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    • 53. 发明授权
    • Floor plan for scalable multiple level tab oriented interconnect architecture
    • 可扩展多级标签定向互连架构的平面图
    • US07126375B2
    • 2006-10-24
    • US11326543
    • 2006-01-04
    • Benjamin S. TingPeter M. Pani
    • Benjamin S. TingPeter M. Pani
    • G06F9/00
    • H03K19/17736H03K19/17704H03K19/17792H03K19/17796
    • A multiple level routing architecture for a programmable logic device having logical blocks, each logical block comprising a plurality of cells, with a first level routing resources coupling the cells of logical blocks. A second level routing resources coupling the first level routing resources through tab networks; each tab network comprises a first plurality of switches coupling the first level routing resources to an intermediate tab and the intermediate tab coupling the second level routing resources through a second plurality of switches, each switch may comprise an additional buffer. Repeated applications of tab networks provide connections between lower level routing resources to higher level routing resources.
    • 具有逻辑块的可编程逻辑设备的多级路由架构,每个逻辑块包括多个小区,具有耦合逻辑块的小区的第一级路由资源。 第二级路由资源通过标签网络耦合第一级路由资源; 每个标签网络包括将第一级路由资源耦合到中间标签的第一多个交换机,以及通过第二多个交换机耦合第二级路由资源的中间标签,每个交换机可以包括附加缓冲器。 标签网络的重复应用提供了较低级别路由资源与较高级别路由资源之间的连接。
    • 54. 发明授权
    • Floor plan for scalable multiple level tab oriented interconnect architecture
    • US07009422B2
    • 2006-03-07
    • US10021744
    • 2001-12-05
    • Benjamin S. TingPeter M. Pani
    • Benjamin S. TingPeter M. Pani
    • G06F9/00
    • H03K19/17736H03K19/17704H03K19/17792H03K19/17796
    • A programmable logic device which incorporates an innovative routing hierarchy consisting of the multiple levels of routing lines, connector tab networks and turn matrices, enables an innovative, space saving floor plan to be utilized in an integrated circuit implementation, and is particularly efficient when an SRAM is used as the configuration bit This floor plan is a scalable block architecture in which each block connector tab networks of a 2×2 block grouping is arranged as a mirror image along the adjacent axis relative to each other. Furthermore, the bidirectional input/output lines are provided as the input/output means for each block are oriented only in two directions (instead of the typical north, south, east and west directions) such that the block connector tab networks for adjacent blocks face each other in orientation. This orientation and arrangement permits blocks to share routing resources. In addition, this arrangement enables a 4×4 block grouping to be scalable. The innovative floor plan makes efficient use of die space with little layout dead space as the floor plan provides for a plurality of contiguous memory and passgate arrays (which provide the functionality of the bidirectional switches) with small regions of logic for CFGs and drivers of the block connector tab networks. Therefore, the gaps typically incurred due to a mixture of memory and logic are avoided. Intra-cluster routing lines and bi-directional routing lines are overlayed on different layers of the chip together with memory and passgate arrays to provide connections to higher level routing lines and connections between CFGs in the block.