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    • 56. 发明申请
    • SILICONE COMPOSITION AND CURED SILICONE RESIN
    • 硅胶组合物和固化硅树脂
    • WO2006055231A1
    • 2006-05-26
    • PCT/US2005/039376
    • 2005-11-01
    • DOW CORNING CORPORATIONSMITH, Michael, AndrewZHU, Bizhong
    • SMITH, Michael, AndrewZHU, Bizhong
    • C08L83/04C08K5/54
    • C08K5/5403C08G77/12C08G77/20C08K5/5425C08L83/04C08L2205/02C08L83/00
    • A silicone composition according to the present invention comprises (A) an organopolysiloxane resin having an average of at least two silicon-bonded alkenyl groups per molecule, (B) an organohydrogensilane in an amount sufficient to cure the composition, (C) an effective amount of a reactive diluent comprising (i) an organosiloxane having an average of at least two alkenyl groups per molecule and a viscosity of from 0.001 to 2 Pa . s at 25 °C, wherein the viscosity of (C)(i) is not greater than 20% of the viscosity of component (A), and (ii) an organohydrogensiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule and a viscosity of from 0.001 to 2 Pa . s at 25 °C, in an amount sufficient to provide from 0.5 to 3 moles of silicon-bonded hydrogen atoms in (C)(ii) to moles of alkenyl groups in (C)(i), and (D) a catalytic amount of a hydrosilylation catalyst; and a cured silicone resin prepared by curing the silicone composition.
    • 根据本发明的硅氧烷组合物包含(A)每分子平均具有至少两个硅键合的烯基的有机聚硅氧烷树脂,(B)足以固化组合物的量的有机氢硅烷,(C)有效量 的反应性稀释剂,其包含(i)每分子平均具有至少两个烯基的有机硅氧烷和在25℃下的粘度为0.001至2Pa·s,其中(C )(i)不大于组分(A)的粘度的20%,和(ii)每分子平均具有至少两个与硅键合的氢原子的有机氢硅氧烷,粘度为0.001-2Pa