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51. 发明授权

US07751036B2 Apparatus of inspecting defect in semiconductor and method of the same 失效
标题翻译：检测半导体缺陷的装置及其方法
公开(公告)号：US07751036B2
公开(公告)日：2010-07-06
申请号：US12349373
申请日：2009-01-06
申请人： Akira Hamamatsu , Shunji Maeda , Hisae Shibuya
发明人： Akira Hamamatsu , Shunji Maeda , Hisae Shibuya
IPC分类号： G01N21/88
CPC分类号： G01N21/956
摘要： When size of a defect on an increasingly miniaturized pattern is obtained by defect inspection apparatus in the related art, a value is inconveniently given, which is different from a measured value of the same defect by SEM. Thus, a dimension value of a defect detected by defect inspection apparatus needs to be accurately calculated to be approximated to a value measured by SEM. To this end, size of the defect detected by the defect inspection apparatus is corrected depending on feature quantity or type of the defect, thereby defect size can be accurately calculated.
摘要翻译：当通过现有技术的缺陷检查装置获得越来越小型化的图案的缺陷的尺寸时，不方便地给出不同于SEM的相同缺陷的测量值的值。因此，需要精确地计算由缺陷检查装置检测到的缺陷的尺寸值，以近似于通过SEM测量的值。为此，由缺陷检查装置检测到的缺陷的尺寸根据缺陷的特征量或类型进行修正，从而可以精确地计算缺陷尺寸。

52. 发明申请

US20090105990A1 METHOD FOR ANALYZING DEFECT DATA AND INSPECTION APPARATUS AND REVIEW SYSTEM 有权
标题翻译：用于分析缺陷数据和检查装置和审查系统的方法
公开(公告)号：US20090105990A1
公开(公告)日：2009-04-23
申请号：US12341657
申请日：2008-12-22
申请人： Hisae SHIBUYA , Yuji Takagi
发明人： Hisae SHIBUYA , Yuji Takagi
IPC分类号： G06F15/00
CPC分类号： G01N21/956 , G06T7/0006 , G06T7/001 , G06T2207/30148
摘要： The distribution states of defects are analyzed on the basis of the coordinates of defects detected by an inspection apparatus to classify them into a distribution feature category, or any one of repetitive defect, congestion defect, linear distribution defect, ring/lump distribution defect and random defect. In the manufacturing process for semiconductor substrates, defect distribution states are analyzed on the basis of defect data detected by an inspection apparatus, thereby specifying the cause of defect in apparatus or process.
摘要翻译：基于由检查装置检测到的缺陷坐标来分析缺陷的分布状态，将其分类为分布特征类别，或重复缺陷，拥塞缺陷，线性分布缺陷，环/块分布缺陷和随机缺陷。在半导体基板的制造工序中，基于由检查装置检测出的缺陷数据来分析缺陷分布状态，从而指定装置或处理中的缺陷的原因。

53. 发明申请

US20080075352A1 DEFECT CLASSIFICATION METHOD AND APPARATUS, AND DEFECT INSPECTION APPARATUS 有权
标题翻译：缺陷分类方法和装置，以及缺陷检查装置
公开(公告)号：US20080075352A1
公开(公告)日：2008-03-27
申请号：US11779905
申请日：2007-07-19
申请人： HISAE SHIBUYA , Shunji Maeda , Akira Hamamatsu
发明人： HISAE SHIBUYA , Shunji Maeda , Akira Hamamatsu
IPC分类号： G06K9/00
CPC分类号： G06T7/0004 , G01N21/9501 , G01N21/956 , G06K9/03 , G06K9/6254 , G06K9/6282 , G06T2207/30148
摘要： A defect classification method to classify defects by using a classifier having a binary tree structure based on features of defects extracted from detected signals acquired from a defect inspection apparatus includes a classifier construction process for constructing the classifier by setting a branch condition including defect classes respectively belonging to groups located on both sides of the branch point, a feature to be used for branching, and a discriminant reference, for each branch point in the structure based on instruction of defect classes and feature data respectively associated therewith beforehand. The process includes a priority order specification process for previously specifying target classification performance of purity and accuracy for each defect class, whole and in worst case, with priority order, and an evaluation process for evaluating whether the specified target classification performance under the branching condition is satisfied and displaying a result of evaluation, every item.
摘要翻译：通过使用基于从缺陷检查装置获取的检测信号提取的缺陷的特征的具有二叉树结构的分类器对缺陷进行分类的缺陷分类方法包括：分类器构造处理，用于通过设置包括分别属于的缺陷类的分支条件来构建分类器基于分支点两侧的组，用于分支的特征，以及基于与预先分别相关联的缺陷类别和特征数据的指示的结构中的每个分支点的判别参考。该处理包括优先顺序指定处理，用于以优先级顺序预先指定每个缺陷类的全部和最坏情况下的纯度和精度的目标分类性能，以及用于评估分支条件下的指定目标分类性能是否为满意并显示评估结果，每个项目。

54. 发明申请

US20070019185A1 Apparatus of inspecting defect in semiconductor and method of the same 有权
标题翻译：检测半导体缺陷的装置及其方法
公开(公告)号：US20070019185A1
公开(公告)日：2007-01-25
申请号：US11488622
申请日：2006-07-19
申请人： Akira Hamamatsu , Shunji Maeda , Hisae Shibuya
发明人： Akira Hamamatsu , Shunji Maeda , Hisae Shibuya
IPC分类号： G01N21/88
CPC分类号： G01N21/956
摘要： When size of a defect on an increasingly miniaturized pattern is obtained by defect inspection apparatus in the related art, a value is inconveniently given, which is different from a measured value of the same defect by SEM. Thus, a dimension value of a defect detected by defect inspection apparatus needs to be accurately calculated to be approximated to a value measured by SEM. To this end, size of the defect detected by the defect inspection apparatus is corrected depending on feature quantity or type of the defect, thereby defect size can be accurately calculated.
摘要翻译：当通过现有技术的缺陷检查装置获得越来越小型化的图案的缺陷的尺寸时，不方便地给出不同于SEM的相同缺陷的测量值的值。因此，需要精确地计算由缺陷检查装置检测到的缺陷的尺寸值，以近似于通过SEM测量的值。为此，由缺陷检查装置检测到的缺陷的尺寸根据缺陷的特征量或类型进行修正，从而可以精确地计算缺陷尺寸。

55. 发明申请

US20060215902A1 Method and apparatus for detecting pattern defects 有权
标题翻译：检测图案缺陷的方法和装置
公开(公告)号：US20060215902A1
公开(公告)日：2006-09-28
申请号：US11319271
申请日：2005-12-29
申请人： Hisae Shibuya , Akira Hamamatsu , Yuji Takagi
发明人： Hisae Shibuya , Akira Hamamatsu , Yuji Takagi
IPC分类号： G06K9/00
CPC分类号： G06K9/6221 , G01N21/9501 , G01N21/95607 , G01N2021/8854 , G01N2021/95676
摘要： With the objective of achieving defect kind training in a short period of time to teach classification conditions of defects detected as a result of inspecting a thin film device, according to one aspect of the present invention, there is provided a visual inspection method, and an apparatus therefor, comprising the steps of: detecting defects based on inspection images acquired by optical or electronic defect detection means, and at the same time calculating features of the defects; and classifying the defects according to classification conditions set beforehand, wherein said classification condition setting step further includes the steps of: collecting defect features over a large number of defects acquired beforehand from the defect detection step; sampling defects based on the distribution of the collected defect features over the large number of defects; and setting defect classification conditions based on the result of reviewing the sampled defects.
摘要翻译：为了在短时间内实现缺陷种类训练，目的在于教导检查薄膜装置的检测缺陷的分类条件，根据本发明的一个方面，提供一种目视检查方法，其装置包括以下步骤：基于由光学或电子缺陷检测装置获取的检查图像检测缺陷，同时计算缺陷的特征; 并根据预先设定的分类条件对缺陷进行分类，其中所述分类条件设置步骤还包括以下步骤：从缺陷检测步骤预先获取的大量缺陷中收集缺陷特征; 基于收集的缺陷特征分布在大量缺陷上的采样缺陷; 并根据检查采样缺陷的结果设置缺陷分类条件。

56. 发明授权

US07084968B2 Method for analyzing defect data and inspection apparatus and review system 失效
公开(公告)号：US07084968B2
公开(公告)日：2006-08-01
申请号：US11095614
申请日：2005-04-01
申请人： Hisae Shibuya , Yuji Takagi
发明人： Hisae Shibuya , Yuji Takagi
IPC分类号： G01N21/88
CPC分类号： G01N21/956 , G06T7/0006 , G06T7/001 , G06T2207/30148
摘要： The distribution states of defects are analyzed on the basis of the coordinates of defects detected by an inspection apparatus to classify them into a distribution feature category, or any one of repetitive defect, congestion defect, linear distribution defect, ring/lump distribution defect and random defect. In the manufacturing process for semiconductor substrates, defect distribution states are analyzed on the basis of defect data detected by an inspection apparatus, thereby specifying the cause of defect in apparatus or process.

57. 发明申请

US20060078188A1 Method and its apparatus for classifying defects 审中-公开
标题翻译：分类缺陷的方法及其设备
公开(公告)号：US20060078188A1
公开(公告)日：2006-04-13
申请号：US11190829
申请日：2005-07-28
申请人： Masaki Kurihara , Hisae Shibuya , Toshifumi Honda , Naoki Hosoya , Atsushi Miyamoto
发明人： Masaki Kurihara , Hisae Shibuya , Toshifumi Honda , Naoki Hosoya , Atsushi Miyamoto
IPC分类号： G06K9/00 , G06K9/62
CPC分类号： G06T7/0004 , G06T2207/30148
摘要： In an automatic defect classifying method, defects not reviewed are assigned with defect classes having the same definitions as those of reviewed defects in order to effectively use information on defects not reviewed, the defects not reviewed occupying most of defects on a wafer. Defects not reviewed are assigned defect classes having the same definitions, by using defect data of defects detected with an inspection equipment and defect classes of already reviewed defects given by ADC of a review equipment. Since all defects are assigned the defect classes having the same definitions, more detailed analysis is possible in estimating the generation reasons of defects.
摘要翻译：在自动缺陷分类方法中，未评估的缺陷被分配具有与经检查的缺陷相同的定义的缺陷类，以便有效地使用未被评估的缺陷的信息，未被评估的缺陷占据了晶片上的大多数缺陷。未审查的缺陷被分配具有相同定义的缺陷类别，通过使用检查设备检测到的缺陷缺陷数据和审查设备的ADC给出的已经评估的缺陷的缺陷类别。由于所有缺陷都分配有相同定义的缺陷类别，因此可以在估计缺陷的生成原因时进行更详细的分析。

58. 发明授权

US06876445B2 Method for analyzing defect data and inspection apparatus and review system 有权
公开(公告)号：US06876445B2
公开(公告)日：2005-04-05
申请号：US10119018
申请日：2002-04-10
申请人： Hisae Shibuya , Yuji Takagi
发明人： Hisae Shibuya , Yuji Takagi
IPC分类号： H01L21/66 , G01N21/95 , G06T7/00 , G01N21/88
CPC分类号： G01N21/956 , G06T7/0006 , G06T7/001 , G06T2207/30148
摘要： The distribution states of defects are analyzed on the basis of the coordinates of defects detected by an inspection apparatus to classify them into a distribution feature category, or any one of repetitive defect, congestion defect, linear distribution defect, ring/lump distribution defect and random defect. In the manufacturing process for semiconductor substrates, defect distribution states are analyzed on the basis of defect data detected by an inspection apparatus, thereby specifying the cause of defect in apparatus or process.

59. 发明授权

US09659250B2 Facility state monitoring method and device for same 有权
公开(公告)号：US09659250B2
公开(公告)日：2017-05-23
申请号：US14241780
申请日：2011-08-31
申请人： Hisae Shibuya , Shunji Maeda
发明人： Hisae Shibuya , Shunji Maeda
IPC分类号： G06N5/00 , G06F1/00 , G06N5/02 , G05B23/02 , G06N99/00
CPC分类号： G06N5/02 , G05B23/0221 , G05B23/0254 , G05B2219/32201 , G06N99/005 , Y02P90/22
摘要： In case-based anomaly indication detection in a facility, there are problems such as error generation due to insufficient learning data or execution difficulty due to increased memory capacity and calculation time when the learning data period has been increased to obtain the learning data sufficiently. Provided is a method for monitoring facility state on the basis of a time series signal outputted from the facility, wherein an operation pattern label for each fixed interval is assigned on the basis of the time series signal, learning data is selected on the basis of the operation pattern label for each fixed interval, a normal model is created on the basis of the selected learning data, an anomaly measure is calculated on the basis of the time series signal and the normal model, and the facility state is determined to be anomaly or normal on the basis of the calculated anomaly measure.

60. 发明授权

US08682824B2 Method and device for monitoring the state of a facility 有权
标题翻译：监控设施状态的方法和装置
公开(公告)号：US08682824B2
公开(公告)日：2014-03-25
申请号：US13383841
申请日：2010-07-28
申请人： Hisae Shibuya , Shunji Maeda
发明人： Hisae Shibuya , Shunji Maeda
IPC分类号： G06N5/00
CPC分类号： G05B23/021 , G06N99/005
摘要： This invention provides method for detecting advance signs of anomalies, event signals outputted from the facility are used to create a separate mode for each operating state, a normal model is created for each mode, the sufficiency of learning data for each mode is checked, a threshold is set according to the results of said check, and anomaly identification is performed using said threshold. Also, for diagnosis, a frequency matrix is created in advance, with result events on the horizontal axis and cause events on the vertical axis, and the frequency matrix is used to predict malfunctions. Malfunction events are inputted as result events, and quantized sensor signals having anomaly measures over the threshold are inputted as cause events.
摘要翻译：本发明提供了用于检测异常的提前符号的方法，从设施输出的事件信号用于为每个操作状态创建单独的模式，为每个模式创建正常模型，检查每种模式的学习数据的充分性，根据所述检查的结果设定阈值，使用所述阈值进行异常识别。另外，为了进行诊断，预先创建频率矩阵，结果事件在水平轴上，导致垂直轴上的事件，频率矩阵用于预测故障。作为结果事件输入故障事件，并且将具有超过阈值的异常测量的量化的传感器信号作为原因事件输入。

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