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    • 53. 发明授权
    • Optimum design method and apparatus, and program for the same
    • 最佳设计方法和设备,以及相同的程序
    • US07676350B2
    • 2010-03-09
    • US11778367
    • 2007-07-16
    • Teruyoshi WashizawaAkira AsaiMasayoshi TachiharaKatsuhiko SinjoNobuhiro Yoshikawa
    • Teruyoshi WashizawaAkira AsaiMasayoshi TachiharaKatsuhiko SinjoNobuhiro Yoshikawa
    • G06F17/50G06G7/48
    • G06F17/11
    • In an optimum design method comprising a first solution determining step of solving an optimization problem of a first evaluation function for a state variable vector with a design variable vector being as a parameter, and a second solution determining step of solving an optimization problem of a second evaluation function for the design variable vector and the state variable vector thus obtained, the second solution determining step includes the steps of computing a gradient vector of the second evaluation function for the design variable vector, computing a first coefficient based on a value of a norm of the gradient vector, computing a search vector based on the first coefficient, computing a second coefficient, and updating the design variable vector based on the second coefficient. The second coefficient computing step includes the first solution determining step, the first solution determining step is executed as an iterative method based on the gradient vector, and the state variable vector is not initialized during iteration. The optimum design method is precisely adaptable for structural changes.
    • 一种最优设计方法,包括:第一解决方案确定步骤,用于以设计变量向量作为参数来求解用于状态变量向量的第一评估函数的优化问题;以及第二解决方案确定步骤,用于求解第二 第二解决方案确定步骤包括以下步骤:计算用于设计变量向量的第二评估函数的梯度向量,基于规范的值计算第一系数;对于设计变量向量和状态变量向量的评估函数, 的梯度向量,基于第一系数计算搜索向量,计算第二系数,并且基于第二系数更新设计变量向量。 第二系数计算步骤包括第一解决方案确定步骤,基于梯度向量作为迭代方法执行第一解决方案确定步骤,并且在迭代期间不初始化状态变量向量。 最佳设计方法适用于结构变化。
    • 57. 发明授权
    • Information processing apparatus for numerically analyzing incompressible fluid and method therefor
    • 用于数值分析不可压缩流体的信息处理装置及其方法
    • US07203606B2
    • 2007-04-10
    • US11275142
    • 2005-12-15
    • Kota NakanoAkira Asai
    • Kota NakanoAkira Asai
    • G01F17/00
    • G06F17/5018G06F2217/16
    • During an incompressible fluid movement, three consecutive times during the movement of the fluid are called first, second, and third times in time order, calculation is performed with two different types of lattices for the first and third times and for the second time. Momentum and mass density at the first time are temporally developed to the third time in accordance with a conservation law by using an upwind velocity field. A pressure at the second time is determined so that a velocity field derived from momenta at the third time satisfies an incompressibility condition, and the field at the third time is corrected by adding a change in momentum caused by a pressure term using the determined pressure. This prevents pressure vibration and avoids the complexity of advective term calculation.
    • 在不可压缩的流体运动期间,在流体运动期间连续三次被称为第一次,第二次和第三次的时间顺序,对于第一次和第三次以及第二次以两种不同类型的格架进行计算。 第一次的动量和质量密度通过使用逆风速度场根据守恒定律在时间上发展到第三次。 确定第二次的压力使得从第三次的动量导出的速度场满足不可压缩条件,并且通过使用所确定的压力加上由压力项引起的动量变化来校正第三次的场。 这可以防止压力振动,避免平流项计算的复杂性。
    • 58. 发明授权
    • Bipolar transistor device having phosphorous
    • 具有磷的双极晶体管器件
    • US07049681B2
    • 2006-05-23
    • US10972442
    • 2004-10-26
    • Teruhito OhnishiAkira Asai
    • Teruhito OhnishiAkira Asai
    • H01L29/02
    • H01L29/66242H01L29/7378
    • A Si1-xGex layer 111b functioning as the base composed of an i-Si1-xGex layer and a p+ Si1-xGex layer is formed on a collector layer 102, and a Si cap layer 111a as the emitter is formed on the p+ Si1-xGex layer. An emitter lead electrode 129, which is composed of an n− polysilicon layer 129b containing phosphorus in a concentration equal to or lower than the solid-solubility limit for single-crystal silicon and a n+ polysilicon layer 129a containing phosphorus in a high concentration, is formed on the Si cap layer 111a in a base opening 118. The impurity concentration distribution in the base layer is properly maintained by suppressing the Si cap layer 111a from being doped with phosphorus (P) in an excessively high concentration. The upper portion of the Si cap layer 111a may contain a p-type impurity. The p-type impurity concentration distribution in the base layer of an NPN bipolar transistor is thus properly maintained.
    • 作为由i-Si 1-x Ge x x构成的基底的Si 1-x Ge 2 x层111b, / SUB层,并且在集电极层102上形成有Si + 1-xSi Ge层,并且Si覆盖层111a 因为发射极形成在p + 1 Si 1-x Ge层上。 发射极引线电极129,其由含有等于或低于单晶硅的固溶度极限的磷的N +和/或多个多晶硅层129b组成, 在基底开口118中的Si覆盖层111a上形成含有高浓度的磷的多晶硅层129a。通过抑制Si覆盖层111a的基底层中的杂质浓度分布适当地保持 以过高浓度的磷(P)掺杂。 Si覆盖层111a的上部可以含有p型杂质。 因此,适当地维持NPN双极晶体管的基极层中的p型杂质浓度分布。
    • 60. 发明授权
    • Method of fabricating a bipolar transistor utilizing a dry etching and a wet etching to define a base junction opening
    • 使用干蚀刻和湿蚀刻来制造双极晶体管以限定基极结开口的方法
    • US06927118B2
    • 2005-08-09
    • US10695478
    • 2003-10-29
    • Ken IdotaTeruhito OhnishiAkira Asai
    • Ken IdotaTeruhito OhnishiAkira Asai
    • H01L21/331H01L21/8249H01L29/737H01L21/8222
    • H01L29/66242H01L21/8249H01L29/7378
    • The present invention discloses a process of fabricating a semiconductor device comprising the steps of: forming a collector layer of a first conductivity type at a portion of a surface of a semiconductor substrate; forming a collector opening portion in a first insulating layer formed on the semiconductor substrate; epitaxially growing, on the semiconductor substrate of the collector opening portion, a semiconductor layer including a layer of a second conductivity type constituting a base layer; sequentially layering, on the semiconductor substrate, an etching stopper layer against dry etching and a masking layer against wet etching; exposing a part of the etching stopper layer by removing a part of the masking layer by means of dry etching; and by subjecting the exposed etching stopper layer to a wet etching treatment using the remaining masking layer as a mask, forming a base junction opening portion through the etching stopper layer and the masking layer.
    • 本发明公开了一种制造半导体器件的方法,包括以下步骤:在半导体衬底的表面的一部分处形成第一导电类型的集电极层; 在形成在所述半导体衬底上的第一绝缘层中形成集电极开口部分; 在集电体开口部的半导体基板上外延生长构成基底层的具有第二导电类型的层的半导体层; 在半导体衬底上依次层叠抗干蚀刻的蚀刻停止层和抗蚀刻的掩模层; 通过干蚀刻去除一部分掩模层来暴露一部分蚀刻阻挡层; 并且通过使用剩余的掩模层作为掩模对暴露的蚀刻停止层进行湿法蚀刻处理,通过蚀刻停止层和掩​​模层形成基底连接开口部分。