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    • 52. 发明授权
    • Method of making a microceramic electromagnetic light shutter
    • 制造微电感电磁光闸的方法
    • US5881449A
    • 1999-03-16
    • US808896
    • 1997-02-28
    • Syamal K. GhoshDilip K. ChatterjeeEdward P. Furlani
    • Syamal K. GhoshDilip K. ChatterjeeEdward P. Furlani
    • G03B9/08H01F7/06
    • G03B9/08Y10T29/4902
    • A method of making a microceramic electromagnetic light shutter, includes forming a micromolded bottom ceramic portion in the green state with a sacrificial fiber having a first and second end portion and being shaped in the form of a coil, mounted on its surface; forming a micromolded top ceramic portion in the green state having surface features that include a pair of bearing structures, at least one stop structure, and a first and second through-hole; assembling the top and bottom micromolded ceramic portions with the first and second ends of the sacrificial fiber being drawn through the first and second through-holes, respectively, and sintering such assembled structure to form a unitary ceramic body; etching through the first and second through-holes to etch away the sacrificial fiber to thereby provide an embedded coil receiving cavity. The method further includes filling the coil receiving cavity with a conductive material to form an embedded coil; providing a light aperture through the unitary ceramic body and a first and second recess in the unitary ceramic body; mounting a ferromagnetic element in the first recess; and mounting a shutter drive mechanism, having a shutter blade in the second recess and in operative relationship to the embedded coil and the ferromagnetic element, and such shutter blade being movable between light blocking and light passing positions relative to the light aperture so that when a drive voltage is applied to the coil, a field is created which provides a driving force to the shutter drive mechanism to move the shutter blade to the light passing position and when the voltage is discontinued the ferromagnetic element provides a torque on the shutter drive mechanism to return it to the light blocking position.
    • 一种制造微电陶瓷电磁光闸的方法,包括:在具有第一和第二端部的牺牲纤维上形成呈绿色状态的微成型底部陶瓷部分,其形状为线圈形状,安装在其表面上; 形成处于绿色状态的微成型顶部陶瓷部分,其具有包括一对轴承结构,至少一个止动结构以及第一和第二通孔的表面特征; 组装顶部和底部微成型陶瓷部分,牺牲纤维的第一和第二端分别被吸入第一和第二通孔,并烧结这种组装结构以形成整体陶瓷体; 蚀刻穿过第一和第二通孔以蚀刻掉牺牲光纤,从而提供嵌入的线圈接收腔。 该方法还包括用导电材料填充线圈容纳腔以形成嵌入式线圈; 提供通过整体陶瓷体的光孔和在整体陶瓷体中的第一和第二凹部; 将铁磁元件安装在所述第一凹槽中; 以及安装快门驱动机构,其具有在所述第二凹部中的快门叶片并且与所述嵌入式线圈和所述铁磁元件具有可操作的关系,并且所述快门叶片可在相对于所述光孔的光阻挡和光通过位置之间移动,使得当 驱动电压被施加到线圈,产生一个场,其向快门驱动机构提供驱动力,以将快门叶片移动到光通过位置,并且当电压停止时,铁磁元件在快门驱动机构上提供转矩 将其返回到遮光位置。
    • 53. 发明授权
    • Embedding a multiwound microcoil in a ceramic structure
    • 在陶瓷结构中嵌入多绕组微线圈
    • US5804130A
    • 1998-09-08
    • US896901
    • 1997-07-18
    • Edward P. FurlaniSyamal K. GhoshDilip K. Chatterjee
    • Edward P. FurlaniSyamal K. GhoshDilip K. Chatterjee
    • H01F41/04B28B1/38
    • H01F41/043
    • A method for forming an embedded multiwound microcoil in a ceramic substrate including the steps of forming a sacrificial mutiwound microcoil to be used in the ceramic substrate by wrapping a first sacrificial coil winding about the midsection of a sintered ceramic bar thereby forming a one winding sacrificial coil structure; dipping the one winding sacrificial coil structure in a sol-gel precursor and then forming an encapsulated one winding sacrificial coil structure from such sol-gel precursor; wrapping a second sacrificial coil winding about the midsection of the encapsulated one winding sacrificial coil structure thereby forming a two winding sacrificial coil structure. The method further includes incorporating the multiwound sacrificial coil structure into a green ceramic substrate; sintering the green ceramic substrate at a sufficient temperature to burn away the sacrificial coil windings thereby forming an embedded coil receiving cavity; flowing molten electrically conductive material into the embedded coil receiving cavity; and cooling the molten electrically conductive material to form the multiwound microcoil embedded in a ceramic substrate.
    • 一种用于在陶瓷衬底中形成嵌入式多重绕线圈的方法,包括以下步骤:通过围绕烧结陶瓷棒的中部包裹第一牺牲线圈绕组形成用于陶瓷衬底中的牺牲多圈微线圈,从而形成一绕组牺牲线圈 结构体; 将一个缠绕的牺牲线圈结构浸入溶胶 - 凝胶前体中,然后从这种溶胶 - 凝胶前体形成封装的一个绕组牺牲线圈结构; 围绕封装的一个绕组牺牲线圈结构的中间部分缠绕第二牺牲线圈绕组,从而形成两绕组牺牲线圈结构。 该方法还包括将多绕组牺牲线圈结构结合到生坯陶瓷衬底中; 在足够的温度下烧结绿色陶瓷衬底以烧掉牺牲线圈绕组,从而形成嵌入式线圈容纳腔; 将熔融的导电材料流入嵌入式线圈容纳腔; 并冷却熔融的导电材料以形成嵌入在陶瓷衬底中的多重绕线圈。