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51. 发明授权

US07903402B2 Electronic apparatus 有权
标题翻译：电子仪器
公开(公告)号：US07903402B2
公开(公告)日：2011-03-08
申请号：US12710233
申请日：2010-02-22
申请人： Kentaro Tomioka , Satoshi Yokote
发明人： Kentaro Tomioka , Satoshi Yokote
IPC分类号： G06F1/20 , H05K7/20
CPC分类号： G06F1/203
摘要： According to one embodiment, a housing of an electronic apparatus includes a first sidewall portion provided with an air vent, a ceiling wall portion extending from an upper end of the first sidewall portion toward the outside of the housing, and a pair of second sidewall portions which extend from respective side end portions of the first sidewall portion toward the outside of the housing and are opposed to each other.
摘要翻译：根据一个实施例，电子设备的壳体包括设置有通气口的第一侧壁部分，从第一侧壁部分的上端朝向壳体的外部延伸的顶壁部分，以及一对第二侧壁部分其从第一侧壁部分的相应侧端部朝向壳体的外侧延伸并且彼此相对。

52. 发明授权

US07830331B2 Electronic device 有权
标题翻译：电子设备
公开(公告)号：US07830331B2
公开(公告)日：2010-11-09
申请号：US12233365
申请日：2008-09-18
申请人： Fuminori Yamazaki , Kentaro Tomioka , Tomomi Murayama , Toshio Ooe , Satoshi Yokote
发明人： Fuminori Yamazaki , Kentaro Tomioka , Tomomi Murayama , Toshio Ooe , Satoshi Yokote
IPC分类号： H01Q1/50 , H01Q1/24 , H01Q1/42
CPC分类号： H01Q1/243 , H01Q1/38
摘要： An electronic device includes: a circuit board that has a wireless communication module that is mounted thereon and a feed line that is formed on the circuit board and electrically connected to the wireless communication module; a planar member that is formed with an opening and has a flexible planar piece that is formed to protrude toward the circuit board from an edge of the opening; and an antenna pattern that includes an antenna part that is formed on the planar member and a feeder part that is formed on the flexible planar piece, wherein circuit board and the planar member are arranged to be in positions to flexibly bend the flexible planar piece by the circuit board to electrically connect the feeder part of the antenna pattern and the feed line formed on the circuit board.
摘要翻译：电子设备包括：电路板，其具有安装在其上的无线通信模块和形成在电路板上并电连接到无线通信模块的馈电线; 平面构件，其形成有开口，并且具有柔性平面片，其形成为从所述开口的边缘朝向所述电路板突出; 以及天线图案，其包括形成在平面构件上的天线部分和形成在柔性平面片上的馈电部分，其中电路板和平面构件被布置成通过使挠性平面片柔性弯曲的位置电路板电连接天线图案的馈电部分和形成在电路板上的馈线。

53. 发明授权

US07738248B2 Electronic device, loop heat pipe and cooling device 有权
标题翻译：电子设备，回路热管及冷却装置
公开(公告)号：US07738248B2
公开(公告)日：2010-06-15
申请号：US12330266
申请日：2008-12-08
申请人： Kentaro Tomioka
发明人： Kentaro Tomioka
IPC分类号： H05K7/20 , H01L23/36
CPC分类号： G06F1/203 , G06F2200/201 , H01L2924/0002 , H01L2924/00
摘要： According to one embodiment, an electronic device includes a heat generating part housed inside a cabinet and a loop heat pipe housed inside the cabinet, which includes an internal flow path having a loop shape in which a working fluid is sealed. The loop heat pipe further includes a heat receiving unit, a heat radiating unit, a vapor flow path which allows a gasified portion of the working fluid to flow from the heat receiving unit towards the heat radiating unit, a liquid returning flow path which allows a liquefied portion of the working fluid to flow from the heat radiating unit towards the heat receiving unit, and a wick provided at a position adjacent to the vapor flow path inside the liquid returning flow path. The wick also serves as a partition portion which partitions the vapor flow path and the liquid returning flow path from each other.
摘要翻译：根据一个实施例，电子设备包括容纳在机壳内部的发热部分和容纳在机壳内的回路热管，其包括具有工作流体被密封的环形的内部流路。回路热管还包括热接收单元，散热单元，允许工作流体的气化部分从热接收单元朝向散热单元流动的蒸气流路，允许工作流体的液化部分从热辐射单元朝向热接收单元流动，并且设置在与返回液流路径内部的蒸气流路相邻的位置处的芯。芯也用作将蒸气流路和液体返回流路彼此隔开的分隔部。

54. 发明授权

US07651345B2 Electronic apparatus in which an conductive layer on an outer surface of a housing is electrically connected to a conductive member in the housing 失效
标题翻译：电子设备，其中壳体的外表面上的导电层电连接到壳体中的导电构件
公开(公告)号：US07651345B2
公开(公告)日：2010-01-26
申请号：US12140884
申请日：2008-06-17
申请人： Kentaro Tomioka , Tomomi Murayama , Noriyasu Kawamura , Toshiyuki Hirota , Hironori Motoe
发明人： Kentaro Tomioka , Tomomi Murayama , Noriyasu Kawamura , Toshiyuki Hirota , Hironori Motoe
IPC分类号： H01R4/66
CPC分类号： H01Q1/2258 , H01Q1/243 , H01Q21/28 , Y10S439/927
摘要： According to one embodiment, an electronic apparatus includes a conductive layer provided on an outer surface of a housing, a conductive member provided inside the housing, and a connecting component attached to the housing. The housing is provided with a through hole which causes the inside of the housing to communicate with the outside. The connecting component has conductivity, and is provided with a major diameter section and a minor diameter section. The major diameter section is formed larger than the through hole, is opposed to the conductive layer from outside the housing, and is electrically connected to the conductive layer. The minor diameter section is formed smaller than the through hole, is inserted in the through hole to reach the inside of the housing, and is electrically connected to the conductive member.
摘要翻译：根据一个实施例，电子设备包括设置在壳体的外表面上的导电层，设置在壳体内部的导电构件和附接到壳体的连接构件。壳体设置有使外壳内部与外部连通的通孔。连接部件具有导电性，并且设置有大直径部分和小直径部分。大直径部形成为比通孔大，与壳体外侧与导电层相对，并且与导电层电连接。小直径部形成为小于通孔，插入通孔中以到达壳体的内部，并且与导电构件电连接。

55. 发明申请

US20090296354A1 ELECTRONIC APPARATUS 失效
标题翻译：电子设备
公开(公告)号：US20090296354A1
公开(公告)日：2009-12-03
申请号：US12429948
申请日：2009-04-24
申请人： Kentaro Tomioka , Tomomi Murayama
发明人： Kentaro Tomioka , Tomomi Murayama
IPC分类号： H05K7/20
CPC分类号： H01L23/367 , G06F1/20 , G06F2200/201 , H01L23/427 , H01L24/32 , H01L2924/01006 , H01L2924/01009 , H01L2924/01013 , H01L2924/01015 , H01L2924/01021 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/19041 , H01L2924/3511
摘要： According to one embodiment, an electronic apparatus includes a semiconductor package including a resin substrate and a die mounted on the resin substrate, a printed circuit board on which the semiconductor package is mounted, and a heat receiving plate that has an area larger than an area of the die. The heat receiving plate has a concave portion that corresponds to a surface of the die at a normal temperature. The concave portion is provided with a pasty heat conductive agent. The heat receiving plate is thermally connected to the semiconductor package via the pasty heat conductive agent.
摘要翻译：根据一个实施例，一种电子设备包括：半导体封装，包括树脂基板和安装在树脂基板上的管芯，安装有半导体封装的印刷电路板和面积大于面积的热接收板的死亡。受热板具有与正常温度下的模具表面对应的凹部。凹部设有糊状导热剂。热接收板通过糊状导热剂热连接到半导体封装。

56. 发明授权

US07539009B2 Cooling unit having a heat radiating portion, and electronic apparatus incorporating a cooling unit 失效
标题翻译：具有散热部分的冷却单元和包括冷却单元的电子设备
公开(公告)号：US07539009B2
公开(公告)日：2009-05-26
申请号：US11116183
申请日：2005-04-28
申请人： Yukihiko Hata , Kentaro Tomioka
发明人： Yukihiko Hata , Kentaro Tomioka
IPC分类号： H05K7/20
CPC分类号： G06F1/203 , G06F2200/201 , H01L2924/0002 , H01L2924/00
摘要： The cooling unit includes a heat receiving portion, a heat radiating portion and a circulation path. The heat radiating portion has an impeller, a heat-radiating member and a case. The heat-radiating member surround the impeller that applies cooling air. The heat-radiating member has a coolant passage in which liquid coolant flows, and a plurality of heat-radiating fins which are thermally connected to the coolant passage. The case contains the impeller and the heat-radiating member and has at least one outlet port through which the cooling air is expelled.
摘要翻译：冷却单元包括热接收部分，散热部分和循环路径。散热部具有叶轮，散热构件和壳体。散热构件围绕施加冷却空气的叶轮。散热构件具有液体冷却剂流动的冷却剂通道和与冷却剂通道热连接的多个散热片。壳体包含叶轮和散热构件，并且具有至少一个出口，冷却空气通过该出口排出。

57. 发明申请

US20080198547A1 ELECTRONIC DEVICE AND HEAT CONDUCTION MEMBER 失效
标题翻译：电子设备和热传导部件
公开(公告)号：US20080198547A1
公开(公告)日：2008-08-21
申请号：US12025606
申请日：2008-02-04
申请人： Kentaro Tomioka
发明人： Kentaro Tomioka
IPC分类号： H05K7/20
CPC分类号： G06F1/203 , H01L23/367 , H01L23/3672 , H01L23/3735 , H01L2924/0002 , H01L2924/00
摘要： According to one embodiment, an electronic device includes a case, a heat generation body mounted in the case, a cooling member mounted in the case, and a heat conduction member. The heat conduction member includes a heat receiving section opposed to the heat generation body and thermally connected to the heat generation body, a heat radiation section opposed to the cooling member, and a section provided between the heat receiving section and the heat radiation section. The heat conduction member is formed by laminating a plurality of sheet members each having thermal conductivity. The plurality of sheet members are joined together in a portion of the heat conduction member.
摘要翻译：根据一个实施例，电子设备包括壳体，安装在壳体中的发热体，安装在壳体中的冷却构件和导热构件。导热构件包括与发热体相对并与发热体相连的热接收部，与冷却部对置的散热部，以及设置在受热部与散热部之间的部分。导热构件通过层叠多个具有导热性的薄片构件而形成。多个片状构件在导热构件的一部分中接合在一起。

58. 发明授权

US07371056B2 Fluid pump, cooling system and electrical appliance 有权
标题翻译：流体泵，冷却系统和电器
公开(公告)号：US07371056B2
公开(公告)日：2008-05-13
申请号：US11093030
申请日：2005-03-30
申请人： Kenichi Ito , Katsuya Seko , Kentaro Tomioka , Tomonao Takamatsu , Fumihide Nagashima , Takahiro Kojima
发明人： Kenichi Ito , Katsuya Seko , Kentaro Tomioka , Tomonao Takamatsu , Fumihide Nagashima , Takahiro Kojima
IPC分类号： F04B17/00 , F04B35/04
CPC分类号： F04D13/0673
摘要： A fluid pump includes a case including a pump chamber, a reserve tank for storing spare liquid and located in the case but outside the pump chamber and formed so that a space independent of the pump chamber is defined by the reserve tank, a fluid path forming member arranged inside the reserve tank and including a discharge path communicating between a discharge port and the pump chamber, and a communication hole which is formed in a side of the fluid path forming member so as to assume such a position that the communication hole faces an inside of the reserve tank so that the hole communicates between the discharge path and the inside of the reserve tank, the communication hole being sized so that air in the pump chamber is allowed to flow through the hole into the reserve tank.
摘要翻译：流体泵包括壳体，其包括泵室，用于存储备用液体并且位于壳体中并且位于泵室外部并形成为使得与泵室独立的空间由备用箱限定的储备罐，形成流体路径配置在储备箱内的构件，包括在排出口和泵室之间连通的排出路径，以及连通孔，其形成在流体路径形成构件的一侧，以使得连通孔朝向在储存箱内部，使得孔在排出路径与储备箱的内部连通，连通孔的尺寸使得泵室中的空气能够通过孔流入储备罐。

59. 发明授权

US07280357B2 Pump and electronic device having the pump 失效
标题翻译：具有泵的泵和电子装置
公开(公告)号：US07280357B2
公开(公告)日：2007-10-09
申请号：US11084654
申请日：2005-03-18
申请人： Kentaro Tomioka , Yukihiko Hata
发明人： Kentaro Tomioka , Yukihiko Hata
IPC分类号： H05K7/20
CPC分类号： G06F1/203 , F04D29/5866 , F04D29/588 , G06F2200/201 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： In one embodiment of the invention, a pump includes a pump housing, an impeller, and a motor. The pump housing has a pump chamber and a heat receiving plate to couple to a heat generating unit, such as a CPU. The impeller is provided in the pump chamber. The motor couples to the impeller to rotate it. A region of the heat receiving plate projects further outward than other regions to couple the heat receiving plate to the IC chip.
摘要翻译：在本发明的一个实施例中，泵包括泵壳体，叶轮和马达。泵壳体具有泵室和热接收板，以耦合到诸如CPU的发热单元。叶轮设在泵室内。马达耦合到叶轮以旋转它。受热板的区域比其他区域进一步向外突出，以将热接收板耦合到IC芯片。

60. 发明申请

US20070002538A1 Cooling device and electronic apparatus 有权
标题翻译：冷却装置和电子设备
公开(公告)号：US20070002538A1
公开(公告)日：2007-01-04
申请号：US11473850
申请日：2006-06-23
申请人： Kentaro Tomioka
发明人： Kentaro Tomioka
IPC分类号： H05K7/20
CPC分类号： G06F1/203 , F28D15/00 , F28F3/12 , F28F13/06 , G06F2200/201 , H01L2924/0002 , H01L2924/00
摘要： According to one embodiment, a cooling device includes: a heat transfer unit thermally connected to a mounted first heating element and a mounted second heating element whose mounted height is higher than that of the first heating element, the heat transfer unit including a passage through which a coolant circulates, a heat-receiving section having a first portion thermally connected to the first heating element and a second portion thermally connected to the second heating element, a heat-sinking section that dissipates heat received by the heat-receiving section, a first plate member in which is formed a first groove corresponding to the passage, and a second plate member that covers the first groove. The heat-receiving section is formed at least one of the first and second plate members.
摘要翻译：根据一个实施例，冷却装置包括：热连接到安装的第一加热元件的热传递单元和安装的高度高于第一加热元件的安装的第二加热元件，传热单元包括通道，冷却剂循环，具有与第一加热元件热连接的第一部分的热接收部分和与第二加热元件热连接的第二部分，散热由热接收部分接收的热量的散热部分，第一部分板构件，其形成有与通道相对应的第一槽，以及覆盖第一槽的第二板构件。受热部形成第一和第二板构件中的至少一个。

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