会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 42. 发明申请
    • FLEXIBLE PLANAR HEATING DEVICE
    • 柔性平面加热装置
    • US20090184106A1
    • 2009-07-23
    • US12015523
    • 2008-01-17
    • KUEI-HUANG WU
    • KUEI-HUANG WU
    • H05B3/34H01C3/06
    • H01C3/06H05B3/34H05B2203/005H05B2203/01H05B2203/011H05B2203/013H05B2203/017H05B2203/036
    • A heating device which includes two first conducting members and at least a second conducting member, wherein the first conducting members are made of silicone rubber conductor and flexibly pressed into an upper thin layer and a lower thin layer between which is arranged the second conducting member. The first and second conducting members are formed into a whole unit by heat and pressure, which are provided holes at predetermined positions for increasing the contact area to disperse electrical current and conducting wires for connection in parallel or series with the power source. Voltages from 0.1V˜500V AC or DC are all applicable. Hence, the first and second conducting members can dissipate heat evenly. The increased temperature ranges from 1˜230° C. with respect to the environmental temperature thereby preventing the formation of high temperature points. Furthermore, the holes can reduced the electrical current required.
    • 一种加热装置,包括两个第一导电构件和至少第二导电构件,其中所述第一导电构件由硅橡胶导体制成并且柔性地压入上薄层和下薄层,其间布置有第二导电构件。 第一导电构件和第二导电构件通过加热和压力形成为整个单元,其在预定位置处设置有用于增加接触面积以分散电流的导电孔和用于与电源并联或串联连接的导线。 0.1V〜500V AC或DC电压均适用。 因此,第一和第二导电构件可以均匀地散热。 相对于环境温度,增加的温度范围为1〜230℃,从而防止形成高温点。 此外,孔可以减少所需的电流。
    • 44. 发明申请
    • Power Semiconductor Module
    • 功率半导体模块
    • US20080192437A1
    • 2008-08-14
    • US11886264
    • 2006-03-16
    • Norifumi Furuta
    • Norifumi Furuta
    • H05K7/00H05K7/20
    • H01L25/162H01C3/06H01L23/473H01L24/33H01L2224/48091H01L2224/48247H01L2224/73265H01L2924/1305H01L2924/13055H01L2924/13091H01L2924/30107H01L2924/00014H01L2924/00
    • A power semiconductor element and a capacitor have their electrodes joined to each other in a module. The power semiconductor element is formed on a semiconductor substrate having first and second main surfaces. A power semiconductor module includes an electrode through which a main current flows, joined to the first main surface, an electrode through which the main current flows, joined to the second main surface, and a resin portion sealing the semiconductor substrate, the capacitor and the electrodes. The capacitor includes electrodes. The electrode of the capacitor and the electrode of the semiconductor element are joined to each other by solder such that surfaces exposed through the resin portion are arranged on one continuous surface on which a cooler can be attached. Therefore, a power semiconductor module can be provided in which the capacitor and the power semiconductor element can effectively be cooled and the surge voltage can be reduced.
    • 功率半导体元件和电容器的电极在模块中彼此连接。 功率半导体元件形成在具有第一和第二主表面的半导体衬底上。 功率半导体模块包括主电流流过的电极,与第一主表面接合,主电流流过的电极连接到第二主表面,以及密封半导体衬底,电容器和 电极。 电容器包括电极。 电容器的电极和半导体元件的电极通过焊料彼此接合,使得通过树脂部分暴露的表面被布置在可连接冷却器的一个连续表面上。 因此,可以提供能够有效地冷却电容器和功率半导体元件的功率半导体模块,并且可以降低浪涌电压。