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51. 发明授权

US09117968B2 Light-emitting diode structure 有权
标题翻译：发光二极管结构
公开(公告)号：US09117968B2
公开(公告)日：2015-08-25
申请号：US13834055
申请日：2013-03-15
申请人： TSMC Solid State Lighting Ltd.
发明人： Hsing-Kuo Hsia , Ching-Hua Chiu
IPC分类号： H01L33/00 , H01L33/20
CPC分类号： H01L33/20 , H01L33/007 , H01L33/0079
摘要： A light-emitting diode structure includes an AuSn or AuIn-containing bonding layer over a substrate, a metal layer disposed over the bonding layer, a p-type doped gallium nitride (p-GaN) layer disposed over the metal layer, a n-type doped gallium nitride (n-GaN) layer approximate the p-GaN layer, a multiple quantum well structure disposed between the n-GaN and p-GaN layers, and a conductive contact disposed on the n-GaN layer. The n-GaN layer includes a rough surface with randomly distributed dips. The nano-sized dips have diameters distributed between about 100 nm and about 600 nm, have a dip density ranging from about 107 grains/cm2 to about 109 grains/cm2, and are spaced from each other with an average spacing S, average diameter D, and a ratio S/D that ranges between about 1.1 and about 1.5. The conductive contact is disposed on some of the nano-sized dips of the rough surface.
摘要翻译：发光二极管结构包括在衬底上的AuSn或含AuIn的结合层，设置在所述接合层上的金属层，设置在所述金属层上的p型掺杂的氮化镓（p-GaN）层，掺杂氮化镓（n-GaN）层近似于p-GaN层，设置在n-GaN和p-GaN层之间的多量子阱结构和设置在n-GaN层上的导电接触。 n-GaN层包括具有随机分布的凹陷的粗糙表面。纳米尺寸浸渍剂的直径分布在约100nm至约600nm之间，浸渍密度范围为约107粒/ cm 2至约109粒/ cm 2，并且以平均间隔S，平均直径D ，S / D的范围为约1.1至约1.5。导电触点设置在粗糙表面的一些纳米尺寸的凹部上。

52. 发明授权

US09035334B2 Method and apparatus for fabricating phosphor-coated LED dies 有权
标题翻译：制造磷光体涂层LED芯片的方法和装置
公开(公告)号：US09035334B2
公开(公告)日：2015-05-19
申请号：US14174929
申请日：2014-02-07
申请人： TSMC Solid State Lighting Ltd.
发明人： Chi-Xiang Tseng , Hsiao-Wen Lee , Min-Sheng Wu , Tien-Min Lin
IPC分类号： H01L33/50 , H01L33/62 , H01L25/075
CPC分类号： H01L33/62 , H01L25/0753 , H01L33/50 , H01L2224/13 , H01L2924/0002 , H01L2933/0041 , H01L2924/00
摘要： The present disclosure involves a method of packaging a light-emitting diode (LED). According to the method, a group of metal pads and a group of LEDs are provided. The group of LEDs is attached to the group of metal pads, for example through a bonding process. After the LEDs are attached to the metal pads, each LED is spaced apart from adjacent LEDs. Also according to the method, a phosphor film is coated around the group of LEDs collectively. The phosphor film is coated on top and side surfaces of each LED and between adjacent LEDs. A dicing process is then performed to slice through portions of the phosphor film located between adjacent LEDs. The dicing process divides the group of LEDs into a plurality of individual phosphor-coated LEDs.
摘要翻译：本公开涉及封装发光二极管（LED）的方法。根据该方法，提供一组金属焊盘和一组LED。该组LED例如通过粘合工艺连接到金属焊盘组上。 LED连接到金属焊盘后，每个LED与相邻的LED间隔开。同样根据该方法，荧光膜被集体涂覆在LED组上。荧光膜被涂覆在每个LED的顶表面和侧表面上以及相邻的LED之间。然后进行切割处理以切割位于相邻LED之间的部分荧光膜。切割工艺将LED组分成多个单独的磷光体涂覆的LED。

53. 发明授权

US09029175B2 Single phosphor layer photonic device for generating white light or color lights 有权
标题翻译：用于产生白光或彩色光的单荧光层光子器件
公开(公告)号：US09029175B2
公开(公告)日：2015-05-12
申请号：US14084783
申请日：2013-11-20
申请人： TSMC Solid State Lighting Ltd.
发明人： Hsin-Chieh Huang , Chao-Hsiung Wang
IPC分类号： H01L33/00 , H01L33/50 , H01L27/15 , H01L33/62 , H01L33/38
CPC分类号： H01L33/502 , H01L27/153 , H01L33/0079 , H01L33/382 , H01L33/504 , H01L33/508 , H01L33/62 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2924/1305 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： A photonic device generates light from a full spectrum of lights including white light. The device includes two or more LEDs grown on a substrate, each generating light of a different wavelength and separately controlled. A light-emitting structure is formed on the substrate and apportioned into the two or more LEDs by etching to separate the light-emitting structure into different portions. At least one of the LEDs is coated with a phosphor material so that different wavelengths of light are generated by the LEDs while the same wavelength of light is emitted from the light-emitting structure.
摘要翻译：光子器件从包括白光的全光谱产生光。该装置包括在基板上生长的两个或更多个LED，每个LED产生不同波长的光并分别控制。在衬底上形成发光结构，并通过蚀刻分配到两个或更多个LED中，以将发光结构分离成不同的部分。 LED中的至少一个被磷光体材料涂覆，使得由发光结构发射相同波长的光的同时由LED产生不同波长的光。

54. 发明授权

US08981534B2 Pre-cutting a back side of a silicon substrate for growing better III-V group compound layer on a front side of the substrate 有权
标题翻译：预切割硅衬底的背面，以在衬底的正面上生长更好的III-V族化合物层
公开(公告)号：US08981534B2
公开(公告)日：2015-03-17
申请号：US13616415
申请日：2012-09-14
申请人： Zhen-Yu Li , Chung-Pao Lin , Hsing-Kuo Hsia , Hao-Chung Kuo , Cindy Huichun Shu , Hsin-Chieh Huang
发明人： Zhen-Yu Li , Chung-Pao Lin , Hsing-Kuo Hsia , Hao-Chung Kuo , Cindy Huichun Shu , Hsin-Chieh Huang
IPC分类号： H01L29/06
CPC分类号： H01L33/0075 , B82Y20/00 , H01L21/02035 , H01L21/02458 , H01L21/0254 , H01L21/268 , H01L21/30604 , H01L29/0657 , H01L29/2003 , H01L29/205 , H01L29/66462 , H01L33/0025 , H01L33/0066 , H01L33/12 , H01L33/20 , H01S5/0207 , H01S5/021 , H01S5/0218 , H01S5/34333
摘要： The present disclosure involves an apparatus. The apparatus includes a substrate having a front side a back side opposite the front side. The substrate includes a plurality of openings formed from the back side of the substrate. The openings collectively define a pattern on the back side of the substrate from a planar view. In some embodiments, the substrate is a silicon substrate or a silicon carbide substrate. Portions of the silicon substrate vertically aligned with the openings have vertical dimensions that vary from about 100 microns to about 300 microns. A III-V group compound layer is formed over the front side of the silicon substrate. The III-V group compound layer is a component of one of: a light-emitting diode (LED), a laser diode (LD), and a high-electron mobility transistor (HEMT).
摘要翻译：本公开涉及一种装置。该装置包括具有前侧与前侧相对的后侧的基板。基板包括从基板的背面形成的多个开口。这些开口从平面图中共同地在基板的背面上限定图案。在一些实施例中，衬底是硅衬底或碳化硅衬底。与开口垂直对准的硅衬底的部分具有约100微米至约300微米的垂直尺寸。在硅衬底的正面上形成III-V族化合物层。 III-V族化合物层是发光二极管（LED），激光二极管（LD）和高电子迁移率晶体管（HEMT）之一的组分。

55. 发明授权

US08981397B2 Light-emitting devices on textured substrates 有权
标题翻译：纹理基板上的发光器件
公开(公告)号：US08981397B2
公开(公告)日：2015-03-17
申请号：US12704997
申请日：2010-02-12
申请人： Hsin-Chieh Huang
发明人： Hsin-Chieh Huang
IPC分类号： H01L33/00 , H01L33/20 , H01L33/46
CPC分类号： H01L33/22 , H01L33/0066 , H01L33/0075 , H01L33/0079 , H01L33/20 , H01L33/46 , H01L2933/0025
摘要： A device includes a textured substrate, which further includes a plurality of trenches. Each of the plurality of trenches includes a first sidewall and a second sidewall opposite the first sidewall. A plurality of reflectors configured to reflect light is formed, with each of the plurality of reflectors being on one of the first sidewalls of the plurality of trenches. The second sidewalls of the plurality of trenches are substantially free from any reflector.
摘要翻译：一种器件包括纹理化衬底，其还包括多个沟槽。多个沟槽中的每一个包括与第一侧壁相对的第一侧壁和第二侧壁。多个反射器被配置成反射光，多个反射器中的每一个在多个沟槽的第一侧壁中的一个上。多个沟槽的第二侧壁基本上没有任何反射器。

56. 发明授权

US08905600B2 Light-emitting diode lamp and method of making 有权
标题翻译：发光二极管灯及其制作方法
公开(公告)号：US08905600B2
公开(公告)日：2014-12-09
申请号：US13273850
申请日：2011-10-14
申请人： Chih-Hsuan Sun , Hsiao-Wen Lee
发明人： Chih-Hsuan Sun , Hsiao-Wen Lee
IPC分类号： F21V29/02 , F21K99/00 , F21V29/00 , F21V3/00 , F21Y101/02
CPC分类号： F21K9/232 , F21K9/90 , F21V3/00 , F21V29/773 , F21V29/83 , F21Y2115/10 , Y10T29/49117
摘要： A Light-Emitting Diode (LED) lamp includes a heat sink with a number of passive air flow ducts defined at least partially by fins of the heat sink and a cover plate over the fins. The heat sink includes a body with a cavity, a number of fins radiating outwards from the body, and a cover plate covering the fins. Each passive air flow duct includes top and bottom openings for air flow.
摘要翻译：发光二极管（LED）灯包括散热器，其具有至少部分地由散热器的鳍片限定的多个被动空气流动管道和鳍片上方的盖板。散热器包括具有空腔的主体，从主体向外辐射的多个翅片以及覆盖翅片的盖板。每个被动气流管道包括用于空气流动的顶部和底部开口。

57. 发明授权

US08899787B2 Thermal protection structure for multi-junction LED module 有权
标题翻译：多结LED模块的热保护结构
公开(公告)号：US08899787B2
公开(公告)日：2014-12-02
申请号：US13287171
申请日：2011-11-02
申请人： Wei-Yu Yeh
发明人： Wei-Yu Yeh
IPC分类号： F21V27/00 , H05B33/08
CPC分类号： H05B33/089 , H05B33/0851 , Y02B20/341
摘要： The present disclosure discloses an apparatus for thermally protecting an LED device. The apparatus includes a substrate. The apparatus includes a plurality of light-emitting devices disposed over the substrate. A selected one of the plurality of light-emitting devices is at least partially surrounded by the rest of the plurality of light-emitting devices. The apparatus includes a feedback mechanism electrically coupled to the selected light-emitting device. The feedback mechanism is operable to detect a change in a temperature of the selected light-emitting device. The feedback mechanism is also operable to adjust an electrical current through at least the selected light-emitting device in response to the detected change in the temperature.
摘要翻译：本公开公开了一种用于热保护LED装置的装置。该装置包括基板。该装置包括设置在基板上的多个发光装置。所述多个发光器件中的所选择的一个至少部分地被所述多个发光器件的其余部分包围。该装置包括电耦合到所选择的发光装置的反馈机构。反馈机构可操作以检测所选择的发光装置的温度变化。反馈机构还可操作以响应于检测到的温度变化而调节通过至少所选择的发光器件的电流。

58. 发明授权

US08894249B2 LED module and method of bonding thereof 有权
公开(公告)号：US08894249B2
公开(公告)日：2014-11-25
申请号：US14153347
申请日：2014-01-13
申请人： TSMC Solid State Lighting Ltd.
发明人： Wei-Yu Yeh
IPC分类号： F21V29/00 , H05K3/00 , H05K1/02 , H05K1/05
CPC分类号： F21V19/005 , B23K20/002 , B23K20/10 , B23K2101/36 , F21V29/70 , H01L2924/0002 , H05K1/0203 , H05K1/05 , H05K3/0061 , H05K2201/10106 , H05K2203/0285 , H01L2924/00
摘要： The present disclosure provides a method including providing a light-emitting diode (LED) device (e.g., a LED element and PCB) and a heat sink. The LED device is bonded to the heat sink by applying an ultrasonic energy. In an embodiment, the bonding may form a bond comprising copper and aluminum. The PCB may be a metal core PCB (MC-PCB).

59. 发明授权

US08889439B2 Method and apparatus for packaging phosphor-coated LEDs 有权
标题翻译：用于包装磷光体涂覆的LED的方法和装置
公开(公告)号：US08889439B2
公开(公告)日：2014-11-18
申请号：US13788536
申请日：2013-03-07
申请人： TSMC Solid State Lighting Ltd.
发明人： Chi-Xiang Tseng , Hsiao-Wen Lee , Min-Sheng Wu , Tien-Min Lin
IPC分类号： H01L33/50 , H01L33/46
CPC分类号： H01L33/504 , H01L33/46 , H01L33/505 , H01L2933/0041
摘要： The present disclosure involves a method of packaging light-emitting diodes (LEDs). According to the method, a plurality of LEDs is provided over an adhesive tape. The adhesive tape is disposed on a substrate. In some embodiments, the substrate may be a glass substrate, a silicon substrate, a ceramic substrate, and a gallium nitride substrate. A phosphor layer is coated over the plurality of LEDs. The phosphor layer is then cured. The tape and the substrate are removed after the curing of the phosphor layer. A replacement tape is then attached to the plurality of LEDs. A dicing process is then performed to the plurality of LEDs after the substrate has been removed. The removed substrate may then be reused for a future LED packaging process.
摘要翻译：本公开涉及封装发光二极管（LED）的方法。根据该方法，在胶带上设置多个LED。粘合带设置在基板上。在一些实施例中，衬底可以是玻璃衬底，硅衬底，陶瓷衬底和氮化镓衬底。磷光体层被涂覆在多个LED上。然后将磷光体层固化。在荧光体层固化之后去除胶带和基材。然后将替代胶带附接到多个LED。然后在去除衬底之后，对多个LED进行切割处理。然后可以将去除的衬底重新用于将来的LED封装工艺。

60. 发明授权

US08823049B2 Light-emitting diode with current-spreading region 有权
标题翻译：具有电流扩展区域的发光二极管
公开(公告)号：US08823049B2
公开(公告)日：2014-09-02
申请号：US13793198
申请日：2013-03-11
申请人： Taiwan Semiconductor Manufacturing Company Ltd.
发明人： Ding-Yuan Chen , Chen-Hua Yu , Wen-Chih Chiou
IPC分类号： H01L33/00
CPC分类号： H01L33/145 , H01L33/0066 , H01L33/04 , H01L33/06 , H01L33/30 , H01L33/36 , H01L33/62 , H01L2933/0066
摘要： A light-emitting diode (LED) device is provided. The LED device has a lower LED layer and an upper LED layer with a light-emitting layer interposed therebetween. A current blocking layer is formed in the upper LED layer such that current passing between an electrode contacting the upper LED layer flows around the current blocking layer. When the current blocking layer is positioned between the electrode and the light-emitting layer, the light emitted by the light-emitting layer is not blocked by the electrode and the light efficiency is increased. The current blocking layer may be formed by converting a portion of the upper LED layer into a resistive region. In an embodiment, ions such as magnesium, carbon, or silicon are implanted into the upper LED layer to form the current blocking layer.
摘要翻译：提供了一种发光二极管（LED）装置。 LED装置具有较低的LED层和位于其间的发光层的上部LED层。在上LED层中形成电流阻挡层，使得在与上层LED层接触的电极之间的电流流过电流阻挡层。当电流阻挡层位于电极和发光层之间时，由发光层发射的光不被电极阻挡，并且光效率增加。可以通过将上部LED层的一部分转换成电阻区域来形成电流阻挡层。在一个实施方案中，诸如镁，碳或硅的离子注入上层LED层以形成电流阻挡层。

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