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51. 发明专利

JP4185523B2 Electroless nickel plating film and machine parts having the coating 有权
公开(公告)号：JP4185523B2
公开(公告)日：2008-11-26
申请号：JP2005359762
申请日：2005-12-14
申请人：日本カニゼン株式会社
发明人：純貴渡辺
IPC分类号： C23C18/50

52. 发明专利

JP2007291465A Device for prolonging lifetime of electroless nickel-plating liquid 有权
标题翻译：用于延长电镀镍液的寿命的装置
公开(公告)号：JP2007291465A
公开(公告)日：2007-11-08
申请号：JP2006122255
申请日：2006-04-26
申请人： Nippon Kanizen Kk , Tokyo Institute Of Technology , 国立大学法人東京工業大学 , 日本カニゼン株式会社
发明人： KOJIMA TAKASHI , YAMAMOTO MAKIKO , NEMOTO KENICHI , MINAGAWA YOSHIE , TANIOKA AKIHIKO
IPC分类号： C23C18/16 , B01D61/44 , B01D61/58 , C02F1/469 , C23C18/31 , C23C18/36
摘要： PROBLEM TO BE SOLVED: To provide a device for prolonging the lifetime of an electroless nickel-plating liquid capable of reducing the amount of a waste liquid and reducing losses of raw material components by increasing the use frequency of continuous circulation of an electroless Ni plating liquid. SOLUTION: A first negative ion exchange membrane 4 which permeates hypophosphite ions, phosphite ions, and SO 4 2- but does not permeate organic acid ions, and a first positive ion exchange membrane 5 which permeates Na+ but does not permeate Ni 2+ are alternately arranged in a first electrodialysis unit 1 connected to a Ni plating liquid tank 21. A second negative ion exchange membrane 14 which permeates hypophosphite ions and organic acid ions but does not permeate phosphate ions and SO 4 2- and a second positive ion exchange membrane which permeates H + but does not permeate Ni 2+ are alternately arranged in a second electrodialysis unit 11 connected to its first concentration chamber 7. A second concentration chamber 17 is connected to the Ni plating liquid tank 21. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够延长化学镀镍液的寿命的装置，其能够通过增加无电镀的连续循环的使用频率来减少废液的量并减少原料成分的损失镀镍液。解决方案：渗透次磷酸根离子，亚磷酸根离子和SO 3 S 2，但不渗透有机酸离子的第一负离子交换膜4和第一在与Ni镀液槽21连接的第一电渗析单元1中交替排列渗透Na +但不渗透Ni +的阳离子交换膜5，第二负离子交换膜14渗透次磷酸盐离子和有机酸离子，但不渗透磷酸根离子和第二阳离子交换膜，其渗透H + ，但是不渗透Ni 2 + 交替排列在与其第一浓缩室7连接的第二电渗析单元11中。第二浓度室17连接到Ni镀液槽21。 C）2008，JPO＆INPIT

53. 发明专利

JP2007071032A Part of rotary machine and rotary machine 有权
标题翻译：旋转机和旋转机的一部分
公开(公告)号：JP2007071032A
公开(公告)日：2007-03-22
申请号：JP2005255481
申请日：2005-09-02
申请人： Mitsubishi Heavy Ind Ltd , Nippon Kanizen Kk , 三菱重工業株式会社 , 日本カニゼン株式会社
发明人： YASUI TOYOAKI , YAMADA YOSHIKAZU , HANANAKA KATSUYASU , HATA SATOSHI , TSURUSAKI YUZO , ISUMI OSAMU , SAITO KAZUHIDE , NEMOTO KENICHI , SUZUKI YUKIHARU
IPC分类号： F01D5/28 , F04D29/30 , F04D29/38
摘要： PROBLEM TO BE SOLVED: To effectively restrain sticking of a particulate included in gas in a rotary machine for treating the gas including silica, iron oxide and other particulates. SOLUTION: This moving blade 23 includes a first fluororesin including plating coating film 12 and a second fluororesin including plating coating film 14 formed as a film on this surface. The first fluororesin including plating coating film 12 includes a first fluororesin particle 13P by a first plating matrix 13M, and a part of the first fluororesin particle 13P is also exposed from a surface of the first plating matrix 13M. In the second fluororesin including plating coating film 14, a second fluororesin particle 14P having a diameter smaller than the first fluororesin particle 13P is included in a second plating matrix 13M, and a part of the second fluororesin particle 14P and the first fluororesin particle 13P is also exposed from a surface of the second plating matrix 14M. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了有效地抑制气体中包含的颗粒在用于处理包括二氧化硅，氧化铁和其它颗粒的气体的旋转机械中的粘附。解决方案：该移动刀片23包括第一氟树脂，其包括镀覆膜12和在该表面上形成为膜的镀覆膜14的第二氟树脂。包括电镀覆膜12的第一氟树脂包括通过第一电镀基质13M的第一氟树脂颗粒13P，并且第一氟树脂颗粒13P的一部分也从第一电镀基质13M的表面露出。在包括电镀覆膜14的第二氟树脂中，第二镀层基质13M中包含直径小于第一氟树脂颗粒13P的第二氟树脂颗粒14P，第二氟树脂颗粒14P和第一氟树脂颗粒13P的一部分也从第二电镀基体14M的表面露出。版权所有（C）2007，JPO＆INPIT

54. 发明专利

JPWO2004057054A1 異方成長バンプ形成用無電解ニッケルめっき浴、異方成長バンプの形成方法、異方成長バンプが形成された物品及び無電解ニッケルめっき浴用異方成長促進剤有权
公开(公告)号：JPWO2004057054A1
公开(公告)日：2006-04-20
申请号：JP2004562067
申请日：2003-12-19
申请人：日本カニゼン株式会社
发明人：幸則齋木 , 幸則齋木 , 憲一根本 , 憲一根本
IPC分类号： C23C18/34 , C23C18/32 , H01L21/288 , H01L21/60
CPC分类号： C23C18/32 , H01L21/288 , H01L24/11 , H01L2224/13099 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01052 , H01L2924/01058 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01093 , H01L2924/014 , H01L2924/09701
摘要：本発明は、広範囲多ピン化及び狭ピッチ化に対応するために必要な、高さばらつきの少ない高アスペクト比のドーム型バンプの形成を可能にする異方成長バンプ形成用無電解ニッケルめっき浴、異方成長ニッケルバンプを有する製品の形成方法、異方成長ニッケルバンプが形成された物品及び無電解ニッケルめっき浴用異方成長促進剤を提供することを目的とする。本発明は、異方成長促進効果を有する量の異方成長促進剤を含有することを特徴とする異方成長バンプ形成用無電解ニッケルめっき浴を提供する。

55. 发明专利

JP2005146411A Surface treatment agent for electroless nickel plating film, protective film, product having the protective film, and their production method 审中-公开
标题翻译：用于电镀镍镀层的表面处理剂，保护膜，具有保护膜的产品及其生产方法
公开(公告)号：JP2005146411A
公开(公告)日：2005-06-09
申请号：JP2004257959
申请日：2004-09-06
申请人： Nippon Kanizen Kk , 日本カニゼン株式会社
发明人： SUZUKI SATOSHI , TAKEUCHI YOSHIHIKO , YAMAMOTO KYOSUKE
IPC分类号： C23C22/42 , C23C28/00
CPC分类号： C23C28/322 , C23C28/345
摘要： PROBLEM TO BE SOLVED: To provide a surface treatment agent for electroless nickel plating capable of forming a protective film having corrosion resistance and discoloration resistance equal to those of a protective film formed with a chromic acid-based surface treatment agent, to provide a protective film on the surface of an electroless nickel plating film, to provide its production method, and to provide a product having a nickel plating film coated with the protective film.
SOLUTION: The surface treatment agent for electroless nickel plating film is composed of an aqueous solution containing, by mass, a 0.1 to 10% molybdenum compound, a 0.01 to 5% tungsten compound, a 0.1 to 12% phosphoric compound, a 0.01 to 3% sulfuric compound and a 0.01 to 12% silicic compound, and forms a protective film comprising 30 to 90% oxygen, 0.1 to 30% silicon, 0.01 to 18% nickel and 5 to 50% phosphorus on an electroless nickel plating film.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够形成具有与由铬酸类表面处理剂形成的保护膜相同的耐腐蚀性和耐变色性的保护膜的化学镀镍表面处理剂，以提供在化学镀镍膜的表面上的保护膜，以提供其制造方法，并提供具有涂覆有保护膜的镀镍膜的产品。解决方案：化学镀镍表面处理剂由含有0.1〜10％的钼化合物，0.01〜5％的钨化合物，0.1〜12％的磷化合物， 0.01〜3％的硫化合物和0.01〜12％的硅化合物，并且在化学镀镍膜上形成包含30〜90％的氧，0.1〜30％的硅，0.01〜18％的镍和5〜50％的磷的保护膜。版权所有（C）2005，JPO＆NCIPI

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