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    • 55. 发明授权
    • Semiconductor device with a charge carrier compensation structure in a semiconductor body and method for its production
    • 具有半导体主体中的载流子补偿结构的半导体器件及其制造方法
    • US08101997B2
    • 2012-01-24
    • US12111749
    • 2008-04-29
    • Armin WillmerothMichael Rueb
    • Armin WillmerothMichael Rueb
    • H01L29/66
    • H01L29/7802H01L29/0634H01L29/0878H01L29/1095H01L29/41766H01L29/66727H01L29/7395
    • A semiconductor device with a charge carrier compensation structure in a semiconductor body and to a method for its production. The semiconductor body includes drift zones of a first conduction type and charge compensation zones of a second conduction type complementing the first conduction type. The drift zones include a semiconductor material applied in epitaxial growth zones, wherein the epitaxial growth zones include an epitaxially grown semiconductor material which is non-doped to lightly doped. Towards the substrate, the epitaxial growth zones are provided with a first conduction type incorporated by ion implantation over the entire surface and with selectively introduced doping material zones of a second, complementary conduction type. Towards the front side, the epitaxial growth zones are provided with a second, complementary conduction type incorporated by ion implantation over the entire surface and with selectively introduced doping material zones of the first conduction type.
    • 在半导体本体中具有电荷载流子补偿结构的半导体器件及其制造方法。 半导体本体包括第一导电类型的漂移区和补充第一导电类型的第二导电类型的电荷补偿区。 漂移区包括施加在外延生长区中的半导体材料,其中外延生长区包括未掺杂以轻掺杂的外延生长的半导体材料。 朝向衬底,外延生长区域被提供有在整个表面上通过离子注入并入的第一导电类型,并且选择性地引入第二互补导电类型的掺杂材料区域。 朝向前侧,外延生长区设置有通过在整个表面上的离子注入并入并且选择性地引入第一导电类型的掺杂材料区的第二互补导电类型。