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51. 发明授权

US08191612B2 Cooler module without base panel 有权
标题翻译：没有底板的冷却器模块
公开(公告)号：US08191612B2
公开(公告)日：2012-06-05
申请号：US12047324
申请日：2008-03-13
申请人： Tsung-Hsien Huang
发明人： Tsung-Hsien Huang
IPC分类号： F28D15/00 , H05K7/20
CPC分类号： H01L23/427 , F28D15/0275 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A light, compact, non-bottom panel type cooler module includes a plurality of radiation fins arranged in a stack, and a plurality of U-shaped heat pipes fastened to the radiation fins to hold the radiation fins in parallel, each U-shaped heat pipe having one or two opposite end pipe sections thereof press-fitted into respective through holes on the radiation fins and a flat bottom surface portion exposed to the outside of the radiation fins for bonding to a semiconductor device for enabling the heat pipes to transport heat from the semiconductor device to the radiation fins for dissipation.
摘要翻译：一种轻巧紧凑的非底板式冷却器模块，包括多个布置成堆叠的辐射翅片，以及多个U形热管，其紧固到辐射翅片以平行地保持辐射翅片，每个U形热管子具有一个或两个相对的端部管段压配合到辐射翅片上的相应的通孔中，以及一个平坦的底面部分，暴露在辐射翅片的外侧，用于粘合到半导体器件上，以使热管能够从半导体器件到散热片散热。

52. 发明申请

US20110290467A1 HEAT SINK MODULE 有权
标题翻译：散热模块
公开(公告)号：US20110290467A1
公开(公告)日：2011-12-01
申请号：US12789454
申请日：2010-05-27
申请人： Tsung-Hsien Huang
发明人： Tsung-Hsien Huang
IPC分类号： F28F1/30
CPC分类号： F28D15/0275 , F28D2021/0028 , F28F1/32 , F28F3/06 , F28F2240/00 , F28F2275/122
摘要： A heat sink includes a base member having stepped channels spaced on the surface thereof in a parallel manner and first and second ribs protruding from the surface and respectively extending along two opposite lateral sides of each of the stepped channels, and radiation fins respectively mounted in the channels of the metal base member and supported on the second ribs vertically, each radiation fin having a Z-shaped foot portion that is inserted into one respective stepped channel of the base member and secured thereto by the associated first and second rib that are stamped to clamp on the Z-shaped foot portion of the associated radiation fin after its insertion into the respective stepped channel.
摘要翻译：散热器包括具有平行方式在其表面上间隔开的台阶通道的基座构件，以及从表面突出并且分别沿着每个台阶式通道的两个相对的横向侧面延伸的第一和第二肋，以及分别安装在金属基底构件的通道并垂直地支撑在第二肋上，每个辐射翅片具有Z形的脚部分，该Z形脚部分插入到基座构件的一个相应的台阶式通道中，并通过相关联的第一和第二肋条被固定到其上，在相关辐射翅片插入相应的台阶式通道之后夹紧在相关散热片的Z形脚部上。

53. 发明申请

US20110116267A1 HEAT DISSIPATION STRUCTURE OF AN ELECTRONIC ELEMENT 审中-公开
标题翻译：电子元件的散热结构
公开(公告)号：US20110116267A1
公开(公告)日：2011-05-19
申请号：US12619244
申请日：2009-11-16
申请人： Tsung-Hsien HUANG
发明人： Tsung-Hsien HUANG
IPC分类号： F21S4/00 , H05K7/20
CPC分类号： F21V29/773 , F21V29/70 , F21V29/89 , F21Y2115/10
摘要： A heat dissipation structure of an electronic element includes a cooling fin, an aluminum heat dissipation seat which is provided on the cooling fin and at least one electronic element which is provided on the aluminum heat dissipation seat. At least one heat conducting copper column is provided on the aluminum heat dissipation seat by being tightly forced in or by a stamping method with a mold, and is located corresponding to the electronic element. Therefore, the present invention can conduct heat from the electronic elements, can reduce a manufacturing cost, can accelerate production, can decrease a manufacturing process, is environment friendly and is provided with a high heat dissipation efficiency.
摘要翻译：电子元件的散热结构包括冷却翅片，设置在散热片上的铝散热座和设置在铝散热座上的至少一个电子元件。在铝散热座上，至少有一个导热铜柱通过用模具紧固在冲压方法中或通过冲压方法设置在铝散热座上，并且对应于电子元件。因此，本发明可以从电子元件传导热量，可以降低制造成本，可以加速生产，可以减少制造工艺，环保，并且具有高的散热效率。

54. 发明申请

US20100270014A1 HEAT SINK WITH RADIALLY ARRANGED RADIATION FINS 审中-公开
标题翻译：散热放射性放射线
公开(公告)号：US20100270014A1
公开(公告)日：2010-10-28
申请号：US12480621
申请日：2009-06-08
申请人： Tsung-Hsien Huang
发明人： Tsung-Hsien Huang
IPC分类号： F28F1/14
CPC分类号： F28F1/20 , F21V29/773 , G06F1/20
摘要： A heat sink includes a tubular base having longitudinal channels arranged in parallel around the periphery and a first and a second ribs protruding from the periphery and respectively extending along two opposite sides of each of the channels, and radiation fins radially arranged around the tubular base and supported on the second ribs, each radiation fin having an angled foot portion respectively inserted into the channels and secured thereto by the first ribs that are stamped down after the angled foot portions of the radiation fins are inserted into the channels of the tubular base.
摘要翻译：散热器包括具有围绕周边平行布置的纵向通道的管状基座和从周边突出并分别沿着每个通道的两个相对侧延伸的第一和第二肋和围绕管状基部径向布置的辐射翅片，支撑在第二肋上，每个辐射翅片具有分别插入通道中的成角度的脚部，并且通过在辐射翅片的成角度的脚部插入到管状基座的通道中之后被冲压的第一肋固定到其上。

55. 发明申请

US20100126697A1 HEAT SINK MODULE 有权
标题翻译：散热模块
公开(公告)号：US20100126697A1
公开(公告)日：2010-05-27
申请号：US12324872
申请日：2008-11-27
申请人： Tsung-Hsien Huang
发明人： Tsung-Hsien Huang
IPC分类号： F28F7/00
CPC分类号： F21V29/83 , F21K9/233 , F21V19/0055 , F21V29/71 , F21V29/773 , F21V29/89 , F21Y2103/33 , F21Y2115/10 , F28F1/20 , F28F3/06 , F28F2275/12
摘要： A heat sink module includes a heat transfer tube, a plurality of radiation fins respectively riveted to locating grooves around the periphery of the heat transfer tube, and a heat transfer panel fastened to the bottom side of the heat transfer tube and the radiation fin set and kept in contact with a heat source, such as a CPU or a light emitting unit of a LED lamp for transferring heat from the heat source to the radiation fins for quick dissipation.
摘要翻译：散热器模块包括传热管，分别铆接到传热管周围的定位槽的多个辐射翅片，以及紧固在传热管和辐射翅片组的底侧的传热面板，与诸如CPU或LED灯的发光单元的热源保持接触，用于将热量从热源传递到散热片以用于快速散热。

56. 发明申请

US20090194255A1 COOLER DEVICE 审中-公开
标题翻译：冷却器装置
公开(公告)号：US20090194255A1
公开(公告)日：2009-08-06
申请号：US12049642
申请日：2008-03-17
申请人： Tsung-Hsien Huang
发明人： Tsung-Hsien Huang
IPC分类号： F28F7/00
CPC分类号： G06F1/20 , F28D15/0275 , G06F2200/201 , H01L21/4882 , H01L23/3672 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A cooler device includes a base panel, which has multiple mounting grooves on the top wall and multiple locating grooves on the bottom wall, a radiation fin module formed by stacking up multiple radiation fins, each radiation fin having multiple mounting through holes and a root portion that is respectively riveted to the mounting grooves of the base panel, and multiple U-shaped heat pipes, each heat pipe having a first extension arm respectively and tightly fitted into the mounting through holes of the radiation fins and a second extension arm respectively and tightly fitted into the locating groove of the base panel and kept in flush with the bottom wall of the base panel for direct contact with a CPU or the like to transfer heat energy from the CPU or the like to the radiation fins for quick dissipation.
摘要翻译：一种冷却器装置，包括：基板，其在顶壁上具有多个安装槽，在底壁上具有多个定位槽;辐射翅片模块，其通过堆叠多个散热片而形成，每个散热片具有多个安装通孔，根部分分别铆接到基板的安装槽和多个U形热管，每个热管分别具有第一延伸臂并分别紧密地装配到散热片的安装通孔中，并且紧紧地配合到第二延伸臂安装到基板的定位槽中，与基板的底壁保持平齐，以便与CPU等直接接触，以将来自CPU等的热能传递到散热片以进行快速散热。

57. 发明申请

US20090084529A1 COOLER MODULE 有权
标题翻译：冷却器模块
公开(公告)号：US20090084529A1
公开(公告)日：2009-04-02
申请号：US11865041
申请日：2007-09-30
申请人： Tsung-Hsien Huang
发明人： Tsung-Hsien Huang
IPC分类号： F28D15/00
CPC分类号： F28F1/32 , F28D15/0275 , F28F2275/10
摘要： A horizontal cooler module includes a heat sink formed of a stack of radiation fins, a base block tightly fitted into the bottom side of the heat sink, and heat pipes each having a first extension arm respectively tightly inserted through the radiation fins and a second extension arm respectively fitted into the bottom open grooves of the base block with a respective flat wall portion of the second extension arm exposed to the outside of the base block and kept in flush with the bottom wall of the base block for direct contact with an external electronic chip to transfer heat energy from the electronic chip to the heat sink for quick dissipation.
摘要翻译：水平冷却器模块包括由散热片堆叠形成的散热片，紧密配合在散热片底面的底座块，以及各自具有分别紧密地插入穿过散热片的第一延伸臂的热管和第二延伸部臂分别装配到基座的底部开口槽中，其中第二延伸臂的相应的平坦壁部暴露于基座的外部并保持与基座的底壁齐平，以直接接触外部电子芯片将热能从电子芯片传递到散热片，以实现快速消散。

58. 发明申请

US20090038776A1 COOLER MODULE 审中-公开
标题翻译：冷却器模块
公开(公告)号：US20090038776A1
公开(公告)日：2009-02-12
申请号：US11837355
申请日：2007-08-10
申请人： Tsung-Hsien Huang
发明人： Tsung-Hsien Huang
IPC分类号： F28D15/00 , F28D7/00
CPC分类号： F28D15/0275 , F28F1/32 , F28F2275/10
摘要： A cooler module includes a heat sink formed of a stack of radiation fins each having a plurality of double-step mounting holes for allowing quick mounting of the radiation fins by fitting the annular outer step portions of the double-step mounting holes of one radiation fin tightly into the annular inner step portions of the double-step mounting holes of another radiation fin, a base block tightly fastened to the bottom side of the heat sink, a plurality of heat pipes tightly fitted into the double-step mounting holes of the radiation fins to reinforce engagement between the respective annular outer step portions with the corresponding annular inner step portions and tightly fitted into the bottom wall of the base block to secure the heat sink and the base block firmly together.
摘要翻译：冷却器模块包括散热片，该散热片由一叠散热片构成，每个散热片具有多个双步安装孔，用于通过安装一个辐射翅片的两步安装孔的环形外台阶部分来快速安装辐射翅片紧紧地插入到另一辐射翅片的两步安装孔的环形内台阶部分中，紧固在散热片底侧的基块，紧密地配合到辐射的两步安装孔中的多个热管翅片以加强各个环形外台阶部分与对应的环形内台阶部分之间的接合，并紧密地装配到基座块的底壁中，以将散热器和基座块牢固地固定在一起。

59. 发明申请

US20090032221A1 COOLER DEVICE 审中-公开
标题翻译：冷却器装置
公开(公告)号：US20090032221A1
公开(公告)日：2009-02-05
申请号：US12243850
申请日：2008-10-01
申请人： Tsung-Hsien Huang
发明人： Tsung-Hsien Huang
IPC分类号： F28F7/00
CPC分类号： F28F1/30 , F28D15/0275 , F28F2275/12 , F28F2275/122 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , Y10T29/49353 , H01L2924/00
摘要： A cooler device includes a metal base member and a plurality of metal radiation fins. The metal base member has parallel locating grooves; the metal radiation fins are fastened to one another in a stack by respective hooked portions thereof, the metal radiation fins each having backwardly curved and crimped bottom mounting portions respectively fitted into the locating grooves of the metal base and fixedly secured thereto by means of compacting the locating grooves of the metal base member without electroplating or using solder paste or bonding means.
摘要翻译：一种冷却器装置包括金属基底构件和多个金属辐射翅片。金属基部件具有平行的定位槽; 金属散热片通过其各自的钩部彼此以堆叠的方式彼此固定，金属散热片各自具有向后弯曲和卷曲的底部安装部分，其分别装配到金属基座的定位槽中，并通过压实在不进行电镀的情况下定位金属基材的槽，或者使用焊膏或接合装置。

60. 发明申请

US20080060793A1 COOLER DEVICE 审中-公开
标题翻译：冷却器装置
公开(公告)号：US20080060793A1
公开(公告)日：2008-03-13
申请号：US11530149
申请日：2006-09-08
申请人： Tsung-Hsien Huang
发明人： Tsung-Hsien Huang
IPC分类号： H05K7/20 , F28D15/02
CPC分类号： F28F1/30 , F28D15/0275 , F28F2275/12 , F28F2275/122 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , Y10T29/49353 , H01L2924/00
摘要： A cooler device includes a metal base member and a plurality of metal radiation fins. The metal base member has parallel locating grooves; the metal radiation fins are fastened to one another in a stack by respective hooked portions thereof or by means of closed-end heat tubes, the metal radiation fins each having backwardly curved and crimped bottom mounting portions respectively fitted into the locating grooves of the metal base and fixedly secured thereto by means of compacting the locating grooves of the metal base member without electroplating or using solder paste or bonding means.
摘要翻译：一种冷却器装置包括金属基底构件和多个金属辐射翅片。金属基部件具有平行的定位槽; 金属散热片通过其相应的钩部或者通过封闭式热管彼此堆叠地彼此固定，每个金属散热片具有分别装配在金属基座的定位槽中的向后弯曲和压接的底部安装部分并且通过在不电镀或使用焊膏或接合装置的情况下压实金属基底构件的定位槽而固定固定。

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