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    • 53. 发明授权
    • Analyzer
    • 分析仪
    • US08293194B2
    • 2012-10-23
    • US12450467
    • 2008-03-26
    • Hideki NishimuraYasushi Dobuchi
    • Hideki NishimuraYasushi Dobuchi
    • G01N15/06G01N33/00G01N33/48
    • G01N33/4875G01N27/3273Y10T436/11
    • The present invention relates to an analyzing device to be used by inserting an analytical instrument 2 comprising a plurality of terminal portions 25A to 28A therein, the device including a plurality of terminals 42 and 43 having a shape of a flat spring to be in contact with the plurality of terminal portions 25A to 28A, and a disposal mechanism for disposing of the analytical instrument 2 after completing an analysis. Contact portions 46 and 47 in the plurality of terminals 42 and 43 having a flat-spring shape to be in contact with the plurality of terminal portions 25A to 28A are placed to be in non-parallel with a direction orthogonal to a disposal direction D1 of the analytical instrument 2 in planar view. The portions 46 and 47 in the plurality of terminals 42 and 43 having the flat-spring shape are preferably placed so as to have a symmetrical or substantially symmetrical positional relationship relative to a center line L1 of the analytical instrument 2 extending along the disposal direction D1.
    • 本发明涉及通过将包括多个端子部分25A至28A的分析仪器2插入其中而使用的分析装置,该装置包括具有与弹簧形状接触的多个端子42和43 多个端子部25A〜28A,以及完成分析后的处理分析用具2的处置机构。 具有与多个端子部25A〜28A接触的平坦弹簧形状的多个端子42和43中的接触部分46和47被放置成与与处理方向D1正交的方向不平行 分析仪器2在平面视图中。 具有扁平弹簧形状的多个端子42和43中的部分46和47优选地被放置成相对于沿着处理方向D1延伸的分析仪器2的中心线L1具有对称或基本上对称的位置关系 。
    • 55. 发明授权
    • Chemical mechanical polishing pad and chemical mechanical polishing process
    • 化学机械抛光垫和化学机械抛光工艺
    • US07354527B2
    • 2008-04-08
    • US11219843
    • 2005-09-07
    • Hiroyuki TanoHideki NishimuraHiroshi Shiho
    • Hiroyuki TanoHideki NishimuraHiroshi Shiho
    • B44C1/22
    • B24B37/24
    • A chemical mechanical polishing pad which has a storage elastic modulus E′(30° C.) at 30° C. of 120 MPa or less and an (E′(30° C.)/E′(60° C.)) ratio of the storage elastic modulus E′(30° C.) at 30° C. to the storage elastic modulus E′(60° C.) at 60° C. of 2.5 or more when the storage elastic moduli of a polishing substrate at 30° C. and 60° C. are measured under the following conditions: initial load: 100 g maximum bias: 0.01 % frequency: 0.2 Hz. A chemical mechanical polishing process makes use of the above chemical mechanical polishing pad. The chemical mechanical polishing pad can suppress the production of a scratch on the polished surface in the chemical mechanical polishing step and can provide a high-quality polished surface, and the chemical mechanical polishing process provides a high-quality polished surface by using the chemical mechanical polishing pad.
    • 在30℃下的储能弹性模量E'(30℃)为120MPa以下,(E'(30℃)/ E'(60℃))的化学机械研磨垫) 当研磨基材的储存弹性模量为60℃时,30℃下的储能弹性模量E'(30℃)与60℃下的储能弹性模量E'(60℃)的比为2.5以上 在以下条件下测量30℃和60℃:初始负荷:最大偏压100g:0.01%频率:0.2Hz。 化学机械抛光工艺利用上述化学机械抛光垫。 化学机械抛光垫可以在化学机械抛光步骤中抑制抛光表面产生划痕,并可提供高质量的抛光表面,化学机械抛光工艺通过使用化学机械 抛光垫
    • 56. 发明申请
    • Liquid crystal panel module and liquid crystal display device using the same
    • 液晶面板模块和使用其的液晶显示装置
    • US20080079864A1
    • 2008-04-03
    • US11905072
    • 2007-09-27
    • Hideki Nishimura
    • Hideki Nishimura
    • G02F1/1333
    • G02F1/13452
    • Disclosed is a liquid crystal display panel module. The liquid crystal display panel module includes a liquid crystal display panel in which a liquid crystal layer is sandwiched between a pair of substrates facing each other, a printed wiring board which is electrically connected to the liquid crystal display panel, a first frame-shaped chassis which is arranged in front of the liquid crystal display panel, and a second frame-shaped chassis which is electrically conductive and arranged behind of the liquid crystal display panel. In the liquid crystal display panel module, the liquid crystal display panel is held by the first chassis and the second chassis. And, the second chassis and a grounding electrode of the printed wiring board are electrically connected by attaching the printed wiring board to the second chassis.
    • 公开了一种液晶显示面板模块。 液晶显示面板模块包括液晶显示面板,液晶层夹在一对彼此相对的基板之间,电连接到液晶显示面板的印刷电路板,第一框架 其布置在液晶显示面板的前面,并且第二框架底座是导电的并且布置在液晶显示面板后面。 在液晶显示面板模块中,液晶显示面板由第一机架和第二机架保持。 并且,通过将印刷线路板附接到第二机架,印刷线路板的第二机架和接地电极电连接。
    • 58. 发明申请
    • Chemical mechanical polishing pad and chemical mechanical polishing process
    • 化学机械抛光垫和化学机械抛光工艺
    • US20060060569A1
    • 2006-03-23
    • US11219843
    • 2005-09-07
    • Hiroyuki TanoHideki NishimuraHiroshi Shiho
    • Hiroyuki TanoHideki NishimuraHiroshi Shiho
    • C03C15/00
    • B24B37/24
    • A chemical mechanical polishing pad which has a storage elastic modulus E′ (30° C.) at 30° C. of 120 MPa or less and an (E′ (30° C.)/E′ (60° C.)) ratio of the storage elastic modulus E′ (30° C.) at 30° C. to the storage elastic modulus E′ (60° C.) at 60° C. of 2.5 or more when the storage elastic moduli of a polishing substrate at 30° C. and 60° C. are measured under the following conditions: initial load: 100 g maximum bias: 0.01 % frequency: 0.2 Hz. A chemical mechanical polishing process makes use of the above chemical mechanical polishing pad. The chemical mechanical polishing pad can suppress the production of a scratch on the polished surface in the chemical mechanical polishing step and can provide a high-quality polished surface, and the chemical mechanical polishing process provides a high-quality polished surface by using the chemical mechanical polishing pad.
    • 在30℃下的储能弹性模量E'(30℃)为120MPa以下,(E'(30℃)/ E'(60℃))的化学机械研磨垫) 当研磨基材的储存弹性模量为60℃时,30℃下的储能弹性模量E'(30℃)与60℃下的储能弹性模量E'(60℃)的比为2.5以上 在以下条件下测量30℃和60℃:初始负荷:最大偏压100g:0.01%频率:0.2Hz。 化学机械抛光工艺利用上述化学机械抛光垫。 化学机械抛光垫可以在化学机械抛光步骤中抑制抛光表面产生划痕,并可提供高质量的抛光表面,化学机械抛光工艺通过使用化学机械 抛光垫
    • 60. 发明授权
    • Spindle motor and disk drive furnished therewith
    • 主轴电机和磁盘驱动器配备
    • US06914358B2
    • 2005-07-05
    • US10250083
    • 2003-06-03
    • Shinya TokunagaKaoru UenosonoHideki NishimuraYoshito Oku
    • Shinya TokunagaKaoru UenosonoHideki NishimuraYoshito Oku
    • F16C17/10F16C17/02F16C17/04F16C33/10G11B19/20H02K5/16H02K7/08H02K21/22G11B17/02H02K5/00
    • F16C17/107F16C33/107F16C33/1085F16C2370/12H02K5/1675
    • In a spindle motor utilizing dynamic-pressure bearings having a full-fill structure, a bearing configuration that balances and sustains at or above atmospheric pressure the internal pressure of the bearing oil. Thrust and radial bearing sections are configured within oil-filled bearing clearances in between the rotor, the shaft, and a shaft-encompassing hollow bearing member. A communicating passage one end of which opens on, radially inwardly along, the thrust bearing section is formed in the bearing member. Either axial ends of the bearing clearance in between the bearing member and shaft communicate through the passage. The communicating passage enables the oil to redistribute itself within the bearing clearances. Pressure difference between the axial upper and lower ends of the oil retained in between the bearing member and the shaft is compensated through the communicating passage, preventing incidents of negative pressure within the oil and of over-lift on the rotor.
    • 在使用具有全填充结构的动压轴承的主轴电机中,轴承构造在大气压力或大于等于或高于轴承油的内部压力的情况下平衡和维持。 推力轴承和径向轴承部分配置在转子,轴和包含轴的中空轴承部件之间的充油轴承间隙内。 在轴承部件上形成有连通通道,其一端在推力轴承部分沿径向向内开口。 轴承构件和轴之间的轴承间隙的轴向端部通过通道连通。 连通通道使得油在轴承间隙内重新分布。 通过连通通道补偿保持在轴承构件和轴之间的油的轴向上端和下端之间的压力差,防止油内的负压和转子上的过度提升。