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    • 54. 发明授权
    • Carrier head with edge load retaining ring
    • 承载头带边缘负载保持环
    • US06890249B1
    • 2005-05-10
    • US10327236
    • 2002-12-20
    • Steven M. ZunigaMing-Kuei Tseng
    • Steven M. ZunigaMing-Kuei Tseng
    • B24B37/04B24B47/02
    • B24B37/32
    • A carrier head for chemical mechanical polishing of a substrate having a front surface, a back surface and an edge. The carrier head has a base, an inner retaining ring positioned beneath the base, and an outer retaining ring surrounding the inner retaining ring to retain the inner retaining ring. The inner retaining ring has a main portion with a first surface to apply a load to a perimeter portion of the back surface of the substrate and an annular lower projection protruding downwardly from the main portion with a second surface to circumferentially surround the edge of the substrate to retain the substrate.
    • 用于具有前表面,后表面和边缘的基底的化学机械抛光的载体头。 承载头具有基座,位于基座下方的内部保持环和围绕内部保持环以保持内部保持环的外部保持环。 内保持环具有主要部分,其具有第一表面,以将负载施加到基板的后表面的周边部分;以及环形下突出部,其从主体部分向下突出并具有第二表面以周向地围绕基板的边缘 以保持基底。
    • 57. 发明授权
    • Carrier head with a flexible membrane and an edge load ring
    • 承载头带有柔性膜和边缘负载环
    • US06358121B1
    • 2002-03-19
    • US09610582
    • 2000-07-05
    • Steven M. Zuniga
    • Steven M. Zuniga
    • B24B722
    • B24B37/30B24B37/32
    • A carrier head for chemical mechanical polishing includes a base and a flexible membrane. A lower surface of the flexible membrane provides a substrate receiving surface of a substrate. The lower surface includes a first surface to apply a first pressure to a first portion of the substrate. A second surface surrounding the first surface applies a second pressure on a second portion of the substrate. An edge load ring surrounds the second surface. A lower surface of the edge load ring provides a third surface to apply a third pressure to a third portion of the substrate surrounding the second portion.
    • 用于化学机械抛光的载体头包括基底和柔性膜。 柔性膜的下表面提供了基板的基板接收表面。 下表面包括将第一压力施加到基板的第一部分的第一表面。 围绕第一表面的第二表面在基底的第二部分上施加第二压力。 边缘负载环围绕第二表面。 边缘负载环的下表面提供第三表面,以将第三压力施加到围绕第二部分的基板的第三部分。