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51. 发明申请

US20180302989A1 APPARATUS FOR CARRYING OUT A MANUFACTURING METHOD ON AN ELECTRO CHEMICAL STRUCTURE 审中-公开
公开(公告)号：US20180302989A1
公开(公告)日：2018-10-18
申请号：US16018127
申请日：2018-06-26
申请人： TactoTek Oy
发明人： Mikko Heikkinen , Jarmo Sääski , Jarkko Torvinen , Paavo Niskala , Mikko Sippari , Pasi Raappana , Antti Keränen
IPC分类号： H05K3/00 , H05K1/03 , H05K1/02
CPC分类号： H05K3/0014 , B29C45/1418 , B29C45/14639 , B29C45/14811 , B29C45/14819 , B29C2045/14237 , B29L2031/3425 , B29L2031/3481 , H05K1/0284 , H05K1/0393 , H05K2201/0129 , H05K2201/09118 , H05K2203/1105
摘要： An apparatus for carrying out a manufacturing method of an electromechanical structure apparatus includes an entity for producing conductors on a flat film, an entity for attaching electronic elements at locations on the flat film in relation to the desired three-dimensional shape of the flat film, the electronic elements including a number of SMT components, the locations of the electronic elements on the flat film selected such that the locations omit substantial deformation during subsequent 3D forming of the flat film, an entity for forming the flat film into a three-dimensional film and an entity for injection molding.

52. 发明申请

US20180220534A1 THERMOFORMED PLASTIC COVER FOR ELECTRONICS AND RELATED METHOD OF MANUFACTURE 审中-公开
公开(公告)号：US20180220534A1
公开(公告)日：2018-08-02
申请号：US15937172
申请日：2018-03-27
申请人： TactoTek Oy
发明人： Mikko HEIKKINEN , Jarmo SÄÄSKI , Jarkko Torvinen
IPC分类号： H05K1/18 , H01L33/52 , H01L23/498 , H05K1/02 , H01L51/00 , H01L23/538
CPC分类号： H05K1/186 , H01L23/4985 , H01L23/5387 , H01L33/52 , H01L51/0097 , H01L2224/1319 , H01L2933/005 , H05K1/0274 , H05K1/0298 , H05K1/189 , H05K3/284 , H05K2201/0129 , H05K2201/05 , H05K2201/09872 , H05K2201/10106 , H05K2201/10151 , H05K2203/1316 , H05K2203/1322
摘要： A multilayer structure for an electronic device including a flexible substrate film for accommodating electronics; at least one electronic component provided on the substrate film; and a number of conductive traces provided on the substrate film for electrically powering and/or connecting electronics including the at least one electronic component, wherein at least one preferably thermoformed cover is attached to the substrate film on top of the at least one electronic component, the at least one thermoformed cover and the substrate film accommodating the electronics being overmolded with thermoplastic material. The invention also relates to a method for manufacturing a multilayer structure for an electronic device.

53. 发明授权

US09869810B2 Method for manufacturing electronic products, related arrangement and product 有权
公开(公告)号：US09869810B2
公开(公告)日：2018-01-16
申请号：US14264273
申请日：2014-04-29
申请人： TactoTek Oy
发明人： Antti Keranen , Jarmo Saaski , Tuomas Heikkila , Paavo Niskala , Kari Severinkangas , Sami Torvinen
IPC分类号： F21V1/00 , F21V8/00
CPC分类号： G02B6/0065 , G02B6/0036 , G02B6/0051 , G02B6/006 , G02B6/0091
摘要： A method for manufacturing an electronic product, includes: obtaining a flexible, optically substantially transparent or translucent, substrate sheet; printing a number of electrical conductors on the substrate sheet in accordance with a predefined schematic; printing or disposing a number of electronic components including optoelectronic light emissive, preferably LED (light-emitting diode), components on the substrate sheet in accordance with the schematic, wherein at least some of the printed conductors are configured to provide electrical current thereto; and attaching a flexible, optically substantially transparent, lightguide sheet to the substrate so as to establish a functional multi-layer structure, where the light emitted by the light emissive components is incoupled to the lightguide, propagates therewithin, and is at least partly outcoupled to the environment through the substrate sheet. Related arrangement and electronic device are presented.

54. 发明申请

US20170371092A1 METHOD FOR MANUFACTURING ELECTRONIC PRODUCTS, RELATED ARRANGEMENT AND PRODUCT 审中-公开
公开(公告)号：US20170371092A1
公开(公告)日：2017-12-28
申请号：US15672684
申请日：2017-08-09
申请人： TactoTek Oy
发明人： Antti KERANEN , Jarmo SAASKI , Tuomas HEIKKILA , Paavo NISKALA , Kari SEVERINKANGAS , Sami TORVINEN
IPC分类号： F21V8/00
CPC分类号： G02B6/0065 , G02B6/0036 , G02B6/0051 , G02B6/006 , G02B6/0091
摘要： A method for manufacturing an electronic product, including obtaining a flexible, optically substantially transparent or translucent, substrate sheet, printing, by an additive printed electronics process, a plurality of electrical conductors on the substrate sheet, printing or disposing, a plurality of electronic components including optoelectronic light emissive components on the substrate sheet, at least some of the printed conductors being configured to provide electrical current thereto, providing at least one graphic on the substrate sheet, the at least one graphic configured to enable outcoupling of light, and attaching a flexible, optically substantially transparent, lightguide sheet to the substrate sheet to establish a multi-layer structure, the light emitted by the light emissive components being received by the lightguide sheet, propagating therewithin, and then being at least partly emitted to the environment through the at least one graphic.

55. 发明授权

US09297675B2 Illuminated indicator structures for electronic devices 有权
标题翻译：电子设备的照明指示器结构
公开(公告)号：US09297675B2
公开(公告)日：2016-03-29
申请号：US14046425
申请日：2013-10-04
申请人： TactoTek Oy
发明人： Antti Keränen , Mikko Heikkinen
IPC分类号： G01D11/28
CPC分类号： G01D11/28 , F21K9/60 , F21V23/04 , H01H13/83 , H01H2219/028 , H01H2219/039 , H01H2219/056 , H01H2219/06
摘要： A composite laminate assembly for an electronic device provides integrated backlighting for one or more indicator shapes defined by the assembly. The assembly includes a substantially opaque cover member to obscure at least parts of the electronic device. Translucent indicator structures in the cover member define respective indicator shapes to allow backlighting to pass through the cover member. An optical matrix layer of an optically conductive material is attached to an inner face of the cover member, with a plurality of lighting devices embedded in the optical matrix layer and laterally offset from associated indicator structures. The plurality of lighting devices may be connected to an electric circuit carried on the inner face of the cover member.
摘要翻译：用于电子设备的复合层压组件为由组件限定的一个或多个指示器形状提供集成背光。组件包括基本上不透明的盖构件，以遮蔽电子设备的至少一部分。盖构件中的半透明指示器结构限定相应的指示器形状，以允许背光通过盖构件。光学导电材料的光学基质层被附着到盖构件的内表面，其中多个照明装置嵌入在光学矩阵层中并且横向偏离相关联的指示器结构。多个照明装置可以连接到承载在盖构件的内表面上的电路。

56. 发明申请

WO2020115370A1 MULTILAYER STRUCTURE WITH EMBEDDED LIGHT SOURCE AND LIGHT-GUIDING FEATURES AND RELATED METHOD OF MANUFACTURE 审中-公开
公开(公告)号：WO2020115370A1
公开(公告)日：2020-06-11
申请号：PCT/FI2019/050872
申请日：2019-12-05
申请人： TACTOTEK OY
发明人： KERÄNEN, Antti , HEIKKINEN, Mikko
IPC分类号： G02B6/00
摘要： Integrated multilayer structure (100, 200, 300, 400, 600, 700), comprising a substrate film (102) having a first side and an opposing second side; electronics comprising at least one light source (110), optionally a LED, provided upon the first side of the substrate film and a number of electrical conductors (112), preferably printed by printed electronics technology, at least electrically coupled to the at least one light source (110), the at least one light source (110) being configured to emit light in selected one or more frequencies or wavelengths, optionally including visible light; an optically transmissive element (104) comprising thermoplastic optically transmissive, having regard to the selected frequencies or wavelengths, material having a first refractive index and produced, preferably through utilization of molding from said optically transmissive thermoplastic material, onto the first side of the substrate film (102) so as to at least partially embed the at least one light source (110) therewithin; and optical cladding (106, 106a, 106b) comprising material having a lower refractive index than the first refractive index and provided adjacent the optically transmissive element upon the first side of the substrate film (102), wherein the at least one light source, the optically transmissive element and the optical cladding have been mutually configured (702, 704) so as to convey light emitted by the light source (110) within the optically transmissive material of the optically transmissive element, at least portion of the conveyed light undergoing a substantially total internal reflection when incident upon the optical cladding. Related method of manufacture is presented

57. 发明申请

WO2020043941A1 ELECTRICAL NODE, METHOD FOR MANUFACTURING AN ELECTRICAL NODE, ELECTRICAL NODE STRIP OR SHEET, AND MULTILAYER STRUCTURE COMPRISING THE NODE 审中-公开
公开(公告)号：WO2020043941A1
公开(公告)日：2020-03-05
申请号：PCT/FI2019/050603
申请日：2019-08-27
申请人： TACTOTEK OY
发明人： SIMULA, Tomi , BRÄYSY, Vinski , HEIKKINEN, Mikko , HINTIKKA, Juha-Matti , HARVELA, Juhani , PIRKONEN, Minna , RAAPPANA, Pasi , HEIKKILÄ, Tuomas , SÄÄSKI, Jarmo
IPC分类号： H05K1/02 , H05K1/18 , H05K1/11 , H05K1/09 , H05K3/00 , H05K3/12
摘要： An electrical node (100), a method, an electrical assembly such as a node strip or sheet, a related multilayer structure and a method of manufacture are presented. The electrical node comprises a first substrate film (10) defining a cavity, and a first material layer (30) arranged to at l east partly fill the cavity, and to embed or at l east partly cover at l east one electrical element (12) arranged into the cavity.

58. 发明申请

WO2019122524A1 ARRANGEMENT AND METHOD FOR DELIVERING A CURRENT-CONTROLLED VOLTAGE 审中-公开
公开(公告)号：WO2019122524A1
公开(公告)日：2019-06-27
申请号：PCT/FI2018/050942
申请日：2018-12-18
申请人： TACTOTEK OY
发明人： KÄRNÄ, Miikka , HEIKKILÄ, Tuomas
IPC分类号： H05B33/08
摘要： An arrangement (100, 200, 300) involving printed conductive traces, the arrangement comprising at least a voltage source (V supply ) and at least one target component (106), preferably a light-emitting component such as an LED. The arrangement is adapted to produce a current-controlled voltage (V out , V out ) originating from the voltage source, the current- controlled voltage being coupled to the at least one target component, wherein said voltage is dependent on the current (I R.LED , I LED ) that is being passed through the target component.

59. 发明申请

WO2017055685A4 METHOD AND ARRANGEMENT FOR PROVIDING ELECTRICAL CONNECTION TO IN-MOLD ELECTRONICS 审中-公开
标题翻译：用于为模内电子提供电连接的方法和装置
公开(公告)号：WO2017055685A4
公开(公告)日：2017-06-15
申请号：PCT/FI2016050673
申请日：2016-09-28
申请人： TACTOTEK OY
发明人： KERÄNEN ANTTI , HEIKKINEN MIKKO , RAAPPANA PASI , SÄÄSKI JARMO
IPC分类号： H05K5/00 , B32B27/08 , H01L23/538 , H01R12/61 , H01R12/77 , H05K1/03 , H05K1/14 , H05K3/28 , H05K5/06
CPC分类号： H05K1/189 , H05K1/0269 , H05K1/028 , H05K1/111 , H05K1/118 , H05K1/16 , H05K3/0044 , H05K3/12 , H05K3/28 , H05K3/4092 , H05K3/46 , H05K2201/0129 , H05K2201/0397 , H05K2201/09081 , H05K2201/09754 , H05K2203/0228 , H05K2203/1316
摘要： A multilayer structure (100) comprises a flexible substrate film (102) having a first side and opposite second side, a number of conductive traces (108), optionally defining contact pads and/or conductors, printed on the first side of the substrate film by printed electronics technology for establishing a desired predetermined circuit design, a plastic layer (104) molded onto the first side of the substrate film (102) so as to enclose the circuit between the plastic layer and the first side of the substrate film (102), and a connector (114) in a form of a flexible flap for providing external electrical connection to the embedded circuit from the second, opposite side of the substrate film (102), the connector being defined by a portion of the substrate film (102) accommodating at least part of one or more of the printed conductive traces (108) and cut partially loose from the surrounding substrate material so as to establish the flap, the loose end of which is bendable away from the molded plastic layer to facilitate the establishment of said electrical connection with external element (118), such as a wire or connector, via the associated gap. A related method of manufacture is presented.
摘要翻译：多层结构（100）包括柔性衬底膜（102），柔性衬底膜（102）具有第一侧和相对的第二侧，多个导电迹线（108），可选地限定接触焊盘和/或导体，印刷在衬底膜通过用于建立期望的预定电路设计的印刷电子技术，在基底膜（102）的第一侧上模制塑料层（104），以便在塑料层和基底膜（102）的第一侧之间封装电路）以及柔性翼片形式的连接器（114），用于从衬底薄膜（102）的相对的第二侧提供到嵌入电路的外部电连接，连接器由衬底薄膜（102）的一部分 102），其容纳印刷导电迹线（108）中的一个或多个的至少一部分并且从周围的基板材料部分地松开以便建立该翼片，该翼片的松散端可弯曲远离该mo 以便于通过相关间隙建立与外部元件（118）（例如导线或连接器）的所述电连接。介绍了一种相关的制造方法。

60. 发明申请

WO2015049425A1 ILLUMINATED INDICATOR STRUCTURES FOR ELECTRONIC DEVICES 审中-公开
标题翻译：电子设备的照明指示器结构
公开(公告)号：WO2015049425A1
公开(公告)日：2015-04-09
申请号：PCT/FI2014/050755
申请日：2014-10-03
申请人： TACTOTEK OY
发明人： KERÄNEN, Antti , HEIKKINEN, Mikko
IPC分类号： H05K5/00 , F21V8/00 , B29C45/14 , F21V31/00 , H05K3/10
CPC分类号： G01D11/28 , F21K9/60 , F21V23/04 , H01H13/83 , H01H2219/028 , H01H2219/039 , H01H2219/056 , H01H2219/06
摘要： A composite laminate assembly for an electronic device provides integrated backlighting for one or more indicator shapes defined by the assembly. The assembly includes a substantially opaque cover member to obscure at least parts of the electronic device. Translucent indicator structures in the cover member define respective indicator shapes to allow backlighting to pass through the cover member. An optical matrix layer of an optically conductive material is attached to an inner face of the cover member, with a plurality of lighting devices embedded in the optical matrix layer and laterally offset from associated indicator structures. The plurality of lighting devices may be connected to an electric circuit carried on the inner face of the cover member.
摘要翻译：用于电子设备的复合层压组件为由组件限定的一个或多个指示器形状提供集成背光。组件包括基本上不透明的盖构件，以遮蔽电子设备的至少一部分。盖构件中的半透明指示器结构限定相应的指示器形状，以允许背光通过盖构件。光学导电材料的光学基质层被附着到盖构件的内表面，其中多个照明装置嵌入在光学矩阵层中并且横向偏离相关联的指示器结构。多个照明装置可以连接到承载在盖构件的内表面上的电路。

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