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51. 发明授权

US08737864B2 Grounding configuration for an image forming apparatus 有权
标题翻译：图像形成装置的接地结构
公开(公告)号：US08737864B2
公开(公告)日：2014-05-27
申请号：US13422171
申请日：2012-03-16
申请人： Shogo Mori , Takuya Yamaguchi
发明人： Shogo Mori , Takuya Yamaguchi
IPC分类号： G03G15/00
CPC分类号： G03G21/1652 , G03G21/1633 , G03G2215/0141
摘要： An image forming apparatus includes: a main body having an opening; a plurality of photosensitive members disposed in the main body; a cover configured to open and close the opening; and a plurality of exposure members that is provided at the cover and is configured to expose the plurality of photosensitive members, respectively. The cover includes a cover-side metal plate provided along a surface of the cover. Entire parts of the plurality of exposure members overlap with the cover-side metal plate, when seen in a direction normal to the cover-side metal plate. At least four positions of the cover-side metal plate, which surround the plurality of exposure members, are electrically grounded at a state in which the cover is closed.
摘要翻译：一种成像设备包括：具有开口的主体; 设置在主体中的多个感光构件; 盖构造成打开和关闭开口; 以及多个曝光构件，其设置在所述盖上并且被配置为分别暴露所述多个感光构件。所述盖包括沿所述盖的表面设置的盖侧金属板。当从垂直于盖侧金属板的方向看时，多个曝光构件的整个部分与盖侧金属板重叠。围绕多个曝光构件的盖侧金属板的至少四个位置在盖关闭的状态下被电接地。

52. 发明授权

US08711457B2 Optical scanner and image-forming device 有权
标题翻译：光学扫描仪和图像形成装置
公开(公告)号：US08711457B2
公开(公告)日：2014-04-29
申请号：US13272823
申请日：2011-10-13
申请人： Ryota Kato , Shogo Mori
发明人： Ryota Kato , Shogo Mori
IPC分类号： G02B26/08
CPC分类号： G02B26/08 , G02B26/124
摘要： An scanning unit scanner includes a light source and a polygon mirror unit. A front-to-rear rib is disposed between the light source and the polygon mirror unit and near the polygon mirror unit. An input side opening having a slit shape is formed as a cutout in the top edge of the front-to-rear rib. When laser light from the light source passes through the input side opening, the input side opening restricts the width of the light in a main scanning direction.
摘要翻译：扫描单元扫描器包括光源和多面镜单元。前后肋设置在光源和多面镜单元之间并且在多角镜单元附近。具有狭缝形状的输入侧开口在前后肋骨的上边缘中形成为切口。当来自光源的激光通过输入侧开口时，输入侧开口限制光在主扫描方向上的宽度。

53. 发明申请

US20130259517A1 Image Forming Apparatus 有权
标题翻译：图像形成装置
公开(公告)号：US20130259517A1
公开(公告)日：2013-10-03
申请号：US13784946
申请日：2013-03-05
申请人： Shogo Mori
发明人： Shogo Mori
IPC分类号： G03G15/00
CPC分类号： G03G21/1666 , G03G21/1633 , G03G21/1647
摘要： An image forming apparatus includes: a body frame having an opening; a cover configured to open/close the opening; an exposure unit configured to expose a photosensitive member and being swingable between an exposure position and a retreated position; an urging member configured to urge the exposure unit from the exposure position towards the retreated position; and an interlocking mechanism configured to: swing the exposure unit from the retreated position to the exposure position against an urging force of the urging member in conjunction with the rotation of the cover when the cover is closed; and allow the exposure unit to swing from the exposure position to the retreated position by the urging force of the urging member in conjunction with the rotation of the cover when the cover is opened.
摘要翻译：一种图像形成装置，包括：具有开口的主体框架; 被构造成打开/关闭开口的盖子; 曝光单元，被配置为暴露感光构件并且可以在曝光位置和后退位置之间摆动; 推动构件，构造成将所述曝光单元从所述曝光位置推向所述退回位置; 以及互锁机构，其构造成：当所述盖关闭时，抵抗所述推动构件的推动力与所述盖的旋转相结合，将所述曝光单元从所述退回位置摆动到所述曝光位置; 并且当盖打开时，通过与推动盖的旋转相结合的推动构件的推动力，允许曝光单元从曝光位置摆动到退回位置。

54. 发明申请

US20130259515A1 Image Forming Apparatus 有权
标题翻译：图像形成装置
公开(公告)号：US20130259515A1
公开(公告)日：2013-10-03
申请号：US13784879
申请日：2013-03-05
申请人： Shogo Mori
发明人： Shogo Mori
IPC分类号： G03G15/00
CPC分类号： G03G21/16 , G03G21/1633
摘要： An image forming apparatus includes: a body frame having an opening, a cartridge being configured to be removably mounted to the body frame through the opening; and a cover configured to open and close the opening, wherein the cover includes a metallic reinforcement plate that is configured to face the cartridge mounted to the body frame when the cover is closed, and wherein the reinforcement plate includes a first recess part configured to receive therein a part of the cartridge mounted to the body frame when the cover is closed.
摘要翻译：一种图像形成装置，包括：具有开口的主体框架，盒被构造成通过开口可拆卸地安装到主体框架; 以及盖，其构造成打开和关闭所述开口，其中所述盖包括金属加强板，所述金属加强板构造成当所述盖关闭时面向安装到所述主体框架的所述盒，并且其中所述加强板包括构造成接收其中当盖关闭时，一部分盒安装到主体框架上。

55. 发明申请

US20130164025A1 Image Forming Apparatus 有权
标题翻译：图像形成装置
公开(公告)号：US20130164025A1
公开(公告)日：2013-06-27
申请号：US13623519
申请日：2012-09-20
申请人： Shogo Mori , Takuya Yamaguchi
发明人： Shogo Mori , Takuya Yamaguchi
IPC分类号： G03G15/00
CPC分类号： G03G21/16 , G03G21/1633 , G03G2221/1678 , H04N1/00551 , H04N1/00554 , H04N1/00559 , H04N2201/0082
摘要： An image forming apparatus includes: a rotary member which rotates with respect to an apparatus main body between a first position and a second position; and a buffering member connected to the apparatus main body and the rotary member for buffering an impact attributable to the rotation of the rotary member. The buffering member includes: a hollow member; a movable member moveable between an evacuation position and an advance position; and a slide member provided to the movable member and contactable with an inner circumferential surface of the hollow member. The slide member is deformable such that a first pressure on the hollow member when the rotary member rotates from the first position to the second position is larger than a second pressure on the hollow member when the rotary member rotates from the second position to the first position.
摘要翻译：图像形成装置包括：旋转构件，其相对于装置主体在第一位置和第二位置之间旋转; 以及缓冲构件，其连接到装置主体和旋转构件，用于缓冲由旋转构件的旋转引起的冲击。缓冲构件包括：中空构件; 可移动构件，其可在排气位置和提前位置之间移动; 以及滑动构件，其设置在所述可动构件上并与所述中空构件的内周面接触。滑动构件是可变形的，使得当旋转构件从第一位置旋转到第二位置时，中空构件上的第一压力大于当旋转构件从第二位置旋转到第一位置时的中空构件上的第二压力。

56. 发明申请

US20120267074A1 COOLING DEVICE 有权
标题翻译：冷却装置
公开(公告)号：US20120267074A1
公开(公告)日：2012-10-25
申请号：US13444001
申请日：2012-04-11
申请人： Shinsuke NISHI , Shogo MORI
发明人： Shinsuke NISHI , Shogo MORI
IPC分类号： F28D15/00
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A cooling device includes a base, first and second heat generating parts connected to the base, first and second passages formed in the base and a partition wall disposed in the base. Liquid refrigerant flows through the first and the second passages for cooling the first and the second heat generating parts, respectively. The first and the second passages are stacked one above the other through the partition wall in the base. The partition wall includes a first region opened to allow liquid refrigerant in the first passage to flow into the second passage and a second region located on the side of the first region to allow liquid refrigerant in the first passage to flow toward the downstream end of the first passage. The first region is formed such that an opening area of the first region is greater than an opening area of the first passage.
摘要翻译：冷却装置包括基部，连接到基座的第一和第二发热部，形成在基部中的第一和第二通道以及设置在基部中的分隔壁。液体制冷剂流过第一和第二通道，以分别冷却第一和第二发热部件。第一和第二通道通过基座中的隔壁彼此层叠。分隔壁包括第一区域，其开口以允许第一通道中的液体制冷剂流入第二通道;以及位于第一区域侧的第二区域，以允许第一通道中的液体制冷剂流向第一通道的下游端第一次通过第一区域形成为使得第一区域的开口面积大于第一通道的开口面积。

57. 发明申请

US20120262883A1 HEAT RADIATOR AND MANUFACTURING METHOD THEREOF 有权
标题翻译：散热器及其制造方法
公开(公告)号：US20120262883A1
公开(公告)日：2012-10-18
申请号：US13443152
申请日：2012-04-10
申请人： Yoshitaka Iwata , Shogo Mori , Tomoya Hirano , Kazuhiko Minami
发明人： Yoshitaka Iwata , Shogo Mori , Tomoya Hirano , Kazuhiko Minami
IPC分类号： H01L23/34 , B23K31/02
CPC分类号： H01L23/473 , H01L24/32 , H01L2224/291 , H01L2224/32225 , H01L2224/32245 , H01L2924/00013 , H01L2924/01068 , H01L2924/1305 , H01L2924/13055 , H05K7/20254 , H01L2924/014 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/3512 , H01L2924/00
摘要： A back metal layer (16, 31) has a plurality of stress relaxation spaces (17). Each stress relaxation space (17) is formed to open at least at one of the front surface and the back surface of the back metal layer (16, 31). A region in the back metal layer (16, 31) that is directly below a semiconductor device (12) is defined as a directly-below region (A1), and a region outside the directly-below region (A1) that corresponds to and has the same dimensions as the directly-below region (A1) is defined as a comparison region (A21). The volume of the stress relaxation spaces (17) in the range of the directly-below region (A1) is less than the volume of the stress relaxation spaces (17) formed in the range of the comparison region (A21).
摘要翻译：后金属层（16,31）具有多个应力松弛空间（17）。每个应力松弛空间（17）形成为至少在后金属层（16,31）的前表面和后表面中的一个处打开。将直接位于半导体器件（12）的正下方的背面金属层（16,31）的区域定义为直接下方的区域（A1），以及直接向下方的区域（A1）外的区域具有与直接下方区域（A1）相同的尺寸作为比较区域（A21）。在直接低于区域（A1）的范围内的应力松弛空间（17）的体积小于在比较区域（A21）的范围内形成的应力松弛空间（17）的体积。

58. 发明申请

US20120182695A1 SEMICONDUCTOR DEVICE 审中-公开
标题翻译：半导体器件
公开(公告)号：US20120182695A1
公开(公告)日：2012-07-19
申请号：US13428584
申请日：2012-03-23
申请人： Shogo MORI , Shinobu TAMURA , Shinobu YAMAUCHI , Taizo KURIBAYASHI
发明人： Shogo MORI , Shinobu TAMURA , Shinobu YAMAUCHI , Taizo KURIBAYASHI
IPC分类号： H05K7/20
CPC分类号： H01L23/367 , H01L23/3735 , H01L23/473 , H01L2924/0002 , H05K7/20263 , H05K7/2039 , H05K7/20518 , H01L2924/00
摘要： A semiconductor device is disclosed that includes an insulation substrate, a metal wiring layer, a semiconductor element, a heat sink, and a stress relaxation member located between the insulation substrate and the heat sink. The heat sink has a plurality of partitioning walls that extend in one direction and are arranged at intervals. The stress relaxation member includes a stress absorbing portion formed by through holes extending through the entire thickness of the stress relaxation member. Each hole is formed such that its dimension along the longitudinal direction of the partitioning walls is greater than its dimension along the arranging direction of the partitioning walls.
摘要翻译：公开了一种半导体器件，其包括绝缘基板，金属布线层，半导体元件，散热器和位于绝缘基板和散热片之间的应力松弛元件。散热器具有沿一个方向延伸并且间隔地布置的多个分隔壁。应力缓和构件包括通过延伸穿过应力松弛构件的整个厚度的通孔形成的应力吸收部分。每个孔形成为使得其沿着分隔壁的纵向的尺寸大于沿着分隔壁的排列方向的尺寸。

59. 发明申请

US20120182692A1 DOUBLE-SIDED SUBSTRATE, SEMICONDUCTOR DEVICE AND METHOD FOR THE SAME 有权
标题翻译：双面基板，半导体器件及其相关方法
公开(公告)号：US20120182692A1
公开(公告)日：2012-07-19
申请号：US13346978
申请日：2012-01-10
申请人： Shogo MORI , Yoshitaka IWATA
发明人： Shogo MORI , Yoshitaka IWATA
IPC分类号： H05K7/20 , B23K31/02 , B23K1/00 , B32B15/20 , B32B3/10
CPC分类号： H01L23/3735 , C04B37/021 , C04B37/026 , C04B2237/121 , C04B2237/124 , C04B2237/402 , C04B2237/582 , C04B2237/62 , C04B2237/706 , C04B2237/72 , H01L2224/32225 , H01L2224/83101 , Y10T428/12361 , Y10T428/12611
摘要： A double-sided substrate includes a ceramic substrate, a first metal layer formed on one surface of the ceramic substrate and having a plurality of subsidiary metal layers which are laminated on the surface of the ceramic substrate and whose purities differ from each other and a second metal layer formed on the other surface of the ceramic substrate, wherein the closer to the ceramic substrate any subsidiary metal layer is located, the lower purity the subsidiary metal layer has. Additionally, a semiconductor includes the above double-sided substrate, a power element and a heat sink.
摘要翻译：双面基板包括陶瓷基板，形成在陶瓷基板的一个表面上的第一金属层，并且具有层叠在陶瓷基板的表面上并且其纯度彼此不同的多个辅助金属层，第二金属层的第二金属层形成在陶瓷基板的另一个表面上，其中更靠近陶瓷基板的任何辅助金属层位于，辅助金属层具有较低的纯度。此外，半导体包括上述双面基板，功率元件和散热器。

60. 发明申请

US20100193941A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20100193941A1
公开(公告)日：2010-08-05
申请号：US12698183
申请日：2010-02-02
申请人： Shogo MORI , Eiji KONO , Keiji TOH
发明人： Shogo MORI , Eiji KONO , Keiji TOH
IPC分类号： H01L23/34
CPC分类号： H01L23/3735 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor device includes an insulating substrate having a ceramic substrate and metal coating layers on opposite surfaces of the ceramic substrate, a semiconductor chip mounted on one surface of the insulating substrate, a heat sink directly or indirectly fixed to the other surface of the insulating substrate and thermally connected to the semiconductor chip through the insulating substrate and at least one anti-warping sheet disposed on at least one surface of the heat sink. The anti-warping sheet is made of a metal sheet having a coating layer and has coefficient of thermal expansion between those of the insulating substrate and the heat sink.
摘要翻译：半导体器件包括：绝缘基板，具有陶瓷基板和在陶瓷基板的相对表面上的金属涂层，安装在绝缘基板的一个表面上的半导体芯片，直接或间接地固定到绝缘基板的另一个表面的散热片并且通过所述绝缘基板与所述半导体芯片热连接，以及设置在所述散热器的至少一个表面上的至少一个抗翘曲板。防翘曲片由具有涂层的金属片制成，并且在绝缘基板和散热片之间具有热膨胀系数。

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