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51. 发明专利

AT304185T 未知
公开(公告)号：AT304185T
公开(公告)日：2005-09-15
申请号：AT02254124
申请日：2002-06-13
申请人： HITACHI VIA MECHANICS LTD
发明人： LIZOTTE TODD E , OHAR OREST
IPC分类号： G02B26/08 , B23K26/06 , B23K26/067 , B23K26/08 , B23K26/38 , G02B5/00 , G02B5/32 , G02B13/00 , G02B26/12 , G02B27/10 , G03H1/08 , H01S3/00 , G02B26/10
摘要： A laser beam delivery system (2) for supplying a laser beam (6) to a computer generated hologram (20) which shapes and divides the supplied laser beam into a plurality of pseudo flat top laser beams (28,30,32). The plurality of pseudo flat top laser beams are then passed through collimating optics (34) which alter the beams so that the beams are conveyed along the optical axis in a parallel manner. The plurality of collimated laser beams then passes through a converging mechanism (40) which facilitates converging of the plurality of separated collimated laser beams through a clear aperture (49) of a mirror (54) of a first repeat positioning device (52) so that all of the light is received by the repeat positioning device and appropriately reflected thereby to a second mirror of a second repeat positioning device (not shown) and then to a rear surface of an F-Theta lens (60). The F-Theta lens focuses the plurality of separated collimated laser beams at the object (12) to be processed. The converging mechanism facilitates converging of all of the supplied light so that substantially all of the supplied light passes through the clear aperture(s) of the repeat positioning device(s).

52. 发明专利

DE102005005248A1 Servo control of moving target in laser processing apparatus for printed wiring board manufacture, has digital filters that adds impulse row signal to output side of integral-compensation device 未知
公开(公告)号：DE102005005248A1
公开(公告)日：2005-08-25
申请号：DE102005005248
申请日：2005-02-04
申请人： HITACHI VIA MECHANICS LTD
发明人： TOYAMA SOUCHI , OKUBO YAICHI , HIRAI HIROMU , IWASAKI MAKOTO , KAWAFUKU MOTOHIRO , HIROSE NORIAKI
IPC分类号： G02B26/10 , B23K26/10 , G05B13/02 , G05D3/12 , G05B19/18 , B23K26/02 , B23K26/38
摘要： The digital filters (10a,10b) generate impulse row signal for every discrete time and adds the impulse row signal to the output side of the integral-compensation device (2) which received tracking error signal. An independent claim is also included for the laser processing apparatus.

53. 发明专利

DE102004042056A1 未知
公开(公告)号：DE102004042056A1
公开(公告)日：2005-07-14
申请号：DE102004042056
申请日：2004-08-31
申请人： HITACHI VIA MECHANICS LTD
发明人： TOYAMA SOUICHI , OTSUKI HARUAKI , SAKAMOTO ATSUSHI , SEKI KENTA , OKUBO YAICHI
IPC分类号： G02B26/10 , H05K3/00
摘要： A scanner system includes a servo control unit. A rotation angle of a rotating shaft supporting a mirror is detected, and an error of the detected value with respect to a commanded value is integrated by an integral compensator so that the detected value is able to track the commanded value. A tracking error proportional compensator is disposed in parallel with the integral compensator so as to add a correction value proportional to the error to the integrated value of the error. A plurality of gains are prepared for each of the integral compensator, the tracking error proportional compensator, a detected value proportional compensator and a detected value differential compensator of the servo control unit. Each gain is changed in accordance with a travel angle of the commanded value. Thus, the mirror can be positioned quickly so that the machining speed can be improved.

54. 发明专利

DE60110817D1 未知
公开(公告)号：DE60110817D1
公开(公告)日：2005-06-16
申请号：DE60110817
申请日：2001-11-28
申请人： HITACHI VIA MECHANICS LTD
发明人： TOHYAMA SOUICHI , HIRAI HIROMU , NAKAJIMA KICHIO , SAKAMOTO ATSUSHI , OKUBO YAICHI , OISHI MASAHIRO
IPC分类号： G02B7/182 , G02B26/10

55. 发明专利

DE102005022354B4 Verfahren zum Bearbeiten von Objekten mittels Laserstrahlung 未知
公开(公告)号：DE102005022354B4
公开(公告)日：2013-10-10
申请号：DE102005022354
申请日：2005-05-13
申请人： HITACHI VIA MECHANICS LTD
发明人： KILTHAU ALEXANDER , MAYER HANS JUERGEN
IPC分类号： B23K26/02 , B23K26/08 , B23K26/38 , H01L21/304 , H01L21/78 , H05K3/00
摘要： Verfahren zum Bearbeiten von Objekten mittels Laserstrahlung, bei dem • von einer Laserlichtquelle (110) ein Laserstrahl (111) erzeugt wird, • der Laserstrahl (111) über eine Ablenkeinheit (130) und eine Optik (140) entlang eines Strahlengangs (141) auf vorgegebene Zielpunkte eines Objekts (150) gerichtet wird, und • die Laserbearbeitung spätestens dann für zumindest eine bestimmte Zeitspanne unterbrochen wird, wenn die Ablenkeinheit (130) derart angesteuert wird, dass der Strahlengang (141) eine Sprungbewegung (155) von einem ersten Zielpunkt hin zu einem zweiten Zielpunkt ausführt, welcher von dem ersten Zielpunkt beabstandet ist, wobei sich die bestimmte Zeitspanne zusammensetzt aus – einer Ansteuerzeit (260s, 260l) für die entsprechende Ansteuerung der Ablenkeinheit (130) und – einer mit dem Ende der Ansteuerzeit (260s, 260l) beginnenden Wartezeit (TWS, TWL), dadurch gekennzeichnet, dass die Wartezeit (TWS, TWL) von dem Abstand des ersten Zielpunkts von dem zweiten Zielpunkt abhängt.

56. 发明专利

DE102004062381B4 未知
公开(公告)号：DE102004062381B4
公开(公告)日：2009-08-20
申请号：DE102004062381
申请日：2004-12-23
申请人： HITACHI VIA MECHANICS LTD
发明人： MAYER HANS JUERGEN
IPC分类号： B23K26/067 , B23K26/38 , G02B27/28 , H05K3/00
摘要： A switch-over device is disclosed for selectively switching a linearly polarized input laser beam to a first output laser beam or to a second output laser beam. The switch-over device includes a primary optical switch-over element having a primary optical element for selectively rotating the polarization direction of the input laser beam and a downstream primary polarization-dependent reflector which guides the input laser beam depending on its polarization direction to a first course of ray or to a second course of ray. In each of the two courses of ray, a further optical switch-over element is respectively provided which includes a secondary optical element for selectively rotating the polarization direction of the respective laser beam and a secondary polarization-dependent reflector which guides the respective laser beam depending on its polarization direction to an output laser beam. Furthermore, a laser machining device is disclosed, including a laser beam switch-over device as mentioned above.

57. 发明专利

DE102008038835A1 未知
公开(公告)号：DE102008038835A1
公开(公告)日：2009-03-26
申请号：DE102008038835
申请日：2008-08-13
申请人： HITACHI VIA MECHANICS LTD
发明人： NAITO YOSHITATSU , SUZUKI MITSUHIRO , KATOH TOMOTSUGU
IPC分类号： G03F7/20 , H05K3/00
摘要： A laser beam direct imaging apparatus and an imaging method which can precisely determine a back-surface-side position with respect to a front-surface-side position even if any kind of photosensitive material is used. In the laser direct imaging apparatus, a laser beam is deflected toward a main scanning direction (X-axis direction) while a workpiece mounted on a table is moved in a sub-scanning direction (Y-axis direction) so that a pattern is imaged on the surface of the workpiece. Hollow pins are disposed on the table so that the tips of the hollow pins 20 project over the surface of the table by a predetermined distance. The workpiece is sucked onto the table so that indentations (indentations by the tips of the hollow pins) are formed on the back surface of the workpiece. When a pattern is imaged on the back surface, imaging is performed with reference to the indentations.

58. 发明专利

DE602005009786D1 未知
公开(公告)号：DE602005009786D1
公开(公告)日：2008-10-30
申请号：DE602005009786
申请日：2005-11-14
申请人： HITACHI VIA MECHANICS LTD
发明人： KATSUTA DAISUKE , NOMOTO MINEO , YOSHIMURA KAZUSHI
IPC分类号： B23K26/00 , B23K26/03 , B23K26/02 , B23K26/08 , B23K26/36
摘要： The invention relates to a laser beam machine of the present invention, the latter includes: an XY stage (32) on which to rest a workpiece (200) with multiple machining objects (201) arrayed on it, and which moves the workpiece (200) in an XY direction on the basis of NC data; an image acquisition head (10) which is provided in an image acquisition station and has oblique illumination optical system and detection optical system (17); and a laser machining head (20) which is provided in a laser machining station and has a laser light source (21), an XY optical beam deflector (22) for deflecting a laser beam in the XY direction on the basis of the deflection control data obtained in accordance with the image signals from each machining object (201) that have been acquired by the image acquisition head (10), and an irradiation lens (23) for admitting the above-deflected laser beam into each machining object (201) from a substantially perpendicular direction.

59. 发明专利

GB2413393B Pattern exposure method comprising sequentially exposing a location to at least two beam spots from a scanning beam array 未知
公开(公告)号：GB2413393B
公开(公告)日：2008-05-14
申请号：GB0504957
申请日：2005-03-10
申请人： HITACHI VIA MECHANICS LTD
发明人： OSHIDA YOSHITADA , NAITO YOSHITATSU , SUZUKI MITUHIRO , UCHIYAMA BUNJI , YAMAGUCHI TSUYOSHI
IPC分类号： G02B26/10 , G03F7/20 , G02B26/12 , G03B27/54 , G03F7/22
摘要： A pattern exposure method and a pattern exposure apparatus in which the throughput is improved with an inexpensive apparatus and without a low running cost. Output faces of a plurality of laser beams emitted from a plurality of semiconductor lasers respectively are arranged in two directions. One of the directions is the same direction as the scanning direction of a polygon mirror while the other is a direction crossing the scanning direction of the polygon mirror. In this event, the array pitch of the output faces arranged in the direction crossing the scanning direction of the polygon mirror is made equal to resolution of an exposure pattern. In this event, the wavelength of each laser may be made not longer than 410 nm.

60. 发明专利

DE602004003436T2 未知
公开(公告)号：DE602004003436T2
公开(公告)日：2007-09-27
申请号：DE602004003436
申请日：2004-08-18
申请人： HITACHI VIA MECHANICS LTD
发明人： ITO YASUSHI , NARUSE FUTAO , MARUYAMA OSAMU
IPC分类号： B23K26/10 , B65H5/10 , B23K37/047 , B23Q7/14 , B65H3/08 , B65H29/32
摘要： There is provided a laser machining apparatus, and a laser machining method using the same, which allow an installation area thereof to be reduced while improving its working efficiency. The laser machining apparatus comprises a body portion (A) having a plurality of laser irradiating sections (10a and 10b) and work mounting sections (3); a supplying stocker (20) for supplying workpieces (4); and a discharging stocker (60) for discharging the workpieces (4). The laser machining apparatus further comprises a supply-side transfer unit (B) having work retaining means (16a, 16b) capable of attaching/detaching the workpieces (4) and of the same number with the laser irradiating sections (10a, 10b), andmoving the work retaining means in the horizontal direction; and a discharge-side transfer unit (C) having work retaining tables (56a, 56b) capable attaching/detaching the workpieces (4) and of the same number with the laser irradiating sections (10a, 10b), and moving the work retaining tables (56a, 56b) in the vertical and horizontal directions. The supply-side transfer unit causes the plurality of supply-side work retaining tables (16a, 16b) to adsorb the workpieces (4) from the supplying stocker (20) one after another and moves these supply-side work retaining tables to the work mounting sections (3) to place the workpieces (4) thereon. The discharge-side unit causes the discharge-side work retaining tables (56a, 56b) to adsorb the workpieces (4) which have been machined on the work mounting sections (3) to move and discharge those workpieces (4) to the discharging stocker (60).

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