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51. 发明授权

US07142181B2 Circuit board for large screen LED matrix array display 有权
标题翻译：电路板用于大屏幕LED矩阵阵列显示
公开(公告)号：US07142181B2
公开(公告)日：2006-11-28
申请号：US10685892
申请日：2003-10-16
申请人： Bily Wang , Jonnie Chuang , John Lin
发明人： Bily Wang , Jonnie Chuang , John Lin
IPC分类号： G09G5/00 , G09G3/32
CPC分类号： G09F9/33 , G09F9/3026 , Y10S248/917 , Y10S345/905
摘要： Multiple LED matrix array circuit boards are pieced together a form a display panel. L-shape brackets are mounted on the bottom sides of the circuit boards and aligned with the butting edges of the circuit boards. The vertical butting walls are pressed together by clamps. A set screw is inserted in one jaw of the clamp to tighten the pressure between butting edges of the circuit boards. Another set screw is inserted on top of the clamp to align the adjacent boards vertically.
摘要翻译：将多个LED矩阵阵列电路板拼接成一个显示面板。 L形支架安装在电路板的底部，并与电路板的对接边缘对齐。垂直对接墙通过夹具压在一起。一个固定螺丝插入夹具的一个夹爪中，以紧固电路板对接边缘之间的压力。另一个固定螺钉插入夹具的顶部，以使相邻的板垂直对齐。

52. 发明申请

US20060232983A1 Lighting module 有权
标题翻译：照明模组
公开(公告)号：US20060232983A1
公开(公告)日：2006-10-19
申请号：US11108800
申请日：2005-04-19
申请人： Bily Wang , Jonnie Chuang , Chun-Cheng Weng
发明人： Bily Wang , Jonnie Chuang , Chun-Cheng Weng
IPC分类号： F21V29/00
CPC分类号： F21V29/70 , F21K9/00 , H01L33/64 , Y10S362/80
摘要： A light module includes a lighting unit, a heat-dissipation plate and an insulative plate. The lighting unit has a leading contact. The heat-dissipation plate contacts the lighting module closely and has a channel corresponding to the leading contact. The insulative plate is disposed under the heat-dissipation plate, and has a predetermined conductive pattern arranged thereon and a through hole corresponding to the channel. The leading contact of the lighting unit penetrates through the channel of the heat-dissipation plate and the through hole of the insulative plate to electrically connect with the predetermined conductive pattern of the insulative plate.
摘要翻译：光模块包括照明单元，散热板和绝缘板。照明单元有一个领先的接触。散热板与照明模块紧密接触，并具有与引导触点对应的通道。绝缘板设置在散热板下方，并且具有布置在其上的预定导电图案和与通道对应的通孔。照明单元的前导触头穿过绝热板的散热板的通道和通孔，以与绝缘板的预定导电图案电连接。

53. 发明申请

US20060099728A1 Method of manufacturing a substrate structure for increasing cutting precision and strength thereof 失效
标题翻译：制造提高切割精度和强度的基板结构的方法
公开(公告)号：US20060099728A1
公开(公告)日：2006-05-11
申请号：US11304558
申请日：2005-12-16
申请人： Bily Wang , Jonnie Chuang , Hui-Yen Huang
发明人： Bily Wang , Jonnie Chuang , Hui-Yen Huang
IPC分类号： H01L21/00
CPC分类号： H05K3/0052 , H05K1/056 , H05K3/445 , H05K2201/09881 , H05K2203/0228 , H05K2203/0278 , H05K2203/1536
摘要： A method of manufacturing a substrate structure includes the steps of: (1) providing a metal substrate having a metal portion; (2) chemically etching a plurality of trenches in the metal substrate; (3) applying a polymer composite material into the trenches to form a substrate having a polymer composite portion abutted to the metal portion; (4) polishing a surface of the substrate to make a height of the polymer composite portion equal to that of the metal portion; (5) forming a covering material on the surface of the substrate; and (6) cutting the substrate via the polymer composite portion for decreasing cutting bur produced on the metal portion. Furthermore, the method is provided for combining the metal substrate and the polymer composite material, thereby to increase cutting precision and strength of the substrate structure.
摘要翻译：一种制造衬底结构的方法包括以下步骤：（1）提供具有金属部分的金属衬底; （2）化学蚀刻金属基板中的多个沟槽; （3）将聚合物复合材料施加到沟槽中以形成具有与金属部分邻接的聚合物复合部分的基底; （4）研磨基板的表面，使聚合物复合部的高度与金属部的高度相等; （5）在基板的表面上形成覆盖材料; 和（6）通过聚合物复合部分切割基底以减少在金属部分上产生的切割毛刺。此外，提供了用于组合金属基板和聚合物复合材料的方法，从而提高基板结构的切割精度和强度。

54. 发明申请

US20060035406A1 METHOD OF FORMING A COMPOSITE POLYMER MATERIAL INSIDE TRENCHES OF A SEMICONDUCTOR SUBSTRATE TO FORM A COMPOSITE POLYMER STRUCTURE 审中-公开
标题翻译：在半导体基板的内部形成复合聚合物材料以形成复合聚合物结构的方法
公开(公告)号：US20060035406A1
公开(公告)日：2006-02-16
申请号：US10918371
申请日：2004-08-16
申请人： Bily Wang , Jonnie Chuang , Hui-Yen Huang
发明人： Bily Wang , Jonnie Chuang , Hui-Yen Huang
IPC分类号： H01L21/50 , H01L23/48
CPC分类号： H05K3/445 , H05K1/056 , H05K3/0052 , H05K2201/09881 , H05K2203/0228 , H05K2203/0278 , H05K2203/1536
摘要： A semiconductor substrate structure includes a substrate having a trench formed thereon, a polymer composite material supplied into the trench and an electroplate conductive layer formed on the substrate. Further, a semiconductor substrate processing method includes the steps of: providing a substrate forming a trench thereon, supplying a polymer composite material into the trench, polishing a surface of the substrate and forming a covering material on the surface of the substrate. Therefore, the method is provided for combining the polymer composite material into the substrate, thereby to raise cutting precision and strength of the semiconductor substrate structure.
摘要翻译：半导体衬底结构包括其上形成有沟槽的衬底，提供到沟槽中的聚合物复合材料和形成在衬底上的电镀导电层。此外，半导体衬底处理方法包括以下步骤：提供在其上形成沟槽的衬底，将聚合物复合材料供应到沟槽中，抛光衬底的表面并在衬底的表面上形成覆盖材料。因此，提供了将聚合物复合材料组合到基板中的方法，从而提高半导体基板结构的切割精度和强度。

55. 外观设计

USD507246S1 Light emitting diode package 失效
公开(公告)号：USD507246S1
公开(公告)日：2005-07-12
申请号：US29179370
申请日：2003-04-10
申请人： Bily Wang , Jonnie Chuang
设计人： Bily Wang , Jonnie Chuang

56. 发明授权

US08137999B2 Package for a light emitting diode and method for fabricating the same 有权
标题翻译：发光二极管封装及其制造方法
公开(公告)号：US08137999B2
公开(公告)日：2012-03-20
申请号：US13214337
申请日：2011-08-22
申请人： Bily Wang , Jonnie Chuang , Hui-Yen Huang
发明人： Bily Wang , Jonnie Chuang , Hui-Yen Huang
IPC分类号： H01L21/56
CPC分类号： H01L33/486 , H01L33/56 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A method for fabricating a LED includes: providing a metal substrate; etching the metal substrate to form a first terminal, a second terminal, and a gap between the first terminal and the second terminal, wherein the first terminal has at least one first etching concave and the second terminal has at least one second etching concave; placing at least one LED chip in the at least one first etching concave, wherein the at least one LED chip has a first electrode and a second electrode; electrically connecting the first electrode with the first terminal, and electrically connecting the second electrode with the second terminal; and then covering the at least one LED chip with synthetic polymer, wherein the synthetic polymer is filled into the at least one first etching concave, the at least one second etching concave and the gap to connect the first terminal with the second terminal.
摘要翻译：一种制造LED的方法包括：提供金属基板; 蚀刻金属基板以形成第一端子，第二端子和第一端子和第二端子之间的间隙，其中第一端子具有至少一个第一蚀刻凹部，并且第二端子具有至少一个第二蚀刻凹部; 将至少一个LED芯片放置在所述至少一个第一蚀刻凹部中，其中所述至少一个LED芯片具有第一电极和第二电极; 将第一电极与第一端子电连接，并将第二电极与第二端子电连接; 然后用合成聚合物覆盖所述至少一个LED芯片，其中所述合成聚合物填充到所述至少一个第一蚀刻凹部中，所述至少一个第二蚀刻凹部和所述间隙将所述第一端子与所述第二端子连接。

57. 发明授权

US07923745B2 LED chip package structure with high-efficiency light-emitting effect and method of packaging the same 有权
标题翻译： LED芯片封装结构具有高效发光效果和封装方法相同
公开(公告)号：US07923745B2
公开(公告)日：2011-04-12
申请号：US11779556
申请日：2007-07-18
申请人： Bily Wang , Jonnie Chuang , Wen-Kuei Wu
发明人： Bily Wang , Jonnie Chuang , Wen-Kuei Wu
IPC分类号： H01L33/00
CPC分类号： B29C45/14655 , B29C33/0022 , F21K9/00 , F21K9/20 , F21Y2103/10 , F21Y2115/10 , G09F9/33 , G09F13/22 , H01L24/97 , H01L33/52 , H01L2224/16225 , H01L2224/48091 , H01L2224/97 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01047 , H01L2924/01074 , H01L2924/01082 , H01L2924/12041 , H01L2924/15747 , H01L2924/15787 , H01L2224/81 , H01L2924/00014 , H01L2224/85 , H01L2924/00
摘要： An LED chip package structure with high-efficiency light-emitting effect includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit. The package colloid unit has a plurality of package colloids respectively covered on the LED chips.
摘要翻译：具有高效率发光效果的LED芯片封装结构包括基板单元，发光单元和封装胶体单元。基板单元具有分别形成在基板主体上的基板主体和正极迹线和负极迹线。发光单元具有布置在基板主体上的多个LED芯片，并且每个LED芯片分别具有正极侧和负极侧，并与基板单元的正极迹线和负极迹线电连接。封装胶体单元具有分别覆盖在LED芯片上的多个封装胶体。

58. 发明授权

US07824938B2 Method for manufacturing an LED chip package structure 有权
标题翻译：制造LED芯片封装结构的方法
公开(公告)号：US07824938B2
公开(公告)日：2010-11-02
申请号：US12382760
申请日：2009-03-24
申请人： Bily Wang , Jonnie Chuang , Hui-Yen Huang
发明人： Bily Wang , Jonnie Chuang , Hui-Yen Huang
IPC分类号： H01L21/00
CPC分类号： H01L25/0753 , H01L24/97 , H01L33/483 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/97 , H01L2924/01082 , H01L2924/12041 , H01L2224/85 , H01L2924/00014
摘要： An LED chip package structure with thick guiding pin includes a plurality of conductive pins separated from each other, an insulative casing, a plurality of LED chips, and a packaging colloid. The insulative casing covers a bottom side of each conductive pin to form an injection concave groove for exposing a top surface of each conductive pin. Two lateral sides of each conductive pin are extended outward from the insulative casing. The LED chips are arranged in the injection concave groove, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with different conductive pins. In addition, the packaging colloid is filled into the injection concave groove for covering the LED chips.
摘要翻译：具有厚引导针的LED芯片封装结构包括彼此分离的多个导电引脚，绝缘壳体，多个LED芯片和封装胶体。绝缘壳体覆盖每个导电销的底侧，以形成用于暴露每个导电销的顶表面的注入凹槽。每个导电针的两个侧面从绝缘壳体向外延伸。 LED芯片布置在注入凹槽中，并且每个LED芯片分别具有正极侧和负极侧，并且与不同的导电针电连接。此外，将包装胶体填充到用于覆盖LED芯片的注入凹槽中。

59. 发明申请

US20100099207A1 LED chip package structure with high-efficiency light-emitting effect and method of packaging the same 有权
标题翻译： LED芯片封装结构具有高效发光效果和封装方法相同
公开(公告)号：US20100099207A1
公开(公告)日：2010-04-22
申请号：US12591329
申请日：2009-11-17
申请人： Bily Wang , Jonnie Chuang , Wen-Kuei Wu
发明人： Bily Wang , Jonnie Chuang , Wen-Kuei Wu
IPC分类号： H01L21/50
CPC分类号： G02F1/133603 , H01L2224/48091 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00012
摘要： An LED chip package structure with high-efficiency light-emitting effect includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body. Each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit. The package colloid unit has a plurality of package colloids respectively covered on the LED chips. Each package colloid has a colloid cambered surface and a colloid light-emitting surface respectively formed on a top surface and a front surface thereof.
摘要翻译：具有高效率发光效果的LED芯片封装结构包括基板单元，发光单元和封装胶体单元。基板单元具有分别形成在基板主体上的基板主体和正极迹线和负极迹线。发光单元具有布置在基板主体上的多个LED芯片。各LED芯片分别具有正极侧和负极侧，与基板单元的正极迹线和负极迹线电连接。封装胶体单元具有分别覆盖在LED芯片上的多个封装胶体。每个包装胶体具有分别形成在其顶表面和前表面上的胶体弧形表面和胶体发光表面。

60. 发明申请

US20090124032A1 Penetrating hole type LED chip package structure using a ceramic material as a substrate and method for manufacturing the same 有权
标题翻译：使用陶瓷材料作为基板的穿透孔型LED芯片封装结构及其制造方法
公开(公告)号：US20090124032A1
公开(公告)日：2009-05-14
申请号：US12314168
申请日：2008-12-05
申请人： Bily Wang , Jonnie Chuang , Chia-Hung Chen
发明人： Bily Wang , Jonnie Chuang , Chia-Hung Chen
IPC分类号： H01L21/50
CPC分类号： H01L33/483 , H01L33/62 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2224/48091 , H01L2224/48247 , H01L2924/09701 , H01L2924/00014
摘要： An LED chip package structure includes a ceramic substrate, a conductive unit, a hollow ceramic casing, many LED chips, and a package colloid. The ceramic substrate has a main body, many protrusions extended from the main body, many penetrating holes respectively penetrating through the protrusions, and many half through holes formed on a lateral side of the main body and respectively formed between each two protrusions. The conductive unit has many first conductive layers respectively formed on the protrusions, many second conductive layers respectively formed on inner surfaces of the half through holes and a bottom face of the main body, and many third conductive layers respectively filled in the penetrating holes. The hollow ceramic casing is fixed on the main body to form a receiving space. The LED chips is received in the receiving space. The package colloid is filled in the receiving space for covering the LED chips.
摘要翻译： LED芯片封装结构包括陶瓷基板，导电单元，中空陶瓷外壳，许多LED芯片和封装胶体。陶瓷基板具有主体，从主体延伸的许多突起，分别穿过突起的许多穿透孔和形成在主体的侧面上并分别形成在每个两个突起之间的许多半通孔。导电单元具有分别形成在突起上的许多第一导电层，分别形成在半通孔的内表面上的许多第二导电层和主体的底面，以及分别填充在穿透孔中的许多第三导电层。中空陶瓷壳体固定在主体上以形成容纳空间。 LED芯片被接收在接收空间中。包装胶体填充在用于覆盖LED芯片的接收空间中。

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