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    • 42. 发明专利
    • Illumination apparatus
    • GB2496183A
    • 2013-05-08
    • GB201119111
    • 2011-11-05
    • OPTOVATE LTD
    • WOODGATE GRAHAM JOHNHARROLD JONATHAN
    • H01L25/16H01L25/04H01L27/15H01L27/32
    • An illumination apparatus comprises an array of inorganic light emitting elements which is formed by selectively removing inorganic light emitting diodes (LEDs) from an array formed on a monolithic wafer and preserving the relative spatial positions of the diodes then forming an array of the selectively removed inorganic LEDs whilst maintaining the relative spatial positions, so that the inorganic LEDs 6, 8 are interspersed in gaps within an array of organic light emitting diodes (OLEDs) 4, positioned within apertures within OLEDs (see Fig. 6a), or formed on the surface of a continuous layer of OLEDs (see Fig. 7) the inorganic LEDs and OLEDs sharing a common substrate 2. There may be more than one array of inorganic LEDs 6, 8, each with different wavelength characteristics. The inorganic light emitting elements 6, 8 are provided at reduced density compared to the organic light emitting elements, achieving high efficiency, long lifetime and high uniformity for white light illumination over a large area.
    • 45. 发明专利
    • LED array fabrication
    • GB2463954A
    • 2010-04-07
    • GB0906714
    • 2009-04-18
    • OPTOVATE LTD
    • WOODGATE GRAHAM JOHNHARROLD JONATHAN
    • H01L25/075H05B44/00
    • The LEDs (72,74) are fabricated as a monolithic structure on a semiconductor wafer and are separated by sawing, cutting etc. Selected non-adjacent LEDs are removed from the diced monolithic wafer and transferred to a heat dissipating substrate in a single process step whilst maintaining their relative positions and separations. An array of lenses 122, 124 or reflectors is also transferred onto the LED assembly formed on the heat dissipating substrate. The LEDs typically have dimensions of 25-100 microns which reduces losses due to internal reflection and increases light output. The density of the LED assembly on the heat dissipating substrate is smaller than the density of the LEDs as formed on the monolithic wafer, maintaining the relative positions and orientations of the transferred LEDs in this way ensures that heat can be effectively removed from the LEDs. The manufacturing efficiency is improved in comparison with conventional pick and place techniques where individual LEDs from the monolithic wafer are selected and transferred to an LED array substrate in a sequential manner.