专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

51. 发明申请

US20140080884A1 NOVEL CRYSTALLINE FORMS OF A DIPEPTIDYL PEPTIDASE-IV INHIBITOR 有权
标题翻译：一种DIPEPTIDYL PEPTIDASE-IV抑制剂的新型结晶形式
公开(公告)号：US20140080884A1
公开(公告)日：2014-03-20
申请号：US14118998
申请日：2012-06-25
申请人： Itzia Arroyo , Davida Krueger , Ping Chen , Aaron Moment , Tesfaye Biftu , Faye Sheen , Yanfeng Zhang
发明人： Itzia Arroyo , Davida Krueger , Ping Chen , Aaron Moment , Tesfaye Biftu , Faye Sheen , Yanfeng Zhang
IPC分类号： C07D487/04
CPC分类号： C07D487/04 , A61K31/4162 , A61K31/4439 , A61K31/4985 , A61K31/513 , C07B2200/13 , Y02P20/55
摘要： Novel crystalline forms of (2R,3S,5R)-2-(2,5-Difluorophenyl)-5-[2-(methylsulfonyl)-2,6-dihydropyrrolo[3,4-c]pyrazol-5(4H)-yl]tetrahydro-2H-pyran-3-amine are potent inhibitors of dipeptidyl peptidase-IV and are useful for the treatment of non-insulin dependent (Type 2) diabetes mellitus. The invention also relates to pharmaceutical compositions containing these novel forms, processes to prepare these forms and their pharmaceutical compositions as well as uses thereof for the treatment of Type 2 diabetes.
摘要翻译：（2R，3S，5R）-2-（2,5-二氟苯基）-5- [2-（甲基磺酰基）-2,6-二氢吡咯并[3,4-c]吡唑-5（4H） - 吡啶-3-基]四氢-2H-吡喃-3-胺是二肽基肽酶-IV的有效抑制剂，可用于治疗非胰岛素依赖型（2型）糖尿病。本发明还涉及含有这些新型形式的药物组合物，制备这些形式的方法及其药物组合物及其用于治疗2型糖尿病的用途。

52. 发明授权

US08659822B2 Multilayered infrared light reflective structure 有权
标题翻译：多层红外光反射结构
公开(公告)号：US08659822B2
公开(公告)日：2014-02-25
申请号：US12976897
申请日：2010-12-22
申请人： Hsiang-Chuan Chen , Mei-Ching Chiang , Chin-Ching Lin , Jen-You Chu , Yi-Ping Chen , Pao-Tang Chung
发明人： Hsiang-Chuan Chen , Mei-Ching Chiang , Chin-Ching Lin , Jen-You Chu , Yi-Ping Chen , Pao-Tang Chung
IPC分类号： G02B5/08 , G02B5/20 , G02B1/11
CPC分类号： G02B5/208 , C03C17/3417 , C03C17/3423 , C03C17/366 , G02B1/115 , G02B5/282
摘要： The invention provides a multilayered infrared light reflective structure. The multilayered infrared light reflective structure includes a transparent substrate. A doped oxide film is disposed on the transparent substrate. An oxide isolated layer is disposed on the doped oxide film, thereby allowing incident light to be incident from a top surface of the transparent substrate into the multilayered infrared light reflective structure.
摘要翻译：本发明提供一种多层红外光反射结构。多层红外光反射结构包括透明基板。掺杂的氧化膜设置在透明基板上。氧化物隔离层设置在掺杂的氧化物膜上，从而允许入射光从透明基板的顶表面入射到多层红外光反射结构中。

53. 发明授权

US08653008B2 Well treatment 有权
标题翻译：治疗好
公开(公告)号：US08653008B2
公开(公告)日：2014-02-18
申请号：US12664023
申请日：2008-06-11
申请人： Olav Martin Selle , Amare Mebratu , Harry Montgomerie , Ping Chen , Thomas Hagen
发明人： Olav Martin Selle , Amare Mebratu , Harry Montgomerie , Ping Chen , Thomas Hagen
IPC分类号： C09K8/52 , E21B43/26 , C09K8/38 , C09K8/70 , C09K8/94
CPC分类号： C09K8/52 , C09K8/38 , C09K8/528 , C09K8/536 , C09K8/70 , C09K8/703 , C09K8/94 , E21B37/06 , Y10S507/927
摘要： A method for delivering a scale treatment agent to a hydrocarbon producing system. The method includes the steps of contacting the system with a foam comprising the scale treatment agent, and shutting the scale treatment agent in the system for at least 0.5 hour.
摘要翻译：一种将规模处理剂递送到烃生产系统的方法。该方法包括以下步骤：使系统与包含刻度处理剂的泡沫体接触，并且将系统中的刻度处理剂封闭至少0.5小时。

54. 发明授权

US08630137B1 Dynamic trim method for non-volatile memory products 有权
标题翻译：非易失性存储器产品的动态修剪方法
公开(公告)号：US08630137B1
公开(公告)日：2014-01-14
申请号：US13028131
申请日：2011-02-15
申请人： Yi He , Larry Wang , Sean Lynch , Che-Ping Chen , Wei Zhao , Albert Bergemont
发明人： Yi He , Larry Wang , Sean Lynch , Che-Ping Chen , Wei Zhao , Albert Bergemont
IPC分类号： G11C29/00
CPC分类号： G11C29/00 , G11C29/006 , G11C29/028 , G11C29/50
摘要： A dynamic trim method includes testing a selected number of cells on a die with predetermined testing margins. Data from this testing is used to determine dynamic reference margins for improving yield. Advantageously, yield is improved by allowing functioning fast or slow units to pass wafer sort by applying the dynamic reference margins for varying processes.
摘要翻译：动态修剪方法包括以预定的测试余量测试在模具上的选定数量的单元。来自该测试的数据用于确定用于提高产量的动态参考余量。有利地，通过允许功能快速或慢速单元通过应用用于变化过程的动态参考边缘来通过晶片排序来提高产量。

55. 发明申请

US20130329371A1 ELECTRONIC DEVICE WITH CONNECTOR 有权
标题翻译：带连接器的电子设备
公开(公告)号：US20130329371A1
公开(公告)日：2013-12-12
申请号：US13543648
申请日：2012-07-06
申请人： SHENG-HUNG LEE , LI-PING CHEN , XIAN-HUANG GAO , JIN-JIA YU , CHENG-WANG ZHAO
发明人： SHENG-HUNG LEE , LI-PING CHEN , XIAN-HUANG GAO , JIN-JIA YU , CHENG-WANG ZHAO
IPC分类号： H05K5/02
CPC分类号： G06F1/183 , G06F1/20
摘要： An electronic device includes an enclosure, a bracket, a connector, and a fan. The enclosure includes a bottom plate and two side plates located on the bottom plate. The bracket is secured to the side plates and includes a bottom wall. The bottom wall is substantially parallel to the bottom plate and defines an installing opening. Two locking pieces extend from two opposite edges of the installing opening. Each of the locking pieces defines a locking hole. The connector is secured in the installing opening, the connector comprising two resilient portions. A locking protrusion protrudes from each of the resilient portions. The locking protrusions of the resilient portions engage in the locking holes of the locking pieces. The resilient portions are deformable to disengage the locking protrusions from the locking holes. The fan is received in the bracket and adapted to be electrically coupled to the connector.
摘要翻译：电子设备包括外壳，支架，连接器和风扇。外壳包括底板和位于底板上的两个侧板。支架固定在侧板上并包括底壁。底壁基本上平行于底板并且限定了安装开口。两个锁定件从安装开口的两个相对的边缘延伸。每个锁定件限定锁定孔。连接器固定在安装开口中，连接器包括两个弹性部分。锁定突起从每个弹性部突出。弹性部分的锁定突起啮合在锁定片的锁定孔中。弹性部分是可变形的，以将锁定突起与锁定孔分离。风扇被容纳在支架中并且适于电连接到连接器。

56. 发明授权

US08587954B2 Electronic device 失效
标题翻译：电子设备
公开(公告)号：US08587954B2
公开(公告)日：2013-11-19
申请号：US13186378
申请日：2011-07-19
申请人： Chung-Cheng Hsieh , Li-Ping Chen
发明人： Chung-Cheng Hsieh , Li-Ping Chen
IPC分类号： H05K5/00 , H05K7/02 , H05K7/10
CPC分类号： H05K7/142
摘要： An electronic device includes a bottom plate, a circuit board, and a securing assembly. The circuit board is located on the bottom plate. The securing assembly comprises a positioning member, a locking member, and a linking member. The positioning member is mounted to the bottom plate and located between the bottom plate and the circuit board. The locking member is locked to the positioning member, to secure the circuit board to the bottom plate. The linking member is located on the positioning member and connected to the circuit board and the bottom plate to electronically connect the circuit board to the bottom plate.
摘要翻译：电子设备包括底板，电路板和固定组件。电路板位于底板上。固定组件包括定位构件，锁定构件和连接构件。定位构件安装到底板并且位于底板和电路板之间。锁定构件被锁定到定位构件，以将电路板固定到底板。连接构件位于定位构件上并连接到电路板和底板，以将电路板电连接到底板。

57. 发明申请

US20130287264A1 DEFECT CATEGORISATION 有权
标题翻译：缺陷分类
公开(公告)号：US20130287264A1
公开(公告)日：2013-10-31
申请号：US13460172
申请日：2012-04-30
申请人： Ping Chen , Chao He , Gary Ross
发明人： Ping Chen , Chao He , Gary Ross
IPC分类号： G06K9/36
CPC分类号： G06T7/0006 , G06T2207/30108 , G07D7/2016 , G07D7/2075
摘要： A method of categorising defects in a media item. The method comprising the steps of: receiving a binarised image of the media item, where the binarised image comprises a plurality of pixels, each pixel having either a potential defect intensity or a non-defect intensity; and identifying one or more blobs comprising contiguous pixels each having a potential defect intensity. For each identified blob, the method involves comparing a size of the blob with a damage threshold; ignoring the blob if the blob size is smaller than the damage threshold; and for each identified blob having a size exceeding or equalling the damage threshold, categorising the identified blob.
摘要翻译：对媒体项目中的缺陷进行分类的方法。该方法包括以下步骤：接收媒体项目的二进制化图像，其中二进制化图像包括多个像素，每个像素具有潜在缺陷强度或非缺陷强度; 以及识别包括各自具有潜在缺陷强度的连续像素的一个或多个斑点。对于每个识别的斑点，该方法涉及将斑块的大小与损伤阈值进行比较; 如果斑点大小小于损伤阈值，则忽略斑点; 并且对于具有超过或等于损伤阈值的大小的每个识别的斑点，对所识别的斑点进行分类。

58. 发明授权

US08567736B2 Mounting apparatus for expansion card 失效
标题翻译：扩充卡安装装置
公开(公告)号：US08567736B2
公开(公告)日：2013-10-29
申请号：US13106794
申请日：2011-05-12
申请人： Li-Ping Chen
发明人： Li-Ping Chen
IPC分类号： A47F5/00
CPC分类号： G06F1/186
摘要： A mounting apparatus includes a chassis, a mounting tray accommodated in the chassis, and a securing member. The chassis includes a bottom plate and a rear plate connected to the bottom plate. The mounting tray is secured to the rear plate. The securing member is located between the bottom plate and the mounting tray. A through hole is defined in the securing member. The mounting tray is attached to a flange of a securing plate, and the through hole receives an insertion portion of the securing plate.
摘要翻译：安装装置包括底盘，容纳在底盘中的安装托盘和固定构件。底盘包括底板和连接到底板的后板。安装托盘固定在后板上。固定构件位于底板和安装托盘之间。在固定构件中限定有通孔。安装托盘附接到固定板的凸缘，并且通孔容纳固定板的插入部分。

59. 发明申请

US20130256787A1 MULTI-LANDING CONTACT ETCHING 有权
标题翻译：多层接触蚀刻
公开(公告)号：US20130256787A1
公开(公告)日：2013-10-03
申请号：US13433665
申请日：2012-03-29
申请人： FEI XIE , WEN CHENG TIEN , YA PING CHEN , LI BIN MAN , KUO JUNG CHEN , YU LIU , TIAN YI ZHANG , SISI XIE
发明人： FEI XIE , WEN CHENG TIEN , YA PING CHEN , LI BIN MAN , KUO JUNG CHEN , YU LIU , TIAN YI ZHANG , SISI XIE
IPC分类号： H01L29/78 , H01L21/283
CPC分类号： H01L29/7827 , H01L21/76816 , H01L21/76897 , H01L21/823425 , H01L21/823443 , H01L21/823456 , H01L21/823475 , H01L29/41766 , H01L29/42372 , H01L29/4238 , H01L29/456 , H01L29/4933 , H01L29/66719 , H01L29/66727 , H01L29/7811 , Y02P80/30
摘要： A method for contacting MOS devices. First openings in a photosensitive material are formed over a substrate having a top dielectric in a first die area and a second opening over a gate stack in a second die area having the top dielectric, a hard mask, and a gate electrode. The top dielectric layer is etched to form a semiconductor contact while etching at least a portion the hard mask layer thickness over a gate contact area exposed by the second opening. An inter-layer dielectric (ILD) is deposited. A photosensitive material is patterned to generate a third opening in the photosensitive material over the semiconductor contact and a fourth opening inside the gate contact area. The ILD is etched through to reopen the semiconductor contact while etching through the ILD and residual hard mask if present to provide a gate contact to the gate electrode.
摘要翻译：一种接触MOS器件的方法。感光材料中的第一开口形成在具有第一管芯区域中的顶部电介质的衬底上，并且在具有顶部电介质的第二管芯区域中的栅极堆叠上的第二开口，硬掩模和栅极电极。蚀刻顶部电介质层以形成半导体接触，同时在由第二开口暴露的栅极接触区域上蚀刻至少一部分硬掩模层厚度。沉积层间电介质（ILD）。图案化感光材料以在半导体触点上方的感光材料中产生第三开口，并在栅极接触区域内产生第四开口。蚀刻通过ILD以重新打开半导体接触，同时蚀刻通过ILD和残余硬掩模（如果存在）以提供与栅电极的栅极接触。

60. 发明授权

US08538380B2 Method of data protection for communication device 有权
标题翻译：通信设备数据保护方法
公开(公告)号：US08538380B2
公开(公告)日：2013-09-17
申请号：US12976969
申请日：2010-12-22
申请人： Jian-Ping Chen
发明人： Jian-Ping Chen
IPC分类号： H04M1/66
CPC分类号： H04W12/12 , H04M1/2745 , H04M1/67 , H04W4/20 , H04W4/60 , H04W4/90 , H04W8/26 , H04W64/00 , H04W88/02
摘要： A method of data protection is used in a communication device. The communication may read a phone number of a subscriber identity module (SIM) card, and further determines whether the phone number conforms to a preset phone number stored in the communication device. Personal data stored in the communication device will be locked if the phone number does not conform to the preset phone number. The communication device further transmits a warning and location information of the communication device to a preset called communication device.
摘要翻译：在通信设备中使用数据保护方法。通信可以读取用户身份模块（SIM）卡的电话号码，并进一步确定电话号码是否符合存储在通信设备中的预设电话号码。如果电话号码不符合预设电话号码，存储在通信设备中的个人数据将被锁定。通信设备还将通信设备的警告和位置信息发送到预设的被叫通信设备。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式