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    • 52. 发明授权
    • Factorized power architecture with point of load sine amplitude converters
    • 具有点负载正弦幅度转换器的因式分解电源架构
    • US06930893B2
    • 2005-08-16
    • US10264327
    • 2002-10-01
    • Patrizio Vinciarelli
    • Patrizio Vinciarelli
    • H02J1/10H02M3/00H02M3/28H02M3/335H02M3/337H02M7/00
    • H02J1/102H01F2038/006H02M1/08H02M3/00H02M3/28H02M3/285H02M3/33592H02M3/337H02M3/3376H02M7/003Y02B70/1433Y02B70/1475
    • A Factorized Power Architecture (“FPA”) includes a power regulator providing controlled DC bus voltages distributed and converted to load voltages, at the load, using DC voltage transformation modules (“VTMs”) having fixed transformation ratios. Optional feedback from the load improves regulation. A Sine Amplitude Converter (“SAC”) VTM locks the conversion frequency to resonance of a resonant circuit including a transformer, uses complementary primary switches, balanced switching, and a high conversion duty cycle, and may use primary ZVS and secondary ZVS and ZCS, low Q, and a low profile core structure, and may exhibit greater than 400 Watts/cubic-inch power density and 95% efficiency. Common-source gate-control topologies efficiently drive switches higher than 1 MHz. Symmetrical power trains reduce common-mode noise. Modulated converter output resistance controls Vout, limits Iout, or improves current sharing. Gate drive circuitry recycles energy from the transformer magnetizing inductance. A DC—DC converter includes a non-isolated converter followed by a SAC.
    • 因式分解电源架构(“FPA”)包括功率调节器,使用具有固定变压比的直流电压变换模块(“VTM”),在受负载下分配并转换为负载电压,从而提供受控直流母线电压。 来自负载的可选反馈改善了调节。 正弦振幅转换器(“SAC”)VTM将转换频率锁定到包括变压器的谐振电路的谐振,使用互补初级开关,平衡开关和高转换占空比,并且可以使用初级ZVS和次级ZVS和ZCS, 低Q值和低外形芯结构,并且可以表现出大于400瓦特/立方英寸的功率密度和95%的效率。 共源栅极控制拓扑有效地驱动高于1 MHz的开关。 对称功率列降低了共模噪声。 调制转换器输出电阻控制V OUT输出,限制I 输出,或改善电流共享。 栅极驱动电路从变压器励磁电感中回收能量。 DC-DC转换器包括非隔离转换器,随后是SAC。
    • 56. 发明授权
    • Panel-molded electronic assemblies
    • US10791645B1
    • 2020-09-29
    • US16791478
    • 2020-02-14
    • VLT, Inc.
    • Patrizio VinciarelliMichael B. LaFleurSean Timothy FlemingRudolph F. MutterAndrew T. D'Amico
    • H05K5/00H05K7/14H05K1/18B29C45/14H05K1/11B29C45/16B29K63/00B29C45/00
    • A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.