过电渗析选择性除去，之后它们被回流到一个concd。液体容器7.再生电镀溶液。被回流到船只1。

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