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51. 发明专利

DE2235522B2 未知
公开(公告)号：DE2235522B2
公开(公告)日：1979-07-19
申请号：DE2235522
申请日：1972-07-14
申请人： YATES INDUSTRIES, INC., BORDENTOWN, N.J. (V.ST.A.)
发明人： YATES, CHARLES B. , WOLSKI, ADAM M.
IPC分类号： C25D5/10 , C25D5/16 , H05K3/38 , C25D5/50
摘要： Copper foil is subjected to a plurality of copper layer treatments including a roughening treatment followed by a locking or gilding treatment so as to form a matte surface on the copper foil. The matte surface is then coated with a thin layer of zinc and heated to produce a brass layer which provides the copper foil with good bond strength with respect to a supporting substrate, and without laminate staining or discoloration. Other metals may also be used in lieu of zinc.

52. 发明专利

FR2227351B1 未知
公开(公告)号：FR2227351B1
公开(公告)日：1979-06-15
申请号：FR7412621
申请日：1974-04-10
申请人： YATES INDUSTRIES
IPC分类号： C25D1/22 , B21C37/02 , B23K20/00 , B32B15/04 , B32B15/08 , B32B33/00 , C25D7/06 , C25D11/04 , H05K3/02 , H05K3/38 , C23F17/00 , B32B15/20

53. 发明专利

NL158560B 未知
公开(公告)号：NL158560B
公开(公告)日：1978-11-15
申请号：NL7213582
申请日：1972-10-06
申请人： YATES INDUSTRIES
IPC分类号： B21C37/02 , B32B15/01 , B32B15/04 , B32B15/08 , C07D239/54 , C07D239/553 , C25D3/58 , C25D5/10 , C25D5/16 , C25D7/06 , G01N33/00 , H05K3/38 , C25D3/38
摘要： Copper foil is subjected to a two-step electrochemical copper treatment to improve its bond strength, the first step of said treatment involving the use of a copper and arsenic-containing electrolyte. A treatment involving the use of the aforementioned two-step electrochemical copper pretreatment prior to the application of an electrochemical copper treatment. Treated copper foil and printed circuit boards resulting therefrom.

54. 发明专利

DE2445160C3 未知
公开(公告)号：DE2445160C3
公开(公告)日：1978-07-20
申请号：DE2445160
申请日：1974-09-19
申请人： YATES INDUSTRIES, INC., BORDENTOWN, N.J. (V.ST.A.)
发明人： YATES, CHARLES B. , WOLSKI, ADAM M.
IPC分类号： C25D11/38 , C25D9/08

55. 发明专利

NL155892B 未知
公开(公告)号：NL155892B
公开(公告)日：1978-02-15
申请号：NL7404880
申请日：1974-04-10
申请人： YATES INDUSTRIES
IPC分类号： C25D11/38 , B21C37/02 , B32B15/01 , B32B15/04 , B32B15/08 , C25D1/04 , H05K3/02

56. 发明专利

SE398896B 未知
公开(公告)号：SE398896B
公开(公告)日：1978-01-23
申请号：SE7411638
申请日：1974-09-16
申请人： YATES INDUSTRIES
发明人： YATES C B , WOLSKI A M
IPC分类号： C25D9/08

57. 发明专利

FR2148025B1 未知
公开(公告)号：FR2148025B1
公开(公告)日：1977-08-05
申请号：FR7226760
申请日：1972-07-25
申请人： YATES INDUSTRIES
IPC分类号： C25D5/10 , C25D5/16 , H05K3/38 , C23B5/00 , H05K3/00
摘要： Copper foil is subjected to a plurality of copper layer treatments including a roughening treatment followed by a locking or gilding treatment so as to form a matte surface on the copper foil. The matte surface is then coated with a thin layer of zinc and heated to produce a brass layer which provides the copper foil with good bond strength with respect to a supporting substrate, and without laminate staining or discoloration. Other metals may also be used in lieu of zinc.

58. 发明专利

IT1008073B 未知
公开(公告)号：IT1008073B
公开(公告)日：1976-11-10
申请号：IT5400373
申请日：1973-11-29
申请人： YATES INDUSTRIES
IPC分类号： C25D11/38 , B23K1/20 , B23K35/22 , B23K35/36 , H05K3/28 , H05K3/38 , H05K
摘要： 1450351 Soldering YATES INDUSTRIES Inc 3 Dec 1973 [1 Dec 1972] 55863/73 Heading B3R In processing a copper foil having a stainproofing coating containing hexavalent chromium ions, to improve the solder wettability of the coating, a compound such that at the soldering temperature it will react with the coating to expose the copper to the solder is applied to the coating. The foil may be for printed circuits and may be stain-proofed by electrolytic treatment in an aqueous electrolyte containing chromic acid and caustic and suitable compounds which are inert to the coating at 200-350‹ F. but react at 450-560‹ F. include hydrazine hydrochloride and ammonium chloride. The compound may be applied as a water solution by rolling, brushing or spraying if one side is to be treated or by dipping if both sides are to be treated. In an example a copper foil electrochemically treated to deposit on one side microcrystalline, modular, powdery copper is immersed in an aqueous chromic acid/sodium hydroxide electrolyte and then passed through a water spray. The foil then passes through a station where ammonium chloride solution is sprayed on the side opposite the one side. After drying solder wets the ammonium chloride treated side without a flux. The processed foil is, in another example, laminated on its side bearing the powdery copper to a substrate of epoxy glass fibre and the assembly is resist coated and etched to form a circuit which is then solder coated using water white rosin flux and wave soldering apparatus.

59. 发明专利

GB1450351A SOLDER WETTABILITY OF COPPER FOIL 未知
公开(公告)号：GB1450351A
公开(公告)日：1976-09-22
申请号：GB5586373
申请日：1973-12-03
申请人： YATES INDUSTRIES
IPC分类号： C25D11/38 , B23K1/20 , B23K35/22 , B23K35/36 , H05K3/28 , H05K3/38
摘要： 1450351 Soldering YATES INDUSTRIES Inc 3 Dec 1973 [1 Dec 1972] 55863/73 Heading B3R In processing a copper foil having a stainproofing coating containing hexavalent chromium ions, to improve the solder wettability of the coating, a compound such that at the soldering temperature it will react with the coating to expose the copper to the solder is applied to the coating. The foil may be for printed circuits and may be stain-proofed by electrolytic treatment in an aqueous electrolyte containing chromic acid and caustic and suitable compounds which are inert to the coating at 200-350‹ F. but react at 450-560‹ F. include hydrazine hydrochloride and ammonium chloride. The compound may be applied as a water solution by rolling, brushing or spraying if one side is to be treated or by dipping if both sides are to be treated. In an example a copper foil electrochemically treated to deposit on one side microcrystalline, modular, powdery copper is immersed in an aqueous chromic acid/sodium hydroxide electrolyte and then passed through a water spray. The foil then passes through a station where ammonium chloride solution is sprayed on the side opposite the one side. After drying solder wets the ammonium chloride treated side without a flux. The processed foil is, in another example, laminated on its side bearing the powdery copper to a substrate of epoxy glass fibre and the assembly is resist coated and etched to form a circuit which is then solder coated using water white rosin flux and wave soldering apparatus.

60. 发明专利

DE2445160A1 Electrolytically stain proofing copper with chromium(VI) - in strongly alkaline bath to precipitate copper and chromous ions 未知
公开(公告)号：DE2445160A1
公开(公告)日：1976-04-01
申请号：DE2445160
申请日：1974-09-19
申请人： YATES INDUSTRIES
发明人： YATES CHARLES B , WOLSKI ADAM M
IPC分类号： C25D11/38 , C25D9/08
摘要： Cu sheet is made cathodic in an aq. soln. contg. Cr6+-contg. anions and sufficiently alkaline to ppte. Cu and chrome ions. Pref. the bath is at pH 12-14, the cathode current density is 10-50A/ft2, bath temp. is 120-170 degrees C with chromate concn. 2-20g/l (calc. as CrO3), and treatment time is 4-8 secs. Partic. for treatment of foil for printed circuits.

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