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    • 51. 发明授权
    • Low-voltage content addressable memory cell with a fast tag-compare capability using partially-depleted SOI CMOS dynamic-threshold techniques
    • 低电压内容可寻址存储单元,具有使用部分耗尽的SOI CMOS动态阈值技术的快速标签比较能力
    • US06240004B1
    • 2001-05-29
    • US09597275
    • 2000-06-19
    • James B. KuoSheng-Che Liu
    • James B. KuoSheng-Che Liu
    • G11C1500
    • G11C15/04
    • This invention discloses a content addressable memory (CAM) cell having a SRAM portion and a tag-compare portion. The tag-compare portion includes six NMOS transistors, designated as M7 to M12, wherein a source of M7 is connected to a drain of M8, a drain of M7 is connected to a match line ML, a source of M8 is grounded; a body of M7 and a body of M8 are tied together at a source of M11, a gate of M7 and a gate of M11 are tied together to a first node n1, a gate of M8 and a drain of M11 are connected to a first digit line DLB; and a source of M9 is connected to a drain of M10, a drain of M9 is connected to said match line ML, a source of M10 is grounded; a body of M9 and a body of M10 are tied together at a source of M12, a gate of M9 and a gate of M12 are tied together to a second node n2, a gate of M10 and a drain of M12 are connected to a second digit line DL. The first and second nodes n1 and n2 are internal storage nodes of the SRAM portion.
    • 本发明公开了一种具有SRAM部分和标签比较部分的内容寻址存储器(CAM)单元。 标签比较部分包括六个称为M7至M12的NMOS晶体管,其中M7的源极连接到M8的漏极,M7的漏极连接到匹配线ML,M8的源极接地; M7的主体和M8的主体在M11的源处连接在一起,M7的门和M11的门被连接到第一节点n1,M8的门和M11的漏极连接到第一节点 数字线DLB; 并且M9的源极连接到M10的漏极,M9的漏极连接到所述匹配线ML,M10的源极接地; M9的主体和M10的主体在M12的源极处连接在一起,M9的门和M12的门被连接在一起到第二节点n2,M10的门和M12的漏极连接到第二个 数字线DL。 第一和第二节点n1和n2是SRAM部分的内部存储节点。
    • 53. 发明授权
    • Spray type heat-exchanging unit
    • 喷雾式热交换装置
    • US08561675B2
    • 2013-10-22
    • US12637495
    • 2009-12-14
    • Chung-Che LiuYie-Zu HuHsi-Tsung Cheng
    • Chung-Che LiuYie-Zu HuHsi-Tsung Cheng
    • F28D5/00A23C3/04
    • F25B39/02F25B2339/0242F28D5/02F28D21/0017F28D2021/0071
    • A spray type heat-exchanging unit includes a main body; a distributive refrigerant spray module located in an upper part of the main body and having an extended distributor and a refrigerant spray surface; and a plurality of heat exchange tubes provided in the main body below the distributive refrigerant spray module. A liquid refrigerant is guided into the extended distributor to drip onto the refrigerant spray surface, and then uniformly sprayed onto the heat exchange tubes. Gaseous refrigerant produced by evaporation in heat exchange in the main body is recovered via a top opening of the main body, making the mechanical refrigerating apparatus more efficient than a refrigerating apparatus adopting a flooded evaporator, and minimizing the refrigerant charge amount and material cost required by the heat-exchanging unit.
    • 喷雾式热交换器包括:主体; 分配制冷剂喷射模块,其位于主体的上部并具有延伸的分配器和制冷剂喷射表面; 以及在分配制冷剂喷射模块的下方的主体内设置的多个热交换管。 将液体制冷剂引导到延伸的分配器中以滴落到制冷剂喷射表面上,然后均匀地喷射到热交换管上。 通过主体的热交换蒸发而产生的气态制冷剂通过主体的顶部开口被回收,使得机械制冷装置比采用淹没的蒸发器的制冷装置更有效,并使制冷剂充量量和材料成本最小化 热交换单元。
    • 55. 发明申请
    • MOTHER SUBSTRATE STRUCTURE OF LIGHT EMITTING DEVICES, LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME
    • 发光装置的发明底板结构,发光装置及其制造方法
    • US20120294003A1
    • 2012-11-22
    • US13197780
    • 2011-08-04
    • Chih-Che LiuShih-Feng Hsu
    • Chih-Che LiuShih-Feng Hsu
    • F21S4/00C03B29/00B32B38/10
    • H05B33/10H01L51/524H01L51/525H01L2251/566
    • A mother substrate structure includes a mother substrate, a cover plate, a sealant and a spacer structure. The mother substrate has light emitting units thereon. The cover plate is disposed above the mother substrate and has unit regions, each unit region corresponding to one of the light emitting unit. The cover plate has a cutting line around each unit region, sealant regions between the cutting line and each of the unit regions, and spacer disposing regions between the cutting line and each of the sealant regions, wherein a distance between the cutting line and each of the spacer disposing region is 0˜100 um. The sealant is disposed in the sealant regions to bond the mother substrate and the cover plate. The spacer structure is disposed in the spacer disposing regions and surrounds each of the light emitting units, and materials of the spacer structure and the sealant include a glass fit.
    • 母基板结构包括母基板,盖板,密封剂和间隔结构。 母基板上具有发光单元。 盖板设置在母基板上方,并且具有单位区域,每个单位区域对应于发光单元之一。 盖板在每个单元区域周围具有切割线,切割线与每个单位区域之间的密封剂区域以及切割线和每个密封剂区域之间的间隔物设置区域,其中切割线与每个切割线之间的距离 间隔物配置区域为0〜100μm。 密封剂设置在密封剂区域中以粘结母基板和盖板。 间隔物结构设置在间隔物设置区域中并且围绕每个发光单元,并且间隔物结构和密封剂的材料包括玻璃配合。
    • 58. 发明申请
    • Glass sealing package and manufacturing method thereof
    • 玻璃密封包装及其制造方法
    • US20110241060A1
    • 2011-10-06
    • US12852530
    • 2010-08-09
    • Chih-Che LIUShih-Feng HSU
    • Chih-Che LIUShih-Feng HSU
    • H01L33/48H01L21/50
    • H01L51/5246
    • Disclosed herein are a glass sealing package and a manufacturing method thereof. The glass sealing package includes a first glass substrate, a second glass substrate and a frit. The coefficient of thermal expansion of the frit lies between that of the two glass substrates. A light emitting element on the first glass substrate is situated in a sealed room formed among the two substrates and the frit. The method includes the steps of proving a first and a second glass substrate, dispensing a frit on the second glass substrate, pre-sintering the frit, assembling the two substrates, and sealing the frit to join the two substrates.
    • 本文公开了一种玻璃密封包装及其制造方法。 玻璃密封包装包括第一玻璃基板,第二玻璃基板和玻璃料。 玻璃料的热膨胀系数在两个玻璃基板的热膨胀系数之间。 第一玻璃基板上的发光元件位于形成在两个基板和玻璃料之间的密封室中。 该方法包括以下步骤:证明第一和第二玻璃基板,在第二玻璃基板上分配玻璃料,预烧结玻璃料,组装两个基板,以及密封玻璃料以连接两个基板。