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51. 发明申请

US20120242363A1 Non-Linear Vertical Leaf Spring 有权
标题翻译：非线性垂直叶片弹簧
公开(公告)号：US20120242363A1
公开(公告)日：2012-09-27
申请号：US13288925
申请日：2011-11-03
申请人： Keith J. Breinlinger , Benjamin N. Eldridge , Eric D. Hobbs , Michael J. Armstrong , John K. Gritters
发明人： Keith J. Breinlinger , Benjamin N. Eldridge , Eric D. Hobbs , Michael J. Armstrong , John K. Gritters
IPC分类号： G01R1/067 , H01R43/16 , H01R24/66 , G01R31/26 , H01R24/00 , H01R13/02
CPC分类号： G01R1/06716 , G01R1/06733 , G01R1/07357 , H01R13/2407 , H01R43/16 , Y10T29/49204
摘要： An electrically conductive contact element can include a first base and a second base with elongate, spaced apart leaves between the bases. A first end of each leaf can be coupled to the first base and an opposite second end of the leaf can be coupled to the second base. A body of the leaf between the first end and the second end can be sufficiently elongate to respond to a force through said contact element substantially parallel with the first axis and the second axis by first compressing axially while said force is less than a buckling force and then bending while said force is greater than the buckling force.
摘要翻译：导电接触元件可以包括第一基部和在基部之间具有细长间隔开的叶片的第二基部。每个叶片的第一端可以联接到第一基部，并且叶片的相对的第二端可以联接到第二基部。在第一端和第二端之间的叶片的主体可以是足够伸长的，以响应于通过所述接触元件的力，所述力通过在所述力小于屈曲力的同时第一轴向压缩而基本上平行于第一轴线和第二轴线，并且然后在所述力大于屈曲力时弯曲。

52. 发明授权

US07977956B2 Method and apparatus for probe card alignment in a test system 有权
标题翻译：测试系统中探针卡校准的方法和设备
公开(公告)号：US07977956B2
公开(公告)日：2011-07-12
申请号：US12431271
申请日：2009-04-28
申请人： Keith J. Breinlinger , Benjamin N. Eldridge , Eric D. Hobbs , Douglas S. Ondricek
发明人： Keith J. Breinlinger , Benjamin N. Eldridge , Eric D. Hobbs , Douglas S. Ondricek
IPC分类号： G01R31/00 , G01R31/20
CPC分类号： G01R31/2891
摘要： Embodiments of methods and apparatus for aligning a probe card assembly in a test system are provided herein. In some embodiments, an apparatus for testing devices may include a probe card assembly having a plurality of probes, each probe having a tip for contacting a device to be tested, and having an identified set of one or more features that are preselected in accordance with selected criteria for aligning the probe card assembly within a prober after installation therein. In some embodiments, the identity of the identified set of one or more features may be communicated to the prober to facilitate a global alignment of the probe card assembly that minimizes an aggregate misalignment of all of the tips in the probe card assembly.
摘要翻译：本文提供了在测试系统中对准探针卡组件的方法和装置的实施例。在一些实施例中，用于测试装置的装置可以包括具有多个探针的探针卡组件，每个探针具有用于接触要测试的装置的尖端，并且具有根据本发明的预选的一组或多个特征在探针卡组件安装在其中之后将探针卡组件对准的选择标准。在一些实施例中，所识别的一个或多个特征集合的身份可以被传送到探测器，以促进探针卡组件的全局对准，其最小化探针卡组件中的所有尖端的聚集失准。

53. 发明授权

US07843202B2 Apparatus for testing devices 有权
标题翻译：用于测试设备的设备
公开(公告)号：US07843202B2
公开(公告)日：2010-11-30
申请号：US11864690
申请日：2007-09-28
申请人： Eric D. Hobbs , Nobuhiro Kawamata , Andrew W. McFarland , Carl V. Reynolds , Yoichi Urakawa
发明人： Eric D. Hobbs , Nobuhiro Kawamata , Andrew W. McFarland , Carl V. Reynolds , Yoichi Urakawa
IPC分类号： G01R31/02
CPC分类号： G01R31/2863 , G01R31/2889 , G01R31/31905
摘要： Methods and apparatus for testing semiconductor devices are provided herein. In some embodiments, an assembly for testing semiconductor devices can include a probe card assembly; and a thermal barrier disposed proximate an upper surface of the probe card assembly, the thermal barrier can restrict thermal transfer between tester side boundary conditions and portions of the probe card assembly disposed beneath the thermal barrier.
摘要翻译：本文提供了测试半导体器件的方法和装置。在一些实施例中，用于测试半导体器件的组件可以包括探针卡组件; 以及设置在探针卡组件的上表面附近的热障，热障可以限制测试仪侧边界条件与布置在热障下方的探针卡组件的部分之间的热传递。

54. 发明申请

US20100271062A1 METHOD AND APPARATUS FOR PROBE CARD ALIGNMENT IN A TEST SYSTEM 有权
标题翻译：检测系统中探针卡对齐的方法与装置
公开(公告)号：US20100271062A1
公开(公告)日：2010-10-28
申请号：US12431271
申请日：2009-04-28
申请人： Keith J. Breinlinger , Benjamin N. Eldridge , Eric D. Hobbs , Douglas S. Ondricek
发明人： Keith J. Breinlinger , Benjamin N. Eldridge , Eric D. Hobbs , Douglas S. Ondricek
IPC分类号： G01R31/02
CPC分类号： G01R31/2891
摘要： Embodiments of methods and apparatus for aligning a probe card assembly in a test system are provided herein. In some embodiments, an apparatus for testing devices may include a probe card assembly having a plurality of probes, each probe having a tip for contacting a device to be tested, and having an identified set of one or more features that are preselected in accordance with selected criteria for aligning the probe card assembly within a prober after installation therein. In some embodiments, the identity of the identified set of one or more features may be communicated to the prober to facilitate a global alignment of the probe card assembly that minimizes an aggregate misalignment of all of the tips in the probe card assembly
摘要翻译：本文提供了在测试系统中对准探针卡组件的方法和装置的实施例。在一些实施例中，用于测试装置的装置可以包括具有多个探针的探针卡组件，每个探针具有用于接触要测试的装置的尖端，并且具有根据本发明的预选的一组或多个特征在探针卡组件安装在其中之后将探针卡组件对准的选择标准。在一些实施例中，所识别的一组一个或多个特征的身份可以被传送到探测器，以促进探针卡组件的全局对准，其最小化探针卡组件中的所有尖端的聚集失准

55. 发明授权

US07772863B2 Mechanical decoupling of a probe card assembly to improve thermal response 有权
标题翻译：探针卡组件的机械去耦以改善热响应
公开(公告)号：US07772863B2
公开(公告)日：2010-08-10
申请号：US12327643
申请日：2008-12-03
申请人： Keith J. Breinlinger , Eric D. Hobbs
发明人： Keith J. Breinlinger , Eric D. Hobbs
IPC分类号： G01R31/02 , G01R31/28
CPC分类号： G01R31/2874 , G01R31/2889
摘要： A stiffener structure, a wiring substrate, and a frame having a major surface disposed in a stack can be part of a probe card assembly. The wiring substrate can be disposed between the frame and the stiffener structure, and probe substrates can be coupled to the frame by one or more non-adjustably fixed coupling mechanisms. Each of the probe substrates can have probes that are electrically connected through the probe card assembly to an electrical interface on the wiring substrate to a test controller. The non-adjustably fixed coupling mechanisms can be simultaneously stiff in a first direction perpendicular to the major surface and flexible in a second direction generally parallel to the major surface.
摘要翻译：加强结构，布线基板和具有设置在堆叠中的主表面的框架可以是探针卡组件的一部分。布线基板可以设置在框架和加强件结构之间，并且探针基板可以通过一个或多个不可调节地固定的联接机构联接到框架。每个探针基板可以具有通过探针卡组件电连接到布线基板上的电接口到测试控制器的探针。不可调节固定的联接机构可以在垂直于主表面的第一方向上同时刚性，并且在大致平行于主表面的第二方向上是柔性的。

56. 发明申请

US20100134128A1 Thermocentric Alignment Of Elements On Parts Of An Apparatus 有权
标题翻译：元件在设备部件上的热中心对准
公开(公告)号：US20100134128A1
公开(公告)日：2010-06-03
申请号：US12327576
申请日：2008-12-03
申请人： Eric D. Hobbs
发明人： Eric D. Hobbs
IPC分类号： G01R1/06 , B05D5/12
CPC分类号： G01R31/2889
摘要： A first device and a second device can include at least one alignment feature and at least one corresponding constraint. The alignment feature and the constraint can be configured to align the first device and the second device when the alignment feature is inserted into the constraint. The alignment feature and the constraint can be further configured to direct relative movement between the first device and the second device due to relative thermal expansion or contraction between the first device and the second device. The directed relative movement can keep the first device and the second device aligned over a predetermined temperature range.
摘要翻译：第一装置和第二装置可以包括至少一个对准特征和至少一个对应的约束。对准特征和约束可以被配置为当对准特征被插入到约束中时，使第一设备和第二设备对齐。对准特征和约束可以被进一步配置成由于第一装置和第二装置之间的相对热膨胀或收缩而引导第一装置和第二装置之间的相对运动。定向相对运动可以使第一装置和第二装置保持在预定的温度范围内。

57. 发明申请

US20080157791A1 STIFFENER ASSEMBLY FOR USE WITH TESTING DEVICES 有权
标题翻译：强化装置与测试装置一起使用
公开(公告)号：US20080157791A1
公开(公告)日：2008-07-03
申请号：US11860406
申请日：2007-09-24
申请人： Eric D. Hobbs , Andrew W. McFarland
发明人： Eric D. Hobbs , Andrew W. McFarland
IPC分类号： G01R1/067
CPC分类号： G01R1/07378
摘要： A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener assembly for use with testing devices can be part of a probe card assembly that can include a stiffener assembly comprising an upper stiffener coupled to a plurality of lower stiffeners; and a substrate constrained between the upper stiffener and the plurality of lower stiffeners, the stiffener assembly restricting non-planar flex of the substrate while facilitating radial movement of the substrate with respect to the stiffener assembly.
摘要翻译：本文提供了一种与测试装置一起使用的加强装置。在一些实施例中，用于与测试装置一起使用的加强件组件可以是探针卡组件的一部分，其可以包括加强件组件，该加强件组件包括联接到多个下加强件的上加强件; 以及限制在所述上加强件和所述多个下加强件之间的衬底，所述加强件组件限制所述衬底的非平面弯曲，同时促进所述衬底相对于所述加强件组件的径向移动。

58. 发明申请

US20080157790A1 STIFFENER ASSEMBLY FOR USE WITH TESTING DEVICES 失效
标题翻译：强化装置与测试装置一起使用
公开(公告)号：US20080157790A1
公开(公告)日：2008-07-03
申请号：US11617929
申请日：2006-12-29
申请人： Eric D. Hobbs , Andrew W. McFarland
发明人： Eric D. Hobbs , Andrew W. McFarland
IPC分类号： G01R1/067 , H01L21/67 , G01R31/02
CPC分类号： G01R1/07378
摘要： A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener for use with testing devices includes an inner member; an outer member disposed in a predominantly spaced apart relation to the inner member; and a plurality of alignment mechanisms for orienting the inner and outer members with respect to each other, wherein the alignment mechanisms transfer forces applied to a lower surface of the inner member to the outer member and provide the predominant conductive heat transfer passageway between the inner and outer members.
摘要翻译：本文提供了一种与测试装置一起使用的加强装置。在一些实施例中，用于与测试装置一起使用的加强件包括内部构件; 与所述内部构件以主要间隔开的关系设置的外部构件; 以及用于使内部和外部构件相对于彼此定向的多个对准机构，其中对准机构将施加到内部构件的下表面的力传递到外部构件，并且在内部构件和内部构件之间提供主要的导电传热通道外部成员。

59. 发明申请

US20080036480A1 Adjustment Mechanism 失效
标题翻译：调整机制
公开(公告)号：US20080036480A1
公开(公告)日：2008-02-14
申请号：US11464593
申请日：2006-08-15
申请人： Eric D. Hobbs , Christopher D. McCoy , James M. Porter , Alexander H. Slocum
发明人： Eric D. Hobbs , Christopher D. McCoy , James M. Porter , Alexander H. Slocum
IPC分类号： G01R31/02
CPC分类号： G01R31/2891 , G01R31/31905
摘要： A probe card assembly can comprise a support structure to which a plurality of probes can be directly or indirectly attached. The probes can be disposed to contact an electronic device to be tested. The probe card assembly can further comprise actuators, which can be configured to change selectively an attitude of the support structure with respect to a reference structure. The probe card assembly can also comprise a plurality of lockable compliant structures. While unlocked, the lockable compliant structures can allow the support structure to move with respect to the reference structure. While locked, however, the compliant structures can provide mechanical resistance to movement of the support structure with respect to the reference structure.
摘要翻译：探针卡组件可以包括支撑结构，多个探针可以直接或间接附接到支撑结构。可以将探针设置成接触要测试的电子设备。探针卡组件还可以包括致动器，其可以被配置为相对于参考结构选择性地改变支撑结构的姿态。探针卡组件还可以包括多个可锁定的柔顺结构。当解锁时，可锁定的柔性结构可以允许支撑结构相对于参考结构移动。然而，当锁定时，柔性结构可以提供对支撑结构相对于参考结构的移动的机械阻力。

60. 发明申请

US20070290705A1 Sawing tile corners on probe card substrates 失效
标题翻译：在探针卡片基板上锯切瓦角
公开(公告)号：US20070290705A1
公开(公告)日：2007-12-20
申请号：US11455110
申请日：2006-06-16
申请人： Benjamin N. Eldridge , Roy J. Henson , Eric D. Hobbs , Peter B. Mathews , Makarand S. Shinde
发明人： Benjamin N. Eldridge , Roy J. Henson , Eric D. Hobbs , Peter B. Mathews , Makarand S. Shinde
IPC分类号： G01R31/26
CPC分类号： G01R1/07342
摘要： A composite substrate for testing semiconductor devices is formed by selecting a plurality of substantially identical individual substrates, cutting a corner from at least some of the individual substrates in accordance with their position in a final array configuration, and then assembling the individual substrates into the final array configuration. The final array configuration of substrates with corners cut or sawed away conforms more closely to the surface area of a wafer being tested, and can easily fit within space limits of a test environment.
摘要翻译：用于测试半导体器件的复合衬底通过选择多个基本上相同的单独衬底形成，根据它们在最终阵列构型中的位置从至少一些单个衬底切割拐角，然后将各个衬底组装成最终阵列配置。具有切割或锯切的角落的基底的最终阵列配置更接近于正被测试的晶片的表面积，并且可以容易地配合在测试环境的空间极限内。

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