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    • 59. 发明公开
    • METHODS OF PROCESSING ELECTRONIC DEVICES
    • VERFAHREN ZUR BEARBEITUNG ELEKTRONISCHER VORRICHTUNGEN
    • EP2974534A1
    • 2016-01-20
    • EP14772973.5
    • 2014-03-10
    • Corning Incorporated
    • BOWDEN, Bradley FrederickELLISON, Adam JamesWEEKS, Wendell Porter
    • H05B33/02G02F1/00G09F9/00
    • B32B17/06G02F1/1333G02F1/133305H01L27/1266
    • A method of processing electronic devices includes obtaining an article (2) having a thin glass sheet (20) coupled to a carrier (10) that has a first QCOLED compaction value. The article is subjected to a first processing cycle (P1) to form a first device (40) on the thin glass sheet, wherein after the first processing cycle, the carrier has a second QCOLED compaction value that is less than the first QCOLED compaction value. The thin glass sheet is removed (P2) from the carrier. Subsequently, the carrier is subjected to a second processing cycle (P4) to form a second device (50) thereon, wherein during the second processing cycle a maximum processing temperature used is not the same as that used during the first processing cycle. Instead of forming second devices on the carrier, a second thin sheet (220) may be coupled to the carrier and third devices (60) processed thereon.
    • 一种处理电子设备的方法包括获得具有耦合到具有第一QCOLED压实值的载体(10)的薄玻璃板(20)的物品(2)。 对物品进行第一处理循环(P1)以在薄玻璃板上形成第一装置(40),其中在第一处理循环之后,载体具有小于第一QCOLED压实值的第二QCOLED压实值 。 从载体上除去薄玻璃板(P2)。 随后,载体经受第二处理循环(P4)以在其上形成第二装置(50),其中在第二处理循环期间,使用的最大处理温度与在第一处理循环期间使用的最大处理温度不同。 代替在载体上形成第二装置,第二薄片(220)可以联接到在其上处理的载体和第三装置(60)。