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51. 发明申请

US20090058328A1 Motor Driving Circuit 有权
标题翻译：电机驱动电路
公开(公告)号：US20090058328A1
公开(公告)日：2009-03-05
申请号：US12200744
申请日：2008-08-28
申请人： Takaaki Ishii , Takashi Tsukagoshi , Akira Suzuki
发明人： Takaaki Ishii , Takashi Tsukagoshi , Akira Suzuki
IPC分类号： H02K41/035
CPC分类号： H02P25/034
摘要： A motor driving circuit for controlling a current amount flowing through a motor coil includes: a comparator configured to output a comparison signal indicating a comparison result between a set current amount and a current amount based on an inputted set current signal according to the set current amount and a current signal according to the current amount flowing through the motor coil; a current control signal update circuit configured to update a current control signal for controlling the current amount flowing through the motor coil in a stepwise manner so that the current amount flowing through the motor coil is changed to the set current amount in a stepwise manner, based on the comparison signal outputted from the comparator; and a driving circuit configured to drive the motor coil based on the current control signal outputted from the current control signal update circuit.
摘要翻译：用于控制流过电动机线圈的电流量的电动机驱动电路包括：比较器，被配置为根据设定的电流量输出表示设定电流量与电流量之间的比较结果的比较信号，该比较信号基于输入的设定电流信号以及根据流过电动机线圈的电流量的电流信号; 电流控制信号更新电路，被配置为以逐步的方式更新用于控制流过电动机线圈的电流量的电流控制信号，使得流过电动机线圈的电流量以逐步的方式被改变为设定电流量对比较器输出的比较信号; 以及驱动电路，被配置为基于从当前控制信号更新电路输出的电流控制信号来驱动电动机线圈。

52. 发明申请

US20090041973A1 RESIN MOLDING AND ITS MANUFACTURING METHOD AND RESIN INJECTING APPARATUS USED FOR THE SAME 有权
标题翻译：树脂成型及其制造方法和树脂注射装置
公开(公告)号：US20090041973A1
公开(公告)日：2009-02-12
申请号：US12253340
申请日：2008-10-17
申请人： Kenshirou Abe , Akira Suzuki
发明人： Kenshirou Abe , Akira Suzuki
IPC分类号： B32B5/00 , B29C45/14 , B29C45/03
CPC分类号： B29C66/54 , B29C45/0062 , B29C65/42 , B29C66/71 , B29C66/73921 , B29K2105/0097 , B29L2031/767 , Y10T428/19 , Y10T428/195 , Y10T428/24 , Y10T428/24529 , Y10T428/31504 , B29K2023/04 , B29K2023/10 , B29K2025/04 , B29K2069/00 , B29K2055/02 , B29K2071/12 , B29K2025/06 , B29K2023/12 , B29K2023/06
摘要： A method of manufacturing a resin molding according to the present invention is made by joining first and second resin molded parts. The method includes molding a concave portion when molding the first part, molding a convex portion which has a through-hole in a central portion thereof when molding the second part, mating the concave portion with the convex portion so that a cavity being in communication with one end of the through-hole is configured between the concave and convex portions, holding, with a jig, the first and second parts which the cavity is configured therebetween, connecting a tip of an injection nozzle for injecting a molten resin into the cavity with the other end of the through-hole, and filling the molten resin into the through-hole and the cavity from the injection nozzle so that the concave and convex portions are integrally joined by the resin.
摘要翻译：本发明的树脂成型体的制造方法通过接合第一和第二树脂成形部而形成。该方法包括在模制第一部分时模制凹部，在模制第二部分时模制其中心部分具有通孔的凸部，将凹部与凸部配合，使得与腔所述通孔的一端构造在所述凹部和凸部之间，用夹具保持所述腔体之间构成的所述第一部分和所述第二部分，将用于将熔融树脂注入所述腔的注射喷嘴的前端连接到所述腔中，通孔的另一端，并且将熔融树脂从注射喷嘴填充到通孔和空腔中，使得凹凸部分通过树脂一体地接合。

53. 再颁专利

USRE40371E1 Optical disc recording/reproduction apparatus and method 有权
标题翻译：光盘记录/再现装置及方法
公开(公告)号：USRE40371E1
公开(公告)日：2008-06-10
申请号：US09726436
申请日：2000-12-01
申请人： Isao Ichimura , Fumisada Maeda , Kenji Yamamoto , Kiyoshi Ohsato , Toshio Watanabe , Akira Suzuki
发明人： Isao Ichimura , Fumisada Maeda , Kenji Yamamoto , Kiyoshi Ohsato , Toshio Watanabe , Akira Suzuki
IPC分类号： G11B7/00
CPC分类号： B82Y10/00 , G11B7/0935 , G11B7/1374 , G11B7/24 , G11B11/10543 , G11B11/10576 , G11B2007/13727
摘要： An optical disc recording/reproduction apparatus for recording and/or reproducing a data by applying a beam from an optical head unit through a substrate onto/from a recording layer of the optical disc through, wherein the substrate of the optical disc is 0.3 mm or below; the optical head unit comprises: an objective lens for converging an incident beam and emitting the beam toward the optical disc; a forward lens for converging the beam introduced through the objective lens and applying the beam to the optical disc; a lens holder where the objective lens and the forward lens are fixed; and an actuator for driving the objective lens and the forward lens as a unitary block and controlling at least focusing, the objective lens and the forward lens having a total numerical aperture of 0.8 or above.
摘要翻译：一种光盘记录/再现装置，用于通过将来自光学头单元的光束通过衬底施加到/从光盘的记录层通过光盘的记录层而记录和/或再现数据，其中光盘的基板为0.3mm或下面; 光头单元包括：用于会聚入射光束并将光束朝向光盘发射的物镜; 用于会聚通过物镜引入的光束并将光束施加到光盘的前向透镜; 固定有物镜和前透镜的透镜保持架; 以及用于将物镜和前透镜驱动为整体块并且至少控制聚焦的致动器，物镜和前透镜具有0.8或更高的总数值孔径。

54. 发明授权

US07382037B2 Semiconductor device with a peeling prevention layer 有权
标题翻译：具有防剥层的半导体装置
公开(公告)号：US07382037B2
公开(公告)日：2008-06-03
申请号：US11236881
申请日：2005-09-28
申请人： Mitsuo Umemoto , Kojiro Kameyama , Akira Suzuki
发明人： Mitsuo Umemoto , Kojiro Kameyama , Akira Suzuki
IPC分类号： H01L23/544
CPC分类号： H01L27/1462 , H01L21/76898 , H01L23/3114 , H01L23/3192 , H01L23/564 , H01L27/14636 , H01L2924/0002 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , H01L2924/00
摘要： The invention is directed to improvement of reliability of a semiconductor device having penetrating electrodes by preventing a protection film and an insulation film peeling. A peeling prevention layer for preventing an insulation film and a protection layer peeling is formed in corner portions of the semiconductor device. The peeling prevention layer can increase its peeling prevention effect more when formed in a vacant space of the semiconductor device other than the corner portions, for example, between ball-shaped conductive terminals. In a cross section of the semiconductor device, the peeling prevention layer is formed on the insulation film on the back surface of the semiconductor substrate, and the protection layer formed of a solder resist or the like is formed covering the insulation film and the peeling prevention layer. The peeling prevention layer has a lamination structure of a barrier seed layer and a copper layer formed thereon when formed by an electrolytic plating method.
摘要翻译：本发明旨在通过防止保护膜和绝缘膜剥离来提高具有穿透电极的半导体器件的可靠性。在半导体器件的角部形成有用于防止绝缘膜和保护层剥离的防剥层。当形成在除了角部之外的半导体器件的空置空间中时，例如在球形导电端子之间，防剥层可以增加其防剥离效果。在半导体器件的横截面中，在半导体衬底的背面上的绝缘膜上形成防剥层，并且形成覆盖绝缘膜的防焊层等形成的防剥离层层。当通过电解电镀法形成时，防剥层具有阻挡种子层和形成在其上的铜层的叠层结构。

55. 发明授权

US07368864B2 Spark plug 有权
标题翻译：火花塞
公开(公告)号：US07368864B2
公开(公告)日：2008-05-06
申请号：US11014830
申请日：2004-12-20
申请人： Akira Suzuki
发明人： Akira Suzuki
IPC分类号： H01T13/20
CPC分类号： H01T13/467 , H01T13/39
摘要： A spark plug including: an insulator having an axial hole; a center electrode disposed in a tip end side of the axial hole of the insulator; a metal shell surrounding the insulator, a first ground electrode having one end bonded to the metal shell; a noble metal tip joined to an inner side face of another end portion of the first ground electrode body disposed opposite a tip end face of the center electrode; and a second ground electrode having one end bonded to the metal shell, and another end face disposed opposite a side peripheral face of said insulator to form a second discharge gap, wherein following relationships are satisfied as defined herein: 0.12≦S≦1.15, 0.3≦t≦1.5, A+0.7(F−A)≦1.8M, and −03≦L/H.
摘要翻译：一种火花塞，包括：具有轴向孔的绝缘体; 设置在绝缘体的轴向孔的前端侧的中心电极; 环绕绝缘体的金属壳，具有一端与金属壳结合的第一接地电极; 与所述第一接地电极体的与所述中心电极的前端面相对配置的另一端部的内侧面接合的贵金属端头; 以及第二接地电极，其一端接合到所述金属壳体，以及另一个端面，与所述绝缘体的侧面相对设置以形成第二放电间隙，其中满足以下定义的以下关系：0.12 <= S <= 1.15 ，0.3 <= t <= 1.5，A + 0.7（FA）<= 1.8M，-03 <= L / H。

56. 发明授权

US07366439B2 Method of remanufacturing cartridge and remanufactured cartridge 失效
标题翻译：再制造墨盒和再制造墨盒的方法
公开(公告)号：US07366439B2
公开(公告)日：2008-04-29
申请号：US11150114
申请日：2005-06-13
申请人： Osamu Anan , Akira Suzuki
发明人： Osamu Anan , Akira Suzuki
IPC分类号： G03G15/00
CPC分类号： G03G21/181 , G03G2215/00987
摘要： A method of remanufacturing a cartridge detachably mountable in an electrophotographic image-forming apparatus body and composed of styrene-based resin compositions at least in part, characterized by including the steps of: (1) dividing the cartridge into at least two parts; and (2) bonding at least one of the divided parts with another one of the divided parts and/or a component other than the divided parts by use of a terpene solvent.
摘要翻译：一种可拆卸地安装在电子照相成像设备主体中并由至少部分由苯乙烯基树脂组合物构成的盒的方法，其特征在于包括以下步骤：（1）将盒分成至少两部分; 和（2）通过使用萜烯溶剂将分割部分中的至少一个与分割部分中的另一个和/或除了分割部分之外的成分结合。

57. 发明授权

US07339273B2 Semiconductor device with a via hole having a diameter at the surface larger than a width of a pad electrode 有权
标题翻译：具有通孔的半导体器件，其表面的直径大于焊盘电极的宽度
公开(公告)号：US07339273B2
公开(公告)日：2008-03-04
申请号：US11257390
申请日：2005-10-25
申请人： Kojiro Kameyama , Akira Suzuki , Mitsuo Umemoto
发明人： Kojiro Kameyama , Akira Suzuki , Mitsuo Umemoto
IPC分类号： H01L29/40 , H01L23/52 , H01L23/48 , H01L21/302 , H01L21/461
CPC分类号： H01L24/10 , H01L23/3114 , H01L23/481 , H01L24/13 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05124 , H01L2224/05147 , H01L2224/05166 , H01L2224/05181 , H01L2224/05184 , H01L2224/05186 , H01L2224/05548 , H01L2224/05569 , H01L2224/05624 , H01L2224/05647 , H01L2224/13 , H01L2224/13022 , H01L2224/13099 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/351 , Y10S438/978 , H01L2924/00 , H01L2924/00014 , H01L2924/013
摘要： The invention is directed to a semiconductor device having a penetrating electrode and a manufacturing method thereof in which reliability and a yield of the semiconductor device are enhanced. A semiconductor substrate is etched to form a via hole from a back surface of the semiconductor substrate to a pad electrode. This etching is performed under an etching condition such that an opening diameter of the via hole at its bottom is larger than a width of the pad electrode. Next, a second insulation film is formed on the back surface of the semiconductor substrate including in the via hole 16, exposing the pad electrode at the bottom of the via hole. Next, a penetrating electrode and a wiring layer are formed, being electrically connected with the pad electrode exposed at the bottom of the via hole 16. Furthermore, a protection layer and a conductive terminal are formed. Finally, the semiconductor substrate is cut and separated in semiconductor dies by dicing.
摘要翻译：本发明涉及一种具有穿透电极的半导体器件及其制造方法，其中提高了半导体器件的可靠性和产量。蚀刻半导体衬底以从半导体衬底的背表面到焊盘电极形成通孔。该蚀刻在蚀刻条件下进行，使得其底部的通孔的开口直径大于焊盘电极的宽度。接下来，在包括在通孔16中的半导体衬底的背面上形成第二绝缘膜，使通孔底部的焊盘电极露出。接下来，形成贯通电极和布线层，与在通孔16的底部露出的焊盘电极电连接。此外，形成保护层和导电端子。最后，通过切割在半导体管芯中切割和分离半导体衬底。

58. 发明申请

US20080029322A1 Cover for vehicle 有权
标题翻译：车盖
公开(公告)号：US20080029322A1
公开(公告)日：2008-02-07
申请号：US11878238
申请日：2007-07-23
申请人： Toru Oba , Akira Suzuki
发明人： Toru Oba , Akira Suzuki
IPC分类号： B62D25/00 , B62D39/00
CPC分类号： F01P11/18 , B62D25/12
摘要： An intake system cover for a vehicle is mounted in an engine compartment to cover a reservoir tank that stores coolant for an engine. The intake system cover for the vehicle is formed with a light introduction opening for introducing light to be directed toward a liquid level gauge at a side of the reservoir tank. The visibility of the liquid level of the reservoir tank at the liquid level gauge is improved.
摘要翻译：用于车辆的进气系统盖安装在发动机舱中以覆盖储存用于发动机的冷却剂的储存罐。用于车辆的进气系统盖形成有用于引导光的导光开口，以引导到储液罐侧面的液位计。液位计液位计液位的可视性得到改善。

59. 发明申请

US20080026227A1 Method of manufacturing a resin molding 失效
标题翻译：树脂成形体的制造方法
公开(公告)号：US20080026227A1
公开(公告)日：2008-01-31
申请号：US11866531
申请日：2007-10-03
申请人： Kenshirou Abe , Akira Suzuki
发明人： Kenshirou Abe , Akira Suzuki
IPC分类号： B29C65/42
CPC分类号： B29C66/54 , B29C45/0062 , B29C65/42 , B29C66/71 , B29C66/73921 , B29K2105/0097 , B29L2031/767 , Y10T428/19 , Y10T428/195 , Y10T428/24 , Y10T428/24529 , Y10T428/31504 , B29K2023/04 , B29K2023/10 , B29K2025/04 , B29K2069/00 , B29K2055/02 , B29K2071/12 , B29K2025/06 , B29K2023/12 , B29K2023/06
摘要： A resin molding is made by integrally joining a first resin molded part configured a concave portion and a second resin molded part configured a convex portion so that the concave portion and the convex portion are mated together. The resin molding includes a cavity that is in communication with the convex portion and the concave portion when the convex and concave portions are mated into each other, and a joining resin filled into the cavity. The first and second molded parts and the joining resin are composed of the same resin or similar resins.
摘要翻译：通过将构成凹部的第一树脂成形部和形成有凸部的第二树脂成型体整体接合而成形树脂成形体，使得凹部和凸部配合在一起。树脂模制件包括当凸部和凹部彼此配合时与凸部和凹部连通的空腔，以及填充到空腔中的接合树脂。第一和第二模制部件和接合树脂由相同的树脂或类似的树脂组成。

60. 发明申请

US20080023846A1 Semiconductor device and manufacturing method of the same 有权
标题翻译：半导体器件及其制造方法相同
公开(公告)号：US20080023846A1
公开(公告)日：2008-01-31
申请号：US11878796
申请日：2007-07-26
申请人： Katsuyuki Seki , Akira Suzuki , Koujiro Kameyama , Takahiro Oikawa
发明人： Katsuyuki Seki , Akira Suzuki , Koujiro Kameyama , Takahiro Oikawa
IPC分类号： H01L21/311 , H01L21/302 , H01L23/48
CPC分类号： H01L21/3065 , H01L21/30655 , H01L21/31138 , H01L21/76898 , H01L2224/02372 , H01L2224/05008 , H01L2224/05009 , H01L2224/05025 , H01L2224/05147 , H01L2224/05164 , H01L2224/05166 , H01L2224/05181 , H01L2224/05184 , H01L2224/05186 , H01L2224/05548 , H01L2224/05568 , H01L2224/05569 , H01L2224/05644 , H01L2224/05655 , H01L2224/16 , H01L2924/01004 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/09701 , H01L2924/00014 , H01L2924/04953 , H01L2924/0496 , H01L2924/01074 , H01L2924/0494
摘要： The invention provides a method of manufacturing a semiconductor device which achieves high reliability and high yield as well as high production efficiency. Back surface grinding (back grinding) is performed to a semiconductor substrate to thin the semiconductor substrate. A damaged layer formed by the back surface grinding is not removed at this time, and a photoresist layer is selectively formed on the back surface of the semiconductor substrate. The semiconductor substrate is then etched using the photoresist layer as a mask to form a via hole. The photoresist layer is then removed with the semiconductor substrate still placed in an etcher used in the etching process subsequently after the formation of the via hole. In this manner, the etching process and the next ashing process are performed sequentially in one apparatus. Then a process of removing the damaged layer on the back surface of the semiconductor substrate and a process of smoothing the sidewall of the via hole are simultaneously performed subsequently after the ashing process in the same apparatus.
摘要翻译：本发明提供一种制造半导体器件的方法，该方法实现了高可靠性和高产率以及高生产效率。对半导体基板进行背面研磨（背面研磨）以使半导体基板变薄。此时不会去除由背面磨削形成的损伤层，并且在半导体衬底的背面上选择性地形成光致抗蚀剂层。然后使用光致抗蚀剂层作为掩模蚀刻半导体衬底以形成通孔。然后在形成通孔之后，半导体衬底仍然放置在蚀刻工艺中使用的蚀刻器中，去除光致抗蚀剂层。以这种方式，在一个装置中顺序地执行蚀刻处理和下一个灰化处理。然后，在同一装置的灰化处理之后，随后进行去除半导体基板背面的损伤层的工序和平滑通路孔的侧面的工序。

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