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51. 发明专利

JPS5753969A Semiconductor device 失效
标题翻译：空值
公开(公告)号：JPS5753969A
公开(公告)日：1982-03-31
申请号：JP12798580
申请日：1980-09-17
申请人： Hitachi Ltd
发明人： INAYOSHI HIDEO , NISHI KUNIHIKO , MOCHIZUKI HIDETOSHI
IPC分类号： H01L23/02 , H01L23/495 , H01L23/50
CPC分类号： H01L23/49548 , H01L23/49541 , H01L2224/48 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/00
摘要： PURPOSE:To augment mechanical combination of a lead and a resifn former by a method wherein a lead frame is provided where it is insertedly supported by a hollow former with protrusions or a bend that goes deep into said resin former during a bonding process. CONSTITUTION:Protrusions 6 or a bent 7 is provided at a part of a lead where a lead frame 1 is insertedly supported by a hollow former. The protrusions 6 or the bend 7 goes into resin former during a melt-and-bond process, strengthening mechanical combination and increasing device reliability.
摘要翻译：目的：通过一种方法来增加引线和沉积物的机械组合，其中提供引线框架，其中在由接合工艺中的具有突起或深度进入所述树脂成形器的弯曲部的中空形成体中插入支撑引线框架的方法。构成：在引线框架1由中空形成体插入地支撑的引线的一部分处提供突起6或弯曲7。突起6或弯曲部7在熔融粘合过程中进入树脂成形体，加强机械组合并提高装置的可靠性。

52. 发明专利

JPS5649547A MANUFACTURE OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS5649547A
公开(公告)日：1981-05-06
申请号：JP12413979
申请日：1979-09-28
申请人： HITACHI LTD
发明人： INAYOSHI HIDEO , WAKASHIMA YOSHIAKI , KOYAMA HIROSHI , ITOU TATSU
IPC分类号： H01L23/50 , H01L23/28 , H01L23/29 , H01L23/31
摘要： PURPOSE:To improve resins in adhesive property by attaching carbon-functional silane to the surface of the tub or a lead frame of a pellet upon resin molding after fitting the pellet on the surface of the tub. CONSTITUTION:A semiconductor pellet 3 is fastened to the upper surface of a tub provided at the central part of a lead frame 1 and thus-obtained electrode is connected to the lead 4 of the frame 1 using a wire 5. Next, the pellet 3 is turned upside down and one or several drips of carbon-functional silane 6 let fall onto the reverse side of the tub 2. Thereafter, the frame 1 and pellet 3 are supported in a chamber 9 consisting of upper and lower dies 7 and 8 and a resin 10 is molded through pressure-supply for completing a package. Silane 6 is superior in the affinity with the resin 10 and liable to combining with O2 of the oxide layer on the surface of the lead 4 or SiO2 on the surface of the pellet 3 so that the resin 10 improves in adhesive property.

53. 发明专利

JPS5645033A PACKAGING METHOD FOR SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS5645033A
公开(公告)日：1981-04-24
申请号：JP12065279
申请日：1979-09-21
申请人： HITACHI LTD
发明人： INAYOSHI HIDEO , WAKASHIMA YOSHIAKI , NISHI KUNIHIKO
IPC分类号： H01L21/56
摘要： PURPOSE:To securely prevent a short-circuit and to obtain a sealed body of higher reliability by providing fused resin between the connections of a semiconductor device, and hardening the resin to secure the connections before transfer-molding. CONSTITUTION:On a semiconductor device 10 which has not been sealed, a lump of unhardened solid epoxy resin 16 is placed and fused in an oven before being cooled to secure connections 13 in the resin 16. Then transfer-molding this prevents the short-circuit of the connections when resin is injected under a high pressure. Setting the outer resin 17 to be of excellent moisture resistance and the thermal expansion coefficient of the inner resin 16 to be the almost same as the connections prevents also the production of cracks. Thus, a sealed body of higher reliability is obtained.

54. 发明专利

JPS5623761A EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS5623761A
公开(公告)日：1981-03-06
申请号：JP9730979
申请日：1979-08-01
申请人： HITACHI LTD , HITACHI CHEMICAL CO LTD
发明人： KITAMURA MASAHIRO , SUZUKI HIROSHI , TANAKA GOROU , SEGAWA MASANORI , SUGAWARA YASUHIDE , INAYOSHI HIDEO , URANO TAKASHI
IPC分类号： C08G59/00 , C08K3/34 , C08L63/00 , H01L23/29 , H01L23/31
摘要： PURPOSE:To remarkably improve the moisture resistance of epoxy resin composition after hardening the composition by employing silane coupling agent having epoxy group and silane coupling agent having mercapto group together. CONSTITUTION:0.01-1pt. of mercapto silane is added to epoxy silane of 1pt. in a composition added with epoxy resin having two or more oxysilane rings in a molecule such as bis-phenol or the like, hardener such as maleate, and hardening accelerator such as tetra-substituted phosphonium.tetra-substituted borate, and 0.1-5pts. thereof is mixed with 100pts. of total epoxy resin. The moisture resistance is not improved if it is less than 0.1wt%, while it is lowered in its glass transistion point of hardener if it exceeds 0.5wt%. When it is sealed with composition thus composed, it can remarkably improve the moistue resistance of the composition.

55. 发明专利

JPS5588357A RESIN MOLD SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS5588357A
公开(公告)日：1980-07-04
申请号：JP15986178
申请日：1978-12-27
申请人： HITACHI LTD
发明人： NISHI KUNIHIKO , WAKASHIMA YOSHIAKI , INAYOSHI HIDEO
IPC分类号： H01L23/34 , H01L23/29 , H01L23/31
摘要： PURPOSE:To prevent breakages of a substrate and also to improve heat-radiation characteristic by absorbing a thermal stress generated in a resin layer by a rubber layer by covering a semiconductor substrate with the first mold layer of high heat conductive rubber and the second mold layer of high heat conductive resin. CONSTITUTION:A semiconductor substrate 11 for IC having pn-junction is fixed on a tab 12, and a plural lead strip 13 arranged around the tab 12 and the substrate are connected with a bonding wire 14. The substrate 11 is first covered with a high heat conductive rubber like silicone rubber containing a large amount of inorganic insulator powder like alumina powder, BN powder, etc. to form the first mold layer 15. Next, the second mold layer 16 is formed by covering with a high heat conductive resin like epoxy resin or silicone resin containing inorganic insulator powder. Breakage of the substrate can be now prevented and also the heat-radiation characteristic can be improved by arranging to absorb the thermal stress arising in the resin layer 16 by the elastic rubber layer 15 and prevent on the substrate 11 from its influence.

56. 发明专利

JPS54106946A PREHEATING METHOD OF RESIN TABLET 失效
公开(公告)号：JPS54106946A
公开(公告)日：1979-08-22
申请号：JP1241578
申请日：1978-02-08
申请人： HITACHI LTD
发明人： WAKASHIMA YOSHIAKI , NISHI KUNIHIKO , INAYOSHI HIDEO
IPC分类号： H05B6/46
摘要： PURPOSE:To prevent a preheating temperature from dropping in case of preheating a resin tablet in a microwave field, by spraying a cooling fluid on the tablet. CONSTITUTION:A resin tablet 12 is placed on a pair of roller electrodes 11 and a high frequency is applied to between the electrodes 11 and an upper electrode 13 for pre-heating treatment. A cooling fluid P such as dry air is blown toward the tablet 12 to keep its external temperature lower than its internal temperature, which allows to raise the upper limit of preheating temperature by above 5 or more than 10 deg.C compared with a conventional method.

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